JPS61243371A - Drive circuit apparatus - Google Patents

Abstract

PURPOSE:To improve the heat radiation of feed end matching resistances, by drawing the feed end matching resistances of a drive circuit in an IC inspection system from a drive circuit module to be set on the back of a wiring board carrying the drive circuit module. CONSTITUTION:Feed end matching resistances 20, 22 and 24 and diodes 32 and 34 are arranged on the back of a wiring board 28 and other parts on the surface thereof 28. The feed end matching resistances 20, 22 and 24 are solder connected to connection pads 50, 51 and 52. the connection pads 50 and 51 are provided at the position almost the same as that of the output pin of the drive circuit module 10 so that the output of the drive circuit module 10 and the feed end matching resistances 20, 22 and 24 may be connected at the shortest distance. Moreover, the feed end matching resistances 20, 22 and 24 are connected mutually in the shape of a triangle to make the respective lead length and the mutual connection distance the shortest as compared with the parallel or series arrangement thereof.

Description

[Detailed Description of the Invention] [Field of Application in Industry-1-] The present invention relates to an IC testing system, and in particular, to an IC testing system.
The present invention relates to a drive circuit device that applies a predetermined voltage to a specific pin of C.

[Prior Art] A drive circuit device of an ICM inspection system applies a predetermined voltage to a specific pin of an IC to be inspected in response to a control number 42 from a control station, and is directly connected to the IC to be inspected. The test head is connected to the test head.

A conventional drive circuit device has a configuration in which a sending end matching resistor is built inside a drive circuit module (hybrid module).

[Problem to be solved] The sending end matching resistor often generates heat, but conventionally the sending end matching resistor is installed inside the drive circuit module.
The heat dissipation was less than 1 minute. As a result, the temperature of the sending-end matching resistor and the elements constituting the drive circuit rose significantly, which was a factor in deteriorating the reliability of the drive circuit device.

In addition, the connection distance between the sending end matching resistance and the output point of the drive circuit, and the connection tA to reduce the sending end matching resistance! It is necessary to shorten the distance as much as possible. In other words, in order to shorten the connection distance, a sending end matching resistor has conventionally been built into the drive circuit module.

[Object of the Invention] An object of the present invention is to solve the problems of the prior art by revising the heat dissipation of the sending end matching resistor, and to provide a drive circuit device that satisfies the connection conditions described above.

[Means for Solving the Problems] In order to achieve the above object, the present invention takes out the sending end matching resistor from the drive circuit module and places it on the back side of the wiring board on which the drive circuit module is mounted. Set up

[Function] Since the sending end matching resistor is exposed, sufficient heat is dissipated, the temperature rise is suppressed, and the reliability of the sending end matching resistor is improved. Since the heat of the sending end matching resistor is blocked by the wiring board and is not directly transmitted to the drive circuit module, the temperature rise of the drive circuit module is suppressed and the reliability of the drive circuit is improved.

Further, since there is a large degree of freedom in positioning the sending end matching resistor relative to each other and the drive circuit module, the sending end matching resistor can be easily connected over the shortest distance.

[Example 1] An example of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic back view of a wiring board of a drive circuit device according to the present invention, and FIG. 2 is a schematic block diagram showing a circuit configuration diagram of the drive circuit device.

First, the circuit configuration will be explained with reference to FIG. In addition, there are two circuit systems A and B, and in each diagram, the corresponding parts of each system are marked A with the same reference number and system.
or B are given as reference numerals, but in the following explanation, only the reference numerals will be used unless there is a need to particularly distinguish between systems.

10 is a drive circuit module (hybrid module), and a related reference voltage source module 12+
14, more stable voltages VIH and VIL are supplied. 1
6 and 18 are complementary terminals at the final stage of the drive circuit.
They are a pair of outputs of the push-pull circuit, and are led out through specific pins of the drive circuit module 10. Unlike before, the sending end matching resistor 20 of the drive circuit
, 22, 24 are arranged outside the drive circuit module 10 and are coupled to the outputs te, ts as shown.

