JPS61271609A - Manufacturing method of thin film magnetic head - Google Patents
Manufacturing method of thin film magnetic headInfo
- Publication number
- JPS61271609A JPS61271609A JP11309885A JP11309885A JPS61271609A JP S61271609 A JPS61271609 A JP S61271609A JP 11309885 A JP11309885 A JP 11309885A JP 11309885 A JP11309885 A JP 11309885A JP S61271609 A JPS61271609 A JP S61271609A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- film
- laminated
- conductor coil
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000010408 film Substances 0.000 claims description 87
- 239000004020 conductor Substances 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000010410 layer Substances 0.000 description 16
- 239000011810 insulating material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- KGLNPUUOMAZVMD-UHFFFAOYSA-N [H][H].NN Chemical compound [H][H].NN KGLNPUUOMAZVMD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は薄膜磁気ヘッドの製造方法に係り、特に磁気デ
ィスク装置に使用するのに好適な薄膜磁気ヘッドの製造
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method of manufacturing a thin film magnetic head, and particularly to a method of manufacturing a thin film magnetic head suitable for use in a magnetic disk device.
磁気ディスク装置に使用される薄膜磁気ヘッドは、回転
された磁気ディスクの表面上に微小な間隙をもって浮上
して、磁気ディスクに対し記録・再生できるように構成
されている。そして、記録・再生を正確に行う為、所望
の電気特性及び磁気特性を持っていなければならない。A thin-film magnetic head used in a magnetic disk device is configured to float above the surface of a rotated magnetic disk with a small gap therebetween so as to be able to record on and read from the magnetic disk. In order to perform recording and reproduction accurately, it must have desired electrical and magnetic properties.
そのため、従来の薄膜磁気ヘッドは、第７図に示すよう
に、下部磁性膜１に積層されたギャップ材２上に予め定
められたパターンの導体コイル３が積層され、前記ギャ
ップ材２上に導体コイル３を覆う絶縁膜４が積層されて
いる。絶縁膜４の周囲にはエツチング処理によってテー
パ面５が形成され、絶縁膜４及びギャップ材２上に上部
磁性膜６が積層されたとき、該上部磁性膜６がテーバ面
５上にも設けられて上部磁性膜６の絶縁膜４上に位置す
る部分と、絶縁膜４上に位置する部分とが接続されるこ
とＫよシ、所望の磁気回路を形成して電気特性の向上を
計っている。前記絶縁膜４は、導体コイル３と上部磁性
膜６との間を電気的に絶縁するものであって、導体コイ
ル３に対する皮膜性の良好な有機樹脂で構成されている
。Therefore, in the conventional thin film magnetic head, as shown in FIG. An insulating film 4 covering the coil 3 is laminated. A tapered surface 5 is formed around the insulating film 4 by etching, and when the upper magnetic film 6 is laminated on the insulating film 4 and the gap material 2, the upper magnetic film 6 is also provided on the tapered surface 5. The part of the upper magnetic film 6 located on the insulating film 4 is connected to the part located on the insulating film 4, thereby forming a desired magnetic circuit and improving electrical characteristics. . The insulating film 4 electrically insulates between the conductor coil 3 and the upper magnetic film 6, and is made of an organic resin that has good film properties on the conductor coil 3.
ところで、有機樹脂の絶縁膜を用いた場合、絶縁膜のテ
ーパ面の角度が磁気ヘッドの電気特性を大きく左右する
ので、その角度を一定に押える必要がある。By the way, when an organic resin insulating film is used, the angle of the tapered surface of the insulating film greatly affects the electrical characteristics of the magnetic head, so it is necessary to keep the angle constant.
しかし乍ら、上記に示す従来例では、絶縁膜４のテーパ
面をエツチング処理によって形成すると、テーパ面の角
度を一定に形成できず、しかも量産時、夫々のテーパ面
の角度にバラツキが生じていた。However, in the conventional example shown above, when the tapered surface of the insulating film 4 is formed by etching, the angle of the tapered surface cannot be formed constant, and furthermore, the angle of each tapered surface varies during mass production. Ta.
