JPS61292880A - High frequency heater - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Industrial Application Field The present invention aims to improve cooling by providing a high voltage transformer on the back plate and making it angle with the cooling device, thereby improving the efficiency and life of the heating element. This invention relates to a high frequency heating device.

Prior Art For example, in a conventional high-frequency heating device having a cooling device using a propeller fan, a high-voltage transformer 1 is provided on a bottom plate 2 as shown in FIG. 3 in order to cool a heating element, and a high-frequency oscillator 3 is A cooling device mounting bracket 4 is installed on the top of the transformer 1.
A cooling device 6 is provided. Here, an orifice 6 is provided in the cooling device mounting bracket 4 in order to maintain the straightness of the cooling air. The cooling air is taken in through the intake looper 7, and the air that cools the high-frequency oscillator 3 is directionally regulated by the air guide 8, passes through the punched hole 9, exits the heating chamber, and passes through the exhaust looper 10 to the outside of the high-frequency heating device. released. High voltage transformer 1
Generally, the air that has cooled the air is discharged to the outside of the high-frequency heating device through an exhaust looper 11.

Problems to be Solved by the Invention However, in the case of the above configuration, since the high temperature wind that cools the high voltage transformer 1 is discharged from the lower part of the high frequency heating device, the high temperature wind rises, which is a natural phenomenon. In order to reverse the flow, the wind is regulated by providing an orifice e, etc., but this does not provide a sufficient effect. In addition, the high-temperature wind that is not discharged to the outside of the high-frequency heating device from the exhaust looper 11 rises to the printed circuit board 12.
Cooling of printed circuit board 12 is impaired. Therefore, heat generation shortens the life of the components that make up the high voltage transformer 1 and the printed circuit board 12.

The present invention solves the above-mentioned conventional drawbacks, and aims to increase the cooling effect by providing a high-voltage transformer on the back plate and discharging high-temperature air after cooling from the upper part of the high-frequency heating device.

Means for solving the problem In order to achieve the above purpose, a high voltage transformer is installed on the back plate,
The high-frequency oscillator is installed on the bottom plate, the cooling device is installed at an angle between the back plate and the bottom plate, and the high-temperature air that cools the high-voltage transformer is released from the top of the high-frequency heating device.

Function The high-frequency heating device of the present invention has a structure in which a high-voltage transformer is provided on the back plate, and air that has cooled the high-voltage transformer is discharged from the top of the high-frequency heating device. By raising the airflow, there is no need to restrict the flow of air through an orifice, etc., and this has the effect that more efficient cooling can be obtained and at the same time unnecessary restrictions are not required.

EXAMPLE Hereinafter, a high frequency heating device according to an example of the present invention will be explained with reference to the drawings. FIG. 2 shows the whole view of the high-frequency heating device of the present invention with the door opened, and FIG. 1 is a sectional view taken along line A in FIG. 2.

In Figure 1, 3 is a high frequency oscillator υ high voltage transformer 1
A high voltage is applied from the high-voltage capacitor, and a considerable amount of self-heating is generated. In this case, current flows through the windings of the high-voltage transformer 1, generating heat, and the temperature of the high-frequency oscillator 3 and high-voltage transformer 1 rises, so a cooling device 6 using a propeller fan is installed to prevent oscillation from occurring and insulation deterioration. Forced air cooling. In this case, the high voltage transformer 1 is provided on the back plate 13, the high frequency oscillator 3 is provided on the bottom plate 14, and the cooling device 6 is provided at an angle between the back plate 13 and the bottom plate 14, so that the cooling air passes through the intake looper 7. The wind that cools the high-frequency oscillator 3 is directionally regulated by the air guide 8, passes through the punched hole 9, passes through the heating chamber, passes through the exhaust looper 10, and is discharged to the outside of the high-frequency heating device. The wind that has cooled the high voltage transformer 1 is discharged to the outside of the high frequency heating device through the exhaust looper 10. Further, if the high voltage transformer 1 needs to be cooled more than the high frequency oscillator 3, the mounting angle of the cooling device 5 can be adjusted so that more air flows to the high voltage transformer 1.

In this way, according to this embodiment, the high voltage transformer 1 is connected to the back plate 13.
The high frequency oscillator 3 is installed on the bottom plate 14 [and the cooling device 5
By providing the back plate 13 and the bottom plate 14 at an angle, high-temperature air can be emitted from the top of the high-frequency heating device, increasing the cooling effect. This has the effect of being able to be determined by the angle of the device 5, and since the high temperature air is emitted at the top, the high temperature air does not hit the printed circuit board 12, thereby preventing deterioration of the printed circuit board 12 due to temperature rise.

Effects of the Invention As described above, according to the present invention, the following effects can be obtained.

(1) By providing a high-voltage transformer on the back plate, it is possible to exhaust high-temperature wind to the top, improve cooling, and improve the efficiency and life of the heating element.

c) Since the upper part can be exhausted, it is possible to eliminate the orifice that regulates the direction of the wind and the complicated mounting hardware that were required in the past, leading to a reduction in price and making it possible to supply inexpensive high-frequency heating equipment to users. This can serve the interests of users.

G3) It is easy to set the cooling device at an angle, and it is adjustable according to the air volume required to cool the heating element.
Efficient cooling can be achieved using a cooling device with the same capacity.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view of Fig. 2 when the person enters the room, Fig. 2 is a perspective view showing an open state of the high-frequency heating device showing an embodiment of the present invention, and Fig. 3 is a diagram showing a conventional heating element and cooling device. FIG. 3 is a side view showing the arrangement. 1...High voltage transformer, 2...Bottom plate, 3.
...High frequency oscillator, 4 ... Cooling device mounting bracket, 6 ... Cooling device, 6 ... Orifice, 7 ... Intake louver, 8 ...Air guide, 9...Punching hole, 10...
...Exhaust louver, 11...Exhaust louver, 1
2...Printed circuit board. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
figure

Claims (3)

[Claims] (1) A heating chamber that stores an object to be heated, a high-frequency oscillator that supplies high-frequency energy into the heating chamber, a high-voltage transformer that supplies high voltage to the high-frequency oscillator, and a heating element that includes the high-frequency oscillator and the high-voltage transformer. a cooling device using a propeller fan for cooling, the high voltage transformer is provided on a back plate constituting the heating chamber, the high frequency oscillator is provided on a bottom plate perpendicular to the back plate, and the cooling device is provided on a bottom plate that is perpendicular to the back plate. A high-frequency heating device configured to be installed at an angle on the bottom plate. (2) The high-frequency heating device according to claim 1, wherein the mounting angle of the cooling device is determined by the amount of air needed to cool the heating element. (3) The high-frequency heating device according to claim 1, wherein the air that cools the heating element is exhausted to the outside from a surface above the heating chamber.