The drive circuit device is built into the test head of the IC4Q inspection system, and the drive circuit module 10 changes the voltage VIH in response to a control signal (test pattern) input from the control stage generator of the IC inspection system. A voltage dependent on the voltage VIL is delivered to the output 16 or a voltage dependent on the voltage VIL is delivered to the output 18.

The connection point between the sending end matching resistor 20 and the matching resistor 22 is connected to the wiring board 28 by a connection switching circuit 26 consisting of a plurality of relay contacts.
is connected to a specific contact pattern 30 or 31 of the plug. The contact pattern of this plug is connected to corresponding pins of the IC to be tested via one or more connectors (not shown). 32 and 34 are diodes to prevent the potential at the connection point of the sending end matching resistor 20. Connected with polarity.

40 is an analog comparator, the input of which is connected to contact pattern 30 or 31 by connection switching circuit 26. However, the drive circuit module 10 and the analog comparator 40 have contact patterns 30 or 3.
Exclusively connected to 1. Analog comparator 4
0 compares the output waveform of the pin of the IC to be tested connected to the contact pattern 30 or 31 with the voltage of two specific groups, converts it into an ECL level digital signal, and sends it to the control station.

Although the analog comparator 40 does not essentially belong to the drive circuit device, since it is directly related to the drive circuit device, it is mounted on the same wiring board 28.

Among the components, the sending end matching resistors 20, 22.24 and the diodes 32.34 are arranged on the back side of the wiring board 28, as shown in FIG. 1, but the other components are as follows. It is arranged on the surface of the wiring board 28. In FIG. 1, reference numerals 50, 51, and 52 are connection pads provided on the back surface of the wiring board 28. The sending end matching resistors 20, 22, 24 are soldered connected to connection pads 50, 51, 52 as shown.

Here, the connection pad 50.51 is provided at almost the same position as the pin of the output 16.18 of the drive circuit module 10, and the distance between the output 16.18 of the drive circuit module 10 and the sending end matching resistor 20.22°24 is as short as possible. They are connected by distance.

Note that the pin and the connection pads 50 and 51 are electrically connected.

In addition, the sending end matching resistors 20, 22, and 24 are arranged in a triangular shape as shown in the figure. I: Because they are connected, their lead lengths and mutual connection distances are the shortest compared to when they are arranged in 112 rows or in series.

Although the embodiments have been described above, the present invention is not limited thereto, and can be implemented with various modifications without departing from the gist of the present invention.

[Effects of the Invention] As explained above, according to the present invention, the sending end matching resistor is taken out from the drive circuit module and placed on the back side of the wiring board on which the drive circuit module is mounted. The end matching resistor dissipates heat in 1 minute, suppressing the rise of 7K degrees, improving the reliability of the sending end matching resistor, and the heat of the sending end matching resistor is blocked by the wiring board and is directly transmitted to the drive circuit module. temperature of the drive circuit module is suppressed, the reliability of the drive circuit is improved, and the matching resistance of the sending end and its position relative to the drive circuit module are reduced. The transmission end matching resistor can be easily connected over the shortest distance, and other effects can be achieved.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing the back side of a wiring board of a drive circuit device according to the present invention, and FIG. 2 is a schematic circuit configuration diagram of the same embodiment. 10A, IOB...drive circuit module, 12
A, 12B, 14A, 14B...Reference voltage source module, 2OA, 20B, 22A, 22B, 24A, 24B
... Sending end matching resistor, 28... Wiring board.

Claims (3)

[Claims] (1) In the IC testing system, the specified voltage is
A drive circuit device for applying voltage to a specific pin of C,
A drive circuit device characterized in that a sending end matching resistor connected to an output of the drive circuit is provided on the back side of a wiring board on which a module of the drive circuit is mounted. (2) The drive circuit device according to claim 1, wherein three sending end matching resistors are connected to three connection pads on the back surface of the wiring board in a triangular shape. (3) The second connection pad to which the sending end matching resistor is connected is located close to the associated specific pin of the module of the drive circuit.
Drive circuit device as described in section.