特開昭５８−１１１１１６号公報には無機絶縁材の層間
絶縁層に有機樹脂の層間絶縁層が堆積されることが開示
されているが、有機樹脂のテーパ面については開示され
ていない。JP-A-58-111116 discloses that an interlayer insulating layer of an organic resin is deposited on an interlayer insulating layer of an inorganic insulating material, but does not disclose a tapered surface of the organic resin.
本発明の目的は、上記事情に鑑み、有機樹脂製絶縁膜を
用いて、そのテーパ面の角度を簡単にかつ確実に一定に
押えることができ、しかも所望の角度を容易に得ること
ができ、以て電気特性を向上させることができる薄膜磁
気ヘッドを提供するにある。In view of the above circumstances, an object of the present invention is to use an organic resin insulating film to easily and reliably hold the angle of the tapered surface constant, and to easily obtain a desired angle. An object of the present invention is to provide a thin film magnetic head that can improve electrical characteristics.
本発明者は、株々の実験・検討をかさねた結果、有機樹
脂製絶縁材は熱硬化するときの時間（または温度）を大
きくした場合、エツチング時のエツチングレートが遅く
なることに着目し、有機樹脂製絶縁材を少なくとも二層
に分けて順次積層し、上層絶縁材の熱硬化時にその時間
分だけ下層絶縁材が再び熱硬化されることＫよって下層
絶縁材と上層絶縁材とに熱硬化時間の差を持たせる。そ
して、エツチング処理したとき、下層絶縁材のエツチン
グレートが上層絶縁材よシ遅くなることによシ、上層絶
縁材から下層絶縁材へ至るに従って次第に拡開されたテ
ーパ面を形成するようにする。As a result of repeated experiments and studies, the inventor of the present invention noticed that when the time (or temperature) for thermal curing of an organic resin insulating material is increased, the etching rate during etching becomes slower. The organic resin insulating material is divided into at least two layers and laminated sequentially, and when the upper layer insulating material is thermally cured, the lower layer insulating material is thermally cured again for the same amount of time.Therefore, the lower layer insulating material and the upper layer insulating material are thermally cured. Create a time difference. When etching is performed, the etching rate of the lower layer insulating material is slower than that of the upper layer insulating material, so that a tapered surface is formed that gradually widens from the upper layer insulating material to the lower layer insulating material.
以下５本発明の一実施例を第１図乃至第６図に従って説
明する。An embodiment of the present invention will be described below with reference to FIGS. 1 to 6.
薄膜磁気ヘッドの製造方法は、第１図に示すように、下
部コアをなす下部磁性膜１１の上にギャップ材１２がス
パッタリング、蒸着等によって積層されている。前記ギ
ャップ材１２は、例えば酸化けい素や酸化アルミニウム
等で構成されている。前記下部磁性膜１１はパーマロイ
、フェライト等で構成され、その下面に絶縁材からなる
下地膜１３を介して基板１４が積層されている。As shown in FIG. 1, a method for manufacturing a thin film magnetic head includes laminating a gap material 12 on a lower magnetic film 11 forming a lower core by sputtering, vapor deposition, or the like. The gap material 12 is made of, for example, silicon oxide or aluminum oxide. The lower magnetic film 11 is made of permalloy, ferrite, etc., and a substrate 14 is laminated on its lower surface with a base film 13 made of an insulating material interposed therebetween.
