JPS6149471U - - Google Patents
Info
- Publication number
- JPS6149471U JPS6149471U JP13365184U JP13365184U JPS6149471U JP S6149471 U JPS6149471 U JP S6149471U JP 13365184 U JP13365184 U JP 13365184U JP 13365184 U JP13365184 U JP 13365184U JP S6149471 U JPS6149471 U JP S6149471U
- Authority
- JP
- Japan
- Prior art keywords
- resist layer
- solder resist
- covered
- land
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
Landscapes
- Tests Of Electronic Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す印刷配線基板
の一部の平面図、第２図は同上縦断側面図、第３
図は同上電子部品を実装した縦断側面図である。
１…基板体、２…配線、３…ハンダレジスト層
、４…端子ランド、５…電子部品、６…テストラ
ンド。
Fig. 1 is a plan view of a part of a printed wiring board showing an embodiment of the present invention, Fig. 2 is a vertical sectional side view of the same, and Fig. 3
The figure is a longitudinal sectional side view of the electronic component mounted thereon. DESCRIPTION OF SYMBOLS 1... Board body, 2... Wiring, 3... Solder resist layer, 4... Terminal land, 5... Electronic component, 6... Test land.
Claims (1)
にハンダレジスト層で被覆されない電子部品接続
用の端子ランドが形成された印刷配線基板におい
て、前記端子ランドに近い配線上にハンダレジス
ト層で被覆されないテストランドを形成したこと
を特徴とする印刷配線基板。 In a printed wiring board in which a terminal land for connecting an electronic component that is not covered with a solder resist layer is formed on the wiring on a board body covered with a solder resist layer, a test in which the wiring near the terminal land is not covered with a solder resist layer. A printed wiring board characterized by forming a land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13365184U JPS6149471U (en) | 1984-09-03 | 1984-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13365184U JPS6149471U (en) | 1984-09-03 | 1984-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6149471U true JPS6149471U (en) | 1986-04-03 |
Family
ID=30692190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13365184U Pending JPS6149471U (en) | 1984-09-03 | 1984-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6149471U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016514367A (en) * | 2013-03-01 | 2016-05-19 | クアルコム，インコーポレイテッド | Package substrate with test pads on fine pitch trace |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5346712B2 (en) * | 1976-04-27 | 1978-12-15 |
-
1984
- 1984-09-03 JP JP13365184U patent/JPS6149471U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5346712B2 (en) * | 1976-04-27 | 1978-12-15 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016514367A (en) * | 2013-03-01 | 2016-05-19 | クアルコム，インコーポレイテッド | Package substrate with test pads on fine pitch trace |