JPS6141272Y2 - - Google Patents
Info
- Publication number
- JPS6141272Y2 JPS6141272Y2 JP1981075921U JP7592181U JPS6141272Y2 JP S6141272 Y2 JPS6141272 Y2 JP S6141272Y2 JP 1981075921 U JP1981075921 U JP 1981075921U JP 7592181 U JP7592181 U JP 7592181U JP S6141272 Y2 JPS6141272 Y2 JP S6141272Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electrical component
- component mounting
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000011295 pitch Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
本考案はプリント基板に関し、連続した電気部
品取付穴を有し各電子部品取付穴ピツチが実質的
に1.27mm以下である両面プリント基板のランド構
造の改良に関する。[Detailed Description of the Invention] The present invention relates to a printed circuit board, and relates to an improvement in the land structure of a double-sided printed circuit board that has continuous electrical component mounting holes and the pitch of each electronic component mounting hole is substantially 1.27 mm or less.
従来、この種の両面プリント基板の電気部品取
付穴の内面には両面を導通するための銅スルーホ
ール処理が為され、取付穴上下面にランドを有し
ている。即ち第１図ａ、第２図ｂに示す如くプリ
ント基板１の電気部品取付穴２の内面に銅スルー
ホール処理によつて銅スルーホール３が施され、
その上下面にランド４ａ，４ｂが形成される如き
構造となつている。かかる両面プリント基板に電
気部品例えば接続コネクタを取りつける場合、接
続コネクタの端子５を電気部品取付穴２に挿入
し、半田付処理によつて、半田層６を介して接続
コネクタの端子５とランド４ａ，４ｂとを接続し
ていた。しかしながら、各電気部品取付穴２のピ
ツチが小さくなり、例えば1.27mm以下である如き
両面プリント基板においては、電気部品取付穴２
の径が通常0.7mm〜0.6mmである為、各ランド４
ａ，４ｂ間の距離が極めて接近したパターンとな
り、ランド４ａ，４ｂ同志がシヨート状態となつ
たり、あるいはランド４ｂ上に半田付処理をする
際、隣接するランド４ｂ上の半田層６と繁がり、
いわゆる半田ブリツジによつて各電気部品の機能
を果せ無くなるという欠点があつた。 Conventionally, the inner surface of the electrical component mounting hole of this kind of double-sided printed circuit board has been treated with a copper through hole to provide electrical continuity between both sides, and has lands on the upper and lower surfaces of the mounting hole. That is, as shown in FIGS. 1a and 2b, a copper through hole 3 is formed on the inner surface of the electrical component mounting hole 2 of the printed circuit board 1 by copper through hole processing.
The structure is such that lands 4a and 4b are formed on the upper and lower surfaces thereof. When attaching an electrical component, such as a connecting connector, to such a double-sided printed circuit board, the terminal 5 of the connecting connector is inserted into the electrical component mounting hole 2, and the terminal 5 of the connecting connector is connected to the land 4a through the solder layer 6 by soldering. , 4b were connected. However, in a double-sided printed circuit board where the pitch of each electrical component mounting hole 2 is small, for example, 1.27 mm or less, the pitch of each electrical component mounting hole 2 becomes smaller.
Since the diameter of the land is usually 0.7mm to 0.6mm, each land 4
The distance between a and 4b becomes extremely close, and the lands 4a and 4b become short, or when soldering is performed on the land 4b, the solder layer 6 on the adjacent land 4b overlaps,
There was a drawback that the so-called solder bridges made it impossible for each electrical component to perform its function.
本考案の目的は上記欠点を排除し得るランド構
造を有する両面プリント基板を提供することにあ
る。 An object of the present invention is to provide a double-sided printed circuit board having a land structure that can eliminate the above-mentioned drawbacks.
本考案によれば、導通用スルーホールおよびラ
ンドから成る複数個の電気部品取付穴を有し、各
電気部品取付穴ピツチが実質的に1.27mm以下であ
る如き両面プリント基板において、各電気部品取
付穴には両面プリント基板の片面にのみランドを
設け、かつ隣接する各電気部品取付穴のランドに
互いに両面プリント基板の反対の面に設けられて
いることを特徴とするプリント基板が得られる。 According to the present invention, in a double-sided printed circuit board that has a plurality of electrical component mounting holes consisting of conductive through holes and lands, and the pitch of each electrical component mounting hole is substantially 1.27 mm or less, each electrical component mounting hole is A printed circuit board is obtained in which the holes are provided with lands only on one side of the double-sided printed circuit board, and the lands of adjacent electrical component mounting holes are provided on opposite sides of the double-sided printed circuit board.
以下、第２図ａおよび第２図ｂにより、本考案
の一実施例を説明する。尚、第２図におて第１図
と同一機能を有するものは同一番号で記す。 Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 2a and 2b. Components in FIG. 2 that have the same functions as those in FIG. 1 are designated by the same numbers.
銅張積層板（図示せず）を両面に有するプリン
ト基板１に、電気部品のピツチに合わせ、電気部
品取付穴２を形成した。しかる後、銅張積層板か
らエツチング法によりランド４ａ，４ｂを形成す
るが、この際、電気部品取付穴２の１個おきにラ
ンド４ａをプリント基板１の一方の面上に形成
し、他の隣接する電気部品取付穴２にはプリント
基板１の他方の面上にランド４ｂを形成した。す
なわち、例えば奇数番めの電気部品取付穴２には
ランド４ａを、プリント基板１の一方の面例えば
部品面に設置し、偶数番めの電気部品取付穴２に
はランド４ｂをプリント基板の他方の面例えば半
田面に設置する如き構造とした。 Electrical component mounting holes 2 were formed in a printed circuit board 1 having copper-clad laminates (not shown) on both sides to match the pitches of the electrical components. Thereafter, lands 4a and 4b are formed from the copper-clad laminate by etching. At this time, lands 4a are formed on one side of the printed circuit board 1 for every other electric component mounting hole 2, and A land 4b was formed on the other surface of the printed circuit board 1 in the adjacent electrical component mounting hole 2. That is, for example, the lands 4a are installed in the odd-numbered electrical component mounting holes 2 on one side of the printed circuit board 1, such as the component surface, and the lands 4b are installed in the even-numbered electrical component mounting holes 2 on the other side of the printed circuit board. For example, the structure is such that it can be installed on a soldering surface.