また前記ギャップ材１２の上には第２図に示すように第
１の絶縁膜１６が形成され、その第１の絶縁膜１６上に
導体コイル１５が積層されている。前記第１の絶縁膜１
６は導体コイルエ５と磁性膜１１との間をギャップ材１
２と共に電気絶縁できるようにポリイミド系の有機樹脂
で構成されている。前記導体コイル１５は予め定められ
たパターンをなしていて、スパッタリング、蒸着等によ
って形成され、例えば銅、銀等で構成されている。Further, as shown in FIG. 2, a first insulating film 16 is formed on the gap material 12, and a conductor coil 15 is laminated on the first insulating film 16. The first insulating film 1
6 is a gap material 1 between the conductor coil 5 and the magnetic film 11.
It is made of polyimide-based organic resin so that it can be electrically insulated together with 2. The conductor coil 15 has a predetermined pattern, is formed by sputtering, vapor deposition, etc., and is made of copper, silver, etc., for example.
更に、第１の絶縁膜１５の上には第３図に示すように導
体コイル１６を覆う為、第２．第３の絶縁膜１７．１８
が順次積層され、これによって平板状積層体１９が形成
される。Further, on the first insulating film 15, as shown in FIG. 3, a second insulating film 15 is formed to cover the conductor coil 16. Third insulating film 17.18
are sequentially laminated, thereby forming a flat laminate 19.
前記第２．第３の絶縁膜１７．１８は、夫々が第１の絶
縁膜１６と同様に、ポリイミド系の有機樹脂で構成され
、かつスピンコーティング法によって適度の厚みで塗布
された後、所定の温度及び時間（３００’ＣＸ１ｈ）で
熱硬化して形成されることによシ、順次積層されている
。従って、第２の絶縁膜１７が熱硬化されたとき、その
熱硬化時間分だけ第１の絶縁膜１６が再び熱硬化され、
かつ第３の絶縁膜１８が熱硬化されたとき、その熱硬化
時間分筒２の絶縁膜１７が再び熱硬化されると同時Ｋ、
第１の絶縁膜１６がさらに熱硬化されることになるので
、夫々の熱履歴の関係は、第３の絶縁膜１８＜第２の絶
縁膜１７＜第１の絶縁膜１６となる。Said 2nd. Like the first insulating film 16, the third insulating films 17 and 18 are each made of polyimide-based organic resin, and are coated to an appropriate thickness by spin coating, and then coated at a predetermined temperature and time. (300'C Therefore, when the second insulating film 17 is thermally hardened, the first insulating film 16 is thermally hardened again for the same amount of time as the second insulating film 17 is thermally hardened.
And when the third insulating film 18 is thermally cured, when the insulating film 17 of the thermal curing time period 2 is thermally cured again, at the same time K,
Since the first insulating film 16 is further thermally cured, the relationship of their respective thermal histories is third insulating film 18<second insulating film 17<first insulating film 16.
しかる後、前記平板状積層体１９の第３の絶縁膜１８上
には第４図に示すように導体コイル１５の上方位置にエ
ツチング用のレジスト２０が積層されている。レジスト
艶としては、図示例ではホトエツチング処理する為にネ
ガ形ホトレジストが使用され、該ネガ形ホトレジストは
前記平板状積層体１９の上にスピンコーティング法によ
って塗布されてプレベークされた後、露光・現像して所
望のパターンに形成されている。Thereafter, an etching resist 20 is laminated on the third insulating film 18 of the flat plate-like laminate 19 at a position above the conductor coil 15, as shown in FIG. As the resist gloss, in the illustrated example, a negative photoresist is used for photoetching, and the negative photoresist is applied onto the flat laminate 19 by a spin coating method, prebaked, and then exposed and developed. It is formed into a desired pattern.
次いで、レジスト２０を有する平板状積層体１９がポス
トベークされた後、エツチング処理される。Next, the flat laminate 19 having the resist 20 is post-baked and then etched.
エツチング処理としては、例えばヒドラジンヒトラード
７容と、エチレンジアミン３容とが混合されたエツチン
グ液を温度３５”Ｃに調温し、このエツチング液に前記
平板状積層体１９が１５分間浸漬される。For the etching treatment, an etching solution containing, for example, 7 volumes of hydrazine hydrogen hydride and 3 volumes of ethylenediamine is adjusted to a temperature of 35''C, and the plate-shaped laminate 19 is immersed in this etching solution for 15 minutes.
