JPS61214439A - Semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE:To enable the simultaneous loading of plural resin tablets and the proper mold shaping by aligning the plural resin tablets in advance according to the arrangement of plural small ports provided for a molding die and loading the whole arranged tablets into the die while retaining such arranging condition. CONSTITUTION:The resin tablets 11 in a part feeder 10a are carried to the side of a release device 18 in order and fall on an alignment table 19 from a chuck part 17 one by one. The alignment table 19 is shifted toward the right in order by a motor 21 and a screw shaft 23 so that the resin tablets 11 are contained in the alignment holes 19a on the side of first row. When the all resin tablets 11 are put in the holes 19a of the row A side, a cylinder 53 is actuated to swing a lever 54. Then as a table 20 is pressed through a roller 54, the alignment table 19 shifts backward and the alignment holes 19a of the row B side shift to beneath the chuck part 17. After that, the resin tablets 11 fall in turn from the chuck part 17 and are contained in the alignment holes 19a of the row B side similarly.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention uses a multi-plunger one-type mold to
Semiconductor manufacturing equipment that uses a transfer molding method to mold semiconductor elements such as chips with resin, especially powdered resin in the form of tablets (hereinafter referred to as resin tablets)
This relates to a feeding mechanism for feeding the metal into the mold.

(Prior Art) Conventionally, as a technology in such a field, there was one described in "R LSI Factory Automation Process Technology Collection" (March 31, 1982) Edipoc Co., Ltd. P, 341-346.

As described in this document, transfer molding is the most productive and low cost of the many integrated circuit packaging methods. In transfer molding, a semiconductor element mounted on a lead frame is set in a mold heated to about 150 to 180 degrees Celsius, a resin tablet is preheated by high-frequency heating, it is put into the mold, and a plunger is used to This is a method of pressurizing the material to about 100 kg/cm2 and filling it into a cavity. Transfer molding requires expensive precision molds and large molding equipment, so it is not suitable for small-scale production, but it is the most excellent packaging method for mass production of ICs. Furthermore, recently, a molding method using a multi-plunger mold has been attracting attention due to the trend toward unmanned molding, reduction of resin tablets, and shortening of curing time.

FIG. 2 is a top view showing a conventional multi-plunger type mold. In FIG. 2, 1 is an upper mold, and 2 is a lower mold, and the mold 1 or 2 is moved downward by a plunger and pressurized. A plurality of concave cavities 3 are arranged in the lower mold 2, and a groove-shaped gate 4 is provided in the cavities 3.
A plurality of concave small ports 5 are connected to each other via a plurality of concave small ports 5.

In the multi-plunger molding method using these molds 1 and 2,
First, a lead frame to be molded is set on a loading frame (not shown), and this loading frame is set on the lower mold 2. Then, each semiconductor element mounted on the lead frame is housed in each cavity 3. Next, a cylindrical resin tablet 11 is put into each small port 5, and the heated upper and lower molds 1.2 are moved through a plurality of plungers. When pressurized, the resin tablet melts and is injected into the cavity 3 through the gate 4, and the semiconductor element is molded with the resin.

In this method, since the distance between the small port 5 and the cavity 3 is short, molding variations between the cavities 3 can be reduced, and the material efficiency of the resin can be improved. Furthermore, since the resin tablet used in the multi-plunger method is small, it has advantages such as excellent heat transfer from the mold 1.2 and the ability to shorten resin curing time.

In order to increase production efficiency, (1) setting the lead frame on the loading frame, (2) ff1
- Setting the ting frame into the mold, (3)
Inserting the resin tablet into the mold, (4) applying pressure to the mold,
(5) Taking out the packaged lead frame and loading frame, (8) Cleaning the mold,
(7) Separation processes such as culls and gates are automated, eliminating manual work and moving toward unmanned operations.

Regarding the charging of the resin tablets into the mold in the above (3), conventionally, an automatic resin tablet supplying device that automatically supplies resin tablets one by one to the plurality of small ports 5 in the lower mold 2 has been used. Proposed.

(Problems to be Solved by the Invention) However, in the resin tablet automatic supply device having the above configuration, since the resin tablets H1 are sequentially supplied to the plurality of small ports 5, the resin tablets are not supplied to all the small ports 5. When pressurizing the upper and lower molds 1 and 2 after charging, the resin tablets that were initially charged melt and solidify.
There was a problem in that the cavity 3 was not filled even when pressurized, resulting in molding defects.

The present invention provides a semiconductor manufacturing apparatus that solves the problem of the prior art, which is the occurrence of molding defects due to the difference in injection time of resin tablets.