この様にして得られた両面プリント基板は各電
気部品取付穴のピツチが1.27mm以下であつても、
ランド（４ａまたは４ｂ）間の距離が接近するこ
となく、ランドパターン形成時おけるランドシヨ
ートが無くなつた。更に電気部品の端子５とラン
ド４ａ，４ｂとを接続する為の半田層６は隣接す
る半田層がプリント基板１反対面にある為、繋が
ることがなくなつた。 The double-sided printed circuit board obtained in this way can be used even if the pitch of each electrical component mounting hole is 1.27 mm or less.
The distance between the lands (4a or 4b) did not become close, and there was no land short at the time of forming the land pattern. Furthermore, the solder layer 6 for connecting the terminal 5 of the electrical component and the lands 4a, 4b is no longer connected because the adjacent solder layer is on the opposite side of the printed circuit board 1.
尚、本考案による両面プリント基板に電気部品
を半田付する場合、プリント基板の部品面から半
田付処理を行なうことにより、半田層は電気部品
の端子、及びスルーホールを介してプリント基板
の部品面まであがる為、従来と同様な半田付方法
でよい。また電気部品取付穴はいずれかの片面に
ランドを有している為、パターンハガしなどの問
題を生じることもない。 In addition, when soldering electrical components to the double-sided printed circuit board according to the present invention, by performing the soldering process from the component side of the printed circuit board, the solder layer is applied to the component surface of the printed circuit board through the terminals and through holes of the electrical component. Since the soldering method is the same as the conventional one, it is sufficient. Furthermore, since the electrical component mounting hole has a land on either side, problems such as pattern peeling do not occur.
以上述べた如く、本考案による両面プリント基
板により、大幅な変更を要することなく、電気部
品の機能を十分に果せる両面プリント基板が出来
た。 As described above, by using the double-sided printed circuit board according to the present invention, a double-sided printed circuit board that can fully perform the functions of electrical components without requiring major changes has been created.
第１図ａおよび第１図ｂは従来の両面プリント
基板を示す平面図および断面図であり、第２図ａ
および第２図ｂは本考案による両面プリント基板
を示す平面図及び断面図である。
１……プリント基板、２……電気部品取付穴、
３……銅スルーホール、４ａ，４ｂ……ランド、
５……電気部品の端子、６……半田層。
Figures 1a and 1b are a plan view and a sectional view of a conventional double-sided printed circuit board, and Figure 2a is a
FIG. 2b is a plan view and a sectional view showing a double-sided printed circuit board according to the present invention. 1... Printed circuit board, 2... Electrical component mounting hole,
3...Copper through hole, 4a, 4b...Land,
5... Terminal of electrical component, 6... Solder layer.
Claims (1)
個の電気部品取付穴を有し、各電気部品取付穴ピ
ツチが実質的に1.27mm以下である如き両面プリン
ト基板において、各電気部品取付穴には両面プリ
ント基板の片面にのみランドを設け、かつ隣接す
る各電気部品取付穴のランドは互いに前記両面プ
リント基板の反対の面に設けられていることを特
徴とする前記両面プリント基板。 In a double-sided printed circuit board that has multiple electrical component mounting holes consisting of conductive through holes and lands, and the pitch of each electrical component mounting hole is substantially 1.27 mm or less, each electrical component mounting hole has a double-sided printed circuit board. The double-sided printed circuit board is characterized in that a land is provided only on one side of the double-sided printed circuit board, and the lands of adjacent electrical component mounting holes are provided on opposite sides of the double-sided printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981075921U JPS6141272Y2 (en) | 1981-05-26 | 1981-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981075921U JPS6141272Y2 (en) | 1981-05-26 | 1981-05-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57188371U JPS57188371U (en) | 1982-11-30 |
| JPS6141272Y2 true JPS6141272Y2 (en) | 1986-11-25 |
Family
ID=29871634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981075921U Expired JPS6141272Y2 (en) | 1981-05-26 | 1981-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6141272Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2858318B2 (en) * | 1989-03-15 | 1999-02-17 | 松下電器産業株式会社 | Electronic component mounting method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3416348A (en) * | 1966-09-30 | 1968-12-17 | Westinghouse Electric Corp | Flat-pack lead bending device |
| JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
| JPS5533666U (en) * | 1978-08-23 | 1980-03-04 | ||
| JPS5571090A (en) * | 1978-11-22 | 1980-05-28 | Sony Corp | Bothhside printed board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5599182U (en) * | 1978-12-27 | 1980-07-10 |
-
1981
- 1981-05-26 JP JP1981075921U patent/JPS6141272Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3416348A (en) * | 1966-09-30 | 1968-12-17 | Westinghouse Electric Corp | Flat-pack lead bending device |
| JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
| JPS5533666U (en) * | 1978-08-23 | 1980-03-04 | ||
| JPS5571090A (en) * | 1978-11-22 | 1980-05-28 | Sony Corp | Bothhside printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57188371U (en) | 1982-11-30 |
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