このようにエツチング処理すると、エツチング液がレジ
スト２０を浸透して夫々第３．第２．第１の絶縁膜１８
．１７．１６を腐食させるが、その際、前述の如く熱履
歴が、第３の絶縁膜１８＜第２の絶縁膜１７＜第１の絶
縁膜１６となっているので、夫々のエツチングレートの
関係が、第３の絶縁膜１ｇ ）第２の絶縁膜１７〉第１
の絶縁膜１６となる。即ち、第３の絶縁膜１８に対する
浸食が最も速く、第２．第１の絶縁膜１７．１６に対す
る浸食が次第に遅くなるので、第５図に示すように第１
〜第３の絶縁膜１６〜１８のレジスト２０周辺部にはテ
ーパ面父が形成される。このテーパ面（資）は、上層か
ら下層に至るに従って次第に拡開された形状をなしてお
り、第１〜第３の絶縁膜１６〜１８の膜厚及び熱履歴並
びにレジスト２０の膜厚が変わることによって任意の角
度に選定される。When the etching process is performed in this manner, the etching solution permeates through the resist 20 and the third and third etching processes are performed. Second. First insulating film 18
．． 17.16 is etched, but at that time, as mentioned above, the thermal history is as follows: third insulating film 18 < second insulating film 17 < first insulating film 16, so the relationship between the respective etching rates is However, third insulating film 1g) second insulating film 17>first
An insulating film 16 is formed. That is, the third insulating film 18 is eroded the fastest, and the second. As the erosion of the first insulating film 17.16 gradually slows down, the first insulating film 17.
~A tapered surface is formed in the third insulating films 16 to 18 around the resist 20. This tapered surface has a shape that gradually expands from the upper layer to the lower layer, and the film thickness and thermal history of the first to third insulating films 16 to 18 and the film thickness of the resist 20 change. An arbitrary angle can be selected by this.
そして、前記エツチング処理によってテーパ面（資）が
形成された後、第３の絶縁膜１８からレジスト艶を剥離
し、その後第６図に示すように１前記ギヤツプ材り及び
下部磁性膜１１の上に第３の絶縁膜１８を覆うように上
部磁性膜２１が積層され、かつその上部磁性膜２１上に
保護膜２２が積層されることにより、薄膜磁気ヘッドが
形成される。前記上部磁性膜２１は、上部コアをなすも
のであって、下部磁性膜１１と同様にパーマロイ、フェ
ライト等で構成されている。After the tapered surface (material) is formed by the etching process, the resist gloss is peeled off from the third insulating film 18, and then, as shown in FIG. An upper magnetic film 21 is laminated to cover the third insulating film 18, and a protective film 22 is laminated on the upper magnetic film 21, thereby forming a thin film magnetic head. The upper magnetic film 21 forms an upper core, and is made of permalloy, ferrite, etc., like the lower magnetic film 11.
本発明方法は、上記の如く、夫々の絶縁膜１６〜１８が
順次積層され、エツチング処理したとき、夫々の絶縁膜
１６〜１８に応じてエツチングレートが変わるようにし
たので、絶縁膜１６〜１８の周辺部に設けられるテーパ
面父の形状を一様に形成することができる。In the method of the present invention, as described above, when the insulating films 16 to 18 are sequentially laminated and etched, the etching rate is changed depending on the insulating films 16 to 18. The shape of the tapered surface provided around the periphery can be formed uniformly.