(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a tablet supply system that sequentially discharges a large number of resin tablets in a semiconductor manufacturing apparatus that molds semiconductor elements with resin using a multi-plunger molding method. a device, a rotating body that sequentially holds resin tablets discharged from the tablet supply device and rotates horizontally intermittently, and a release provided at a stop position of the rotating body to release the resin tablets clamped by the rotating body. a device, and an alignment hole installed horizontally movably below the release device and arranged in the same arrangement as a plurality of small ports, through which the resin tablets to be released into the release device are sequentially placed. A sorting table for storing the resin tablets and a delivery device for simultaneously introducing the resin tablets stored in the sorting table into the small port while maintaining the arrangement state thereof are provided.

(Function) According to the present invention, since the semiconductor manufacturing apparatus is configured as described above, the resin tablets discharged from the tablet supply device are individually moved to a predetermined position by the rotating body, and the resin tablets are moved by the releasing device to a predetermined position. are released from the holding state and sequentially introduced into the alignment holes of the alignment table. The resin tablets arranged on the alignment table in the same arrangement as the plurality of small ports are simultaneously thrown into the plurality of small ports by the delivery device. Therefore, the above problem can be eliminated.

(Embodiment) FIG. 1 is a perspective view of a semiconductor manufacturing apparatus showing an embodiment of the present invention. In FIG. 1, reference numeral 10 denotes a tablet supply device, and this tablet supply device IO sequentially discharges a large number of cylindrical resin tablets, for example II! j+! It is composed of a parts feeder 10a having a linear groove and a linear discharge cylinder 10b.

When a large number of resin tablets 11 are fed into the parts feeder 10a, the parts feeder fOa fI rotates to feed the resin tablets H1 into the cylinder 1Ob. The resin tablets 11 are arranged in rows within the cylindrical body 10b, and are sequentially discharged from the opening at the tip of the cylindrical body 10 and provided to the holding member 12. The holding member 12 is made of a member having a U-shaped cutout in a portion facing the cylinder tab, and is movably mounted on a base 13 having a drop hole 13a. A cylinder 15 is attached to the holding member 12 via a moving guide member 14, and the cylinder 15 causes the holding member 12 to slide in the direction of the drop hole 13a. Therefore, the resin tablet 11 inserted into the notch of the holding member 12 moves in the direction of the drop hole 13a, falls from the drop hole 13a, and is held by the disc-shaped index table 18, which is a rotating body.

The index table 1B has chuck portions 17 for holding resin tablets provided near the outer edge of the disk, for example, at 80° intervals, and is operated by a motor (not shown) to hold resin tablets at 90°.
It rotates intermittently. A release device 18 for releasing the resin tablet 11 from the chuck portion I7 is provided on the opposite side of the index table 18 in correspondence with the cylinder 10b. The release device 18 is composed of, for example, a cylinder 18a and a pressing member 18b, and the suppressing member 18b presses the chuck part 17 inward to drop the resin tablets 11 clamped by the chuck part 17, so that the resin tablets 11 are aligned in a longitudinal shape. stand 18
supply to.

The alignment table 18 is installed below the index table 16, and the plurality of small ports 5 shown in FIG.
It has a plurality of alignment holes 19a for storing resin tablets arranged in the same arrangement as. The alignment table 18 is fixed to a table 20 installed below the alignment table 18 by a support member described later. The table 20 is moved in the lateral direction of the alignment table 19 by a sliding mechanism to be described later, and is moved in the longitudinal direction of the alignment table 13 by rotation of a screw shaft 23 connected to the shaft of a motor 21 via a coupling 22. Move to. Therefore, the alignment table 19 also moves in its longitudinal direction and width direction, and the resin tablets 11 falling from the chuck portion 17 are sequentially accommodated in the plurality of alignment holes 19a.

A movable plate-shaped shutter 24 is provided on the bottom of the alignment table 18.
is provided, and this shutter 24 prevents the resin tablets 11 from falling into the alignment holes 19a. The shutter 24 is moved under the bottom surface of the alignment table 18 by a cylinder 25, and drops the resin tablet 11 in the alignment hole 19a in an open state.

In addition, in FIG. 1, 30 is a motor, and a side cam 32 is connected to this motor 30 via a camshaft 31.
0 rotation causes the side cam 32 to rotate.

A cam lever 33 is provided near the side cam 32, and a roller 3 attached to one end 33a of this cam lever 33
4 is in contact with the side cam 32. When the side cam 32 rotates, the displacement of the side cam 32 causes one end 33a of the cam lever 33 to swing left and right via the roller 34, and the other end 33b of the cam lever 33 accordingly swings back and forth. The other end 33b of the cam lever 33 is separated from and in contact with the chuck portion 17.

