JPS6133462U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS6133462U JPS6133462U JP11799384U JP11799384U JPS6133462U JP S6133462 U JPS6133462 U JP S6133462U JP 11799384 U JP11799384 U JP 11799384U JP 11799384 U JP11799384 U JP 11799384U JP S6133462 U JPS6133462 U JP S6133462U
- Authority
- JP
- Japan
- Prior art keywords
- lead pattern
- plating
- plating lead
- common
- individual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ないし第６凶は本考案に係るプリント配線板の実
施例を示し、第１図は第１実施例必要部の縦断面図、第
２図イーホは夫々その製造工程を説明するための縦断面
図、第３図は第２実施例の要部の縦断面図、第４図イー
二は夫々その製造工程を説明するための縦断面図、そし
て、第５図および第６図は夫々２種類の配線パターンを
有するプリント配線板を例示する平面図である。
また、第７図および第８図は夫々従来技術を説明するた
めのものであって、第７図は従来一般のプリント配線板
の平面図、そして、第８図イー二は夫々その製造工程を
示す要部の縦断面図である。
１・・・・・・基板、２７・・・・メッキリードパター
ン、２λ・・・・・・個別メッキリードパターン部分、
２Ｂ・・・・・・共通メツキリードパターン部分、３・
・・・・・金メッキ、４，７・・・・・・絶縁コーティ
ング、６・・・・・・溝または穴、５，７・・・・・・
絶縁性物質。1 to 6 show examples of the printed wiring board according to the present invention, FIG. 1 is a vertical sectional view of the necessary parts of the first embodiment, and FIG. 2 is a diagram for explaining the manufacturing process. 3 is a vertical sectional view of the main part of the second embodiment, FIG. 4 is a longitudinal sectional view for explaining the manufacturing process, and FIGS. 5 and 6 are respectively FIG. 3 is a plan view illustrating a printed wiring board having two types of wiring patterns. Furthermore, FIGS. 7 and 8 are for explaining the prior art, respectively. FIG. 7 is a plan view of a conventional general printed wiring board, and FIG. FIG. 1... Board, 27... Plated lead pattern, 2λ... Individual plated lead pattern part,
2B... Common matsuki lead pattern part, 3.
...Gold plating, 4,7...Insulating coating, 6...Groove or hole, 5,7...
Insulating substance.
Claims (1)
メッキリードパターン部分と共通メツキリードパターン
部分とから成るメツキリードパターンを形成し、前記共
通メツキリードパターン部分を介し．て前記メツキリー
ドパターン全体に通電しながらそのメツキリードパター
ンに対して金メッキを施し、更に、前記金メッキされた
メツキリードパターンに対して絶縁コーティングを施し
、かつ、前記個別メツキリードパターン部分と共通メツ
キリードパターン部分とを非導通状態に切り離すことに
より構成してあるプリント配線板であって、 前記金メッキを施した後、または、前記絶縁コーティン
グを施した後で、前記個別メツキリードパターン部分と
共通′メツキリードパターン部分との間において、該メ
ツキリードパターンの最上面から前記基板の厚さ方向途
中部分に至る溝または穴を機械的工作にて形成すること
により、前記個別メツキリードパターン部分と共通メツ
キリードパターン部分とを互いに非導通状態に分離し、
、更に、前記溝ま，たは穴に絶縁性物質を充填して該溝
または穴を埋め戻すことにより、前記個別メッキリード
パターン部分と共通メッキリードパターン部分との可の
絶縁を確実ならしめてあることを特徴とするプリント配
線板。[Claims for Utility Model Registration] A plating lead pattern consisting of an individual plating lead pattern portion and a common plating lead pattern portion is formed on a substrate by a method such as copper plating or etching, and the plating lead pattern is formed through the common plating lead pattern portion. ．． electrifying the entire plating lead pattern, applying gold plating to the plating lead pattern; further applying an insulating coating to the gold plated plating lead pattern; A printed wiring board configured by separating a pattern part in a non-conducting state, and after applying the gold plating or applying the insulating coating, a common plating with the individual plating lead pattern part. A common plating lead is formed between the individual plating lead pattern portion and the common plating lead by mechanically forming a groove or a hole extending from the top surface of the plating lead pattern to a midway portion in the thickness direction of the substrate. The pattern part is separated from each other in a non-conductive state,
Furthermore, by filling the groove or hole with an insulating material and backfilling the groove or hole, the insulation between the individual plated lead pattern portion and the common plated lead pattern portion is ensured. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11799384U JPS6133462U (en) | 1984-07-30 | 1984-07-30 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11799384U JPS6133462U (en) | 1984-07-30 | 1984-07-30 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6133462U true JPS6133462U (en) | 1986-02-28 |
Family
ID=30676881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11799384U Pending JPS6133462U (en) | 1984-07-30 | 1984-07-30 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6133462U (en) |
-
1984
- 1984-07-30 JP JP11799384U patent/JPS6133462U/en active Pending
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