従って、有機樹脂の絶縁膜４を一層設けた従来例と比較
すると、テーパ面加を円滑に形成することができると共
に、量産時、テーパ面蜀にノくラツキが生じるのを防ぐ
ことができる。しかもテーパ面（資）は絶縁膜厚及び熱
履歴等によって種々の角度に選定できるので、所望の角
度を容易に得ることができる。Therefore, compared to the conventional example in which one layer of the organic resin insulating film 4 is provided, the tapered surface can be smoothly formed, and unevenness in the tapered surface can be prevented during mass production. Moreover, since the tapered surface can be selected to have various angles depending on the thickness of the insulating film, thermal history, etc., a desired angle can be easily obtained.
また、図示実施例では第１の絶縁膜１６に導体コイル１
５が設けられるので、第１の絶縁膜工６とギャップ材１
２との双方によって導体コイル１５及び下部磁性膜１１
間を確実に電気絶縁することができ１ しかも第１の絶
縁膜１６とその上に積層された第２の絶縁膜１７とで導
体コイル１５を挾むので、両絶縁膜１６．１７によって
導体コイル１５に対する支援性をよシいっそう高めるこ
とができる。Further, in the illustrated embodiment, a conductor coil 1 is provided on the first insulating film 16.
5 is provided, the first insulating film 6 and the gap material 1
2 and the conductor coil 15 and the lower magnetic film 11.
Since the conductor coil 15 is sandwiched between the first insulating film 16 and the second insulating film 17 laminated thereon, the conductor coil 15 can be reliably electrically insulated between 15 can be further enhanced.
なお図示実施例では、前述の如く、第１の絶縁膜１６と
第２の絶縁膜１７との間に導体コイル１５が設けられた
例を示したが、本発明方法においては必ずしもそれに限
定されるものではない。即ち、本発明方法においては、
上記実施例の効果と相反するが、例えばギャップ材が確
実に電気絶縁できる厚みであれば、第１の絶縁膜１６が
年債になシ１その場合、導体コイル１５を覆う絶縁膜を
少なくとも二層に順次積層することによシ、上記の効果
を達成することができる。Although the illustrated embodiment shows an example in which the conductor coil 15 is provided between the first insulating film 16 and the second insulating film 17 as described above, the method of the present invention is not necessarily limited to this. It's not a thing. That is, in the method of the present invention,
Although it contradicts the effect of the above embodiment, for example, if the gap material has a thickness that can ensure electrical insulation, the first insulating film 16 will not be used for annual bonds.In that case, at least two insulating films covering the conductor coil 15 will By laminating the layers one after another, the above effects can be achieved.
以上述べたように、本発明方法によれば、下部磁性膜に
積層されたギャップ材に導体コイルを積層し、そのギャ
ップ材の上に導体コイルを覆り有機樹脂製の絶縁膜を少
なくとも二層に分けて順次積層して平板状積層体を形成
し、該平板状積層体の前記上層絶縁膜上には導体コイル
よシ上方位置にレジストを塗布すると共に平板状積層体
をエツチング処理して、上層及び下層絶縁膜のレジスト
周辺部にエツチングレートに応じたテーパ面が形成され
るようにしたので、テーパ面の角度を簡単にかつ確実に
一定に押えることができると共に、所望の角度を容易に
形成することもできる。従って、本発明方法によれば、
電気特性を確実に向上させることができる効果がある。As described above, according to the method of the present invention, a conductor coil is laminated on the gap material laminated on the lower magnetic film, and at least two layers of organic resin insulating films are formed on the gap material, covering the conductor coil. are sequentially laminated to form a flat laminated body, and a resist is applied on the upper insulating film of the flat laminated body at a position above the conductor coil, and the flat laminated body is etched. Since a tapered surface corresponding to the etching rate is formed around the resist of the upper and lower insulating films, the angle of the tapered surface can be easily and reliably held constant, and the desired angle can be easily achieved. It can also be formed. Therefore, according to the method of the present invention,
This has the effect of reliably improving electrical characteristics.