FIG. 3 is an enlarged side view of the vicinity of the base drop hole 13a in FIG. 1. At a lower position of the drop hole 13a provided in the base 13, there is a resin tablet Nl that falls from the drop hole 13a.
A stopper 40 is installed for placing the. A chuck portion 17 provided near the outer edge of the index table 1B passes between the stopper 40 and the base 13. The chuck part 17 is attached to the index table 1B.
An opening 42 is formed leaving the outer edge 41 of the opening 42 and one end 4
3a is located outside the outer edge 41, and the other end 43b is located at the opening 4.
2 and has a through hole 43c between both ends 43a and 43b, and a spring 44 stretched between the other end 43b of the moving member 43 and the opening 42.

The chuck portion 17 is in a closed state when the movable member 43 is moved to the left in FIG. 3 due to the biasing force of the spring 44. On the other hand, by the other end 33b of the cam lever 33 in FIG. 1 or the pressing member 18b of the release device 18,
When one end 43a of the moving member 43 is pressed toward the right in FIG. 3 against the biasing force of the spring 44, the chuck portion 1
7 is in an open state, and the resin tablet 11 can be held. When the chuck part 17 opens, the resin tablet 11 that has fallen from the drop hole 13a will fall into the opening 44 and the through hole 4.
3c and is written on the stopper 40, and then when the chuck part 17 is closed, the outer edge part 41 and the other end 43 of the moving member
The resin tablet 11 is held between the parts b and b.

FIG. 4 is a rear perspective view of the vicinity of the alignment table la in FIG. 1. The alignment table 18 has a plurality of alignment holes 19a in row A on the rear side and row B on the front side in FIG. 4, and is fixed to the table 20 via a support member 50. The table 20 is placed on a moving block 52 via a sliding mechanism 51 such as a bearing, and can be moved in the lateral direction of the alignment table 18 by the sliding mechanism 51. A cylinder 53 is provided below the table 20, and this cylinder 53 has
A lever 54 with rollers 54 is connected. When the cylinder 53 is driven, the lever 54 swings, thereby moving the table 20 in the lateral direction of the alignment table 18 via the roller 54a. The moving block 52 is moved by a guide shaft 55 arranged parallel to the longitudinal direction of the alignment table 19.
It is supported slidably and moves along the guide shaft 55 as the screw shaft 23 rotates.

Near the alignment table 18 is a resin tablet H1 delivery device 6.
0 is set. The delivery device 60 includes a transport mechanism 81 that moves in the direction of the arrow in FIG. 4 between the alignment table 19 and the mold 1.2 shown in FIG. It is composed of a receiving block 82 having resin tablet storage holes 82a arranged in an array, and a hole closing shutter 63 movably attached below the bottom surface of the receiving block 62.

Note that the mechanisms of each part of the semiconductor manufacturing apparatus automatically operate in sequence according to a predetermined sequence.

Next, the operation of the semiconductor manufacturing apparatus configured as described above will be explained.

First, in FIG. 1, when a large number of resin tablets 11 are fed into the parts feed 10a, the resin tablets 11 are ejected one by one from the opening at the tip of the cylinder 10b, and are removed from the U-shaped cut of the holding member 12. It is inserted into the gap. Then, the holding member 12 is moved by the cylinder 15 toward the drop hole 13a of the base 13, and the resin tablet 11 inside the U-shaped notch is dropped from the drop hole 13a.

As shown in FIG. 3, the chuck portion 17 of the index table IB has been moved to the lower position of the drop hole 13a, and this chuck portion 17 is moved inside by the other end 33b of the cam lever 33 shown in FIG. Since the tablet H1 is pushed open in the opposite direction, the resin tablet H1 that has fallen from the drop hole 13a is placed on the stopper 40. Next, cam lever 3
When the pressing force from the other end 33b of 3b is released and the chuck part 17 is closed, the resin tablet 11 is clamped by this chuck part 17. and index table 1
6 rotates to the right in FIG. 1, and the resin tablet 11 is transferred to the release device 18 side.

In the release device 18, the cylinder 18a is operated and the suppressing member 18b presses the chuck part 17, so that the chuck part 17 opens and the resin tablet 11 is dropped. The resin tabley/ ) 11 that fell from the chuck part 17 is
As shown in FIG. 4, it is stored in the alignment hole 19a at the right end of row A provided in the alignment table 19.

