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JPS6142838U - Bonding wire spool for semiconductor devices - Google Patents

Bonding wire spool for semiconductor devices

Info

Publication number
JPS6142838U
JPS6142838U JP12608084U JP12608084U JPS6142838U JP S6142838 U JPS6142838 U JP S6142838U JP 12608084 U JP12608084 U JP 12608084U JP 12608084 U JP12608084 U JP 12608084U JP S6142838 U JPS6142838 U JP S6142838U
Authority
JP
Japan
Prior art keywords
bonding wire
semiconductor devices
wire spool
flange
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12608084U
Other languages
Japanese (ja)
Inventor
保 森
正幸 田中
Original Assignee
三菱マテリアル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱マテリアル株式会社 filed Critical 三菱マテリアル株式会社
Priority to JP12608084U priority Critical patent/JPS6142838U/en
Publication of JPS6142838U publication Critical patent/JPS6142838U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Manufacturing Of Electric Cables (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の一部破断正面図、第２図は
別の実施例の一部破断正面図、第３図は従来例の一部破
断正面図である。 １・・・本体、２・・・フランジ、４・・・ワイヤー巻
線、４ａ・・・巻始部、５・・・アルマイト層、１０．
１１・・・導電性金属メッキ層、Ａ・・・スプール。FIG. 1 is a partially cutaway front view of one embodiment of the present invention, FIG. 2 is a partially cutaway front view of another embodiment, and FIG. 3 is a partially cutaway front view of a conventional example. DESCRIPTION OF SYMBOLS 1... Main body, 2... Flange, 4... Wire winding, 4a... Winding start part, 5... Alumite layer, 10.
11... Conductive metal plating layer, A... Spool.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アルミニウムまたはアルミニウム合金からなる本体及び
フランジにアルマイト処理を施してなるスプールにおい
て、ボンデイングワイヤーの巻始部が係着されるフラン
ジ又は該フランジと本体内′ 面の一部あるいは全面に
導電性金属メッキが施されていることを特徴とする半導
体装置用ボンデイングワイヤースプール。In a spool made of aluminum or aluminum alloy, the main body and flange are anodized, and the flange to which the beginning of the bonding wire is attached, or the flange and a part or the entire inner surface of the main body, are plated with conductive metal. A bonding wire spool for semiconductor devices characterized by:
JP12608084U 1984-08-20 1984-08-20 Bonding wire spool for semiconductor devices Pending JPS6142838U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12608084U JPS6142838U (en) 1984-08-20 1984-08-20 Bonding wire spool for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12608084U JPS6142838U (en) 1984-08-20 1984-08-20 Bonding wire spool for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS6142838U true JPS6142838U (en) 1986-03-19

Family

ID=30684766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12608084U Pending JPS6142838U (en) 1984-08-20 1984-08-20 Bonding wire spool for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6142838U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513494A (en) * 1991-07-03 1993-01-22 Kaijo Corp Cassette type wire feeder of wire bonder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513494A (en) * 1991-07-03 1993-01-22 Kaijo Corp Cassette type wire feeder of wire bonder

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