第１図乃至第６図は本発明の薄膜磁気ヘッドの製造方法
を具体化した一実施例を示し、第１図はギャップ材の積
層状態を示す断面図、第２図は導体コイルの積層状態を
示す断面図、第３図は平板状積層体を示す断面図、第４
図はレジストの積層状態を示す断面図、第５図はエツチ
ング処理によってテーパ面が形成された状態を示す断面
図、第６図は薄膜磁気ヘッドを示す断面図、第７図は従
来の薄膜磁気ヘッドの一構成例を示す断面図である。
１１・・・下部磁性膜、１２・・・ギャップ材、１５・
・・導体コイル、１６・・・第１の絶縁膜、１７・・・
第２の絶縁膜、１８・・・第３の絶縁膜。
代理人 弁理士 秋 本 正 実
＠１図
第２図
第３図1 to 6 show an embodiment of the method of manufacturing a thin film magnetic head of the present invention, FIG. 1 is a cross-sectional view showing the laminated state of the gap material, and FIG. 2 is the laminated state of the conductor coil. FIG. 3 is a sectional view showing a flat laminate; FIG.
The figure is a cross-sectional view showing the laminated state of resist, Figure 5 is a cross-sectional view showing a tapered surface formed by etching, Figure 6 is a cross-sectional view showing a thin film magnetic head, and Figure 7 is a conventional thin film magnetic head. FIG. 2 is a cross-sectional view showing an example of the configuration of a head. 11... Lower magnetic film, 12... Gap material, 15.
...Conductor coil, 16...First insulating film, 17...
second insulating film, 18... third insulating film; Agent Patent Attorney Tadashi Akimoto @Figure 1 Figure 2 Figure 3
Claims (1)
パターンで導体コイルを積層し、前記ギャップ材膜に導
体コイルを覆う有機樹脂製の絶縁膜を少なくとも二層に
分けて順次積層して平板状積層体を形成し、その後、平
板状積層体の前記上層絶縁膜には導体コイルより上方位
置にレジストを塗布して該平板状積層体をエッチング処
理し、上層及び下層絶縁膜のレジスト材周辺部に上層絶
縁膜と下層絶縁膜とのエッチングレートの差に応じたテ
ーパ面が形成されることを特徴とする薄膜磁気ヘッドの
製造方法。A conductor coil is laminated in a predetermined pattern on a gap material film laminated on a lower magnetic film, and at least two layers of an organic resin insulating film covering the conductor coil are sequentially laminated on the gap material film to form a flat plate. After that, a resist is applied to the upper insulating film of the flat laminated body at a position above the conductor coil, and the flat laminated body is etched, so that the periphery of the resist material of the upper and lower insulating films is etched. 1. A method of manufacturing a thin-film magnetic head, characterized in that a tapered surface is formed in a portion corresponding to a difference in etching rate between an upper insulating film and a lower insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60113098A JPH0658729B2 (en) | 1985-05-28 | 1985-05-28 | Method of manufacturing thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60113098A JPH0658729B2 (en) | 1985-05-28 | 1985-05-28 | Method of manufacturing thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61271609A true JPS61271609A (en) | 1986-12-01 |
| JPH0658729B2 JPH0658729B2 (en) | 1994-08-03 |
Family
ID=14603427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60113098A Expired - Lifetime JPH0658729B2 (en) | 1985-05-28 | 1985-05-28 | Method of manufacturing thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0658729B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58108019A (en) * | 1981-12-21 | 1983-06-28 | Trio Kenwood Corp | Thin-film magnetic head |
| JPS59165220A (en) * | 1983-03-11 | 1984-09-18 | Comput Basic Mach Technol Res Assoc | Thin-film magnetic head and its manufacture |
-
1985
- 1985-05-28 JP JP60113098A patent/JPH0658729B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58108019A (en) * | 1981-12-21 | 1983-06-28 | Trio Kenwood Corp | Thin-film magnetic head |
| JPS59165220A (en) * | 1983-03-11 | 1984-09-18 | Comput Basic Mach Technol Res Assoc | Thin-film magnetic head and its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0658729B2 (en) | 1994-08-03 |
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