As described above, the resin tablets 11 in the parts feeder 10a are sequentially transported to the release device 18 side, and are dropped one by one from the chuck section 17 to the alignment table 18 by the release device i18. The alignment table 18 in Fig. 4 is sequentially moved to the right by the motor 21 and screw shaft 23, and
The resin tablets 11 are stored in the alignment holes 19a on the row side. When the resin tablets 11 are completely filled in the alignment holes 19a on the A row side, the cylinder 53 is activated and the lever 5 is moved.
4 swings and the table 20 is pressed via the roller 54a, the alignment table 19 moves rearward in FIG. after that.

The resin tablets 11 sequentially fall from the chuck portion 17 and are stored in the alignment holes IEla on the B row side in the same manner as described above.

When the storage is completed, the transport mechanism 81 of the delivery device 80 moves toward the yutter 24, and the receiving block 62 comes to a position below the shutter 24. Then, the cylinder 25 is actuated and the shutter 24 is opened, and the resin tablet (11) in the alignment hole t9a falls and enters the hole B2 of the receiving block B2.
Then, the conveying mechanism 81 moves away from the shutter 24 and moves in the direction of the upper and lower molds 1 and 2 in FIG. 2. When the receiving block 62 comes over the lower mold ylj, 2, the shutter 83 opens and the resin tablets 11 in each hole 82a fall, and the resin tablets 11 are simultaneously placed in each small port 5 provided in the lower mold 2. It can be thrown in.

Note that before the resin tablet 11 is introduced, the lower mold 2 is already in place.
The lead frame to be molded is set, and the upper and lower molds 1 and 2 are heated, so after the resin tablet H1 is introduced, the upper and lower molds 1 and 2 are pressurized by the plunger and the resin mold of the semiconductor element is heated. It is done.

According to this embodiment, the resin tablet H1 is attached to the lower mold 2.
Since it is simultaneously injected into each of the small ports 5, it is possible to prevent molding defects from occurring.

Furthermore, since the cylindrical resin tablets [1] are fed into the small port 5 without being transferred as much as possible, it is possible to prevent the loss or loss of the resin tablets 11 due to transfers. Tablet) 11 can be inserted into small port 5. Therefore, defects in molding due to insufficient amount of resin can also be prevented.

In the above embodiment, the tablet supply device 1O was configured with the parts feeder 10a and the cylindrical body tob, but if this is replaced with a device having a structure that allows the resin tablets 11 to be sequentially ejected without being transferred, it will be possible to remove the resin tablets 11 without being transferred. Now, it is possible to further reduce the wear and tear of the resin tablet 11.

Further, it goes without saying that the present invention is not limited to the structure shown in the drawings, and various modifications are possible.

(Effects of the Invention) As described in detail above, according to the present invention, a plurality of resin tablets are arranged in advance according to the arrangement of a plurality of small ports provided in a mold, and the resin tablets are directly arranged. Since the resin tablets are placed in the mold, it is possible to feed a plurality of resin tablets at the same time, which allows accurate molding.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a semiconductor manufacturing apparatus showing an embodiment of the present invention, FIG. 2 is a top view showing a conventional multi-plunger one-type mold, and FIG. 3 is a view of the vicinity of the base drop hole in FIG. The enlarged side view and FIG. 4 are rear perspective views of the vicinity of the alignment table in FIG. 1. l... Upper mold, 2... Lower mold, 3...
...Cavity, 5...Small port,
10... Tablet supply device, 11...
- Resin tablet, 16...Rotating body (index table), 17...Chuck part. 18...Release device, 18...Alignment table,
19a...Alignment hole, 80...Delivery device. Applicant's representative Kakimoto Kyo Sei I: Stopper mold 2: Lower mold 3: J1 Yahi "T 4: Mata mall boat

Claims (1)

[Claims] A semiconductor element mounted on a lead frame in the cavity of an upper and lower mold having a plurality of arranged concave cavities and a plurality of concave small ports connected to the cavities and arranged in a plurality. In the semiconductor manufacturing apparatus, the resin tablet is inserted into each of the small ports, the upper and lower molds are heated and pressurized vertically to fill the resin tablet into the cavity, and the semiconductor element is resin-molded. , a tablet supply device that sequentially discharges a large number of resin tablets; a rotating body that sequentially holds the resin tablets discharged from the tablet supply device and rotates horizontally intermittently;
A release device is provided at a stop position of the rotary body to release the resin tablet held by the rotary body, and a release device is installed at a position below the release device so as to be horizontally movable and is arranged in the same manner as the plurality of small ports. an alignment table that sequentially stores the resin tablets released by the releasing device in the arranged alignment holes; and a delivery device that simultaneously throws the resin tablets stored in the alignment table into the small port while maintaining the arrayed state. A semiconductor manufacturing device characterized by being provided with.