JPS6120728A - Preparation of laminate board - Google Patents
Preparation of laminate boardInfo
- Publication number
- JPS6120728A JPS6120728A JP59142922A JP14292284A JPS6120728A JP S6120728 A JPS6120728 A JP S6120728A JP 59142922 A JP59142922 A JP 59142922A JP 14292284 A JP14292284 A JP 14292284A JP S6120728 A JPS6120728 A JP S6120728A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- resin
- laminated base
- laminate
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
- B32B38/105—Removing layers, or parts of layers, mechanically or chemically on edges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2317/00—Animal or vegetable based
- B32B2317/12—Paper, e.g. cardboard
- B32B2317/125—Paper, e.g. cardboard impregnated with thermosetting resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Quality & Reliability (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【発明の詳細な説明】
[技術分野1
本発明は反りとかねじれのない積層板を製造す・る連続
無圧成形方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field 1] The present invention relates to a continuous non-pressure forming method for producing a laminate without warping or twisting.
[背景技術]
従来より、所要枚数の樹脂含浸基材を圧着して、積層基
材を予備加熱して含浸させた樹脂が流動しない程度に予
備硬化させ、そのまま更に加熱して樹脂を完全硬化させ
て積層板を製造していたが、予備加熱して樹脂を予備硬
化させた段階で積層基材の両側より流出した余剰樹脂に
て形成された耳部の硬化収縮率が本体の積層基材の硬化
収縮率よりも大きく、耳部近傍の積層基材の両側部のひ
ずみ残留応力が積層基材の中心部より大きくなり、この
ため完全硬化させて得た積層板には大きな反りやねじれ
が発生してしまった。[Background technology] Conventionally, a required number of resin-impregnated base materials are pressure-bonded, the laminated base material is preheated to pre-cure the impregnated resin to the extent that it does not flow, and then further heated to completely cure the resin. However, when the resin was preheated and precured, the curing shrinkage of the edges formed by the excess resin that flowed out from both sides of the laminated base material caused the curing shrinkage of the laminated base material of the main body. This is larger than the curing shrinkage rate, and the strain residual stress on both sides of the laminated base material near the ears is larger than that at the center of the laminated base material, resulting in large warps and twists in the fully cured laminate. have done.
[発明の目的1
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、積層板の無圧連続成形において、反
りやねじれの小さな積層板を得る製造方法を提供するこ
とにある。[Objective of the Invention 1 The present invention has been made in view of the above-mentioned circumstances, and its purpose is to provide a manufacturing method for obtaining a laminate with little warpage or twist in pressureless continuous forming of the laminate. There is a particular thing.
[発明の開示]
本発明の製造方法は、熱硬化性樹脂1を含浸させた所要
枚数の基材2を圧着させて積層基材3を形成し、次いで
この積層基材3を予備加熱して含浸鋒せた樹脂が流動し
ない程度に予備硬化させ、この後積層基材3の両側に余
剰樹脂にて形成された耳部4を切断し、次いで積層基材
3を加熱して樹脂を完全に硬化させることを特徴とする
ものであり、この構成により上記目的を達成できたもの
である。即ち、積層基材3の樹脂を完全硬化させる前に
、硬化収縮率の大きい耳部を切断しておくことにより、
積層基材3のひずみ残留応力を均一にできたものである
。[Disclosure of the Invention] In the manufacturing method of the present invention, a required number of base materials 2 impregnated with a thermosetting resin 1 are bonded together to form a laminated base material 3, and then this laminated base material 3 is preheated. The impregnated resin is precured to the extent that it does not flow, and then the ears 4 formed with excess resin on both sides of the laminated base material 3 are cut, and then the laminated base material 3 is heated to completely cure the resin. It is characterized by being cured, and with this configuration, the above object can be achieved. That is, before the resin of the laminated base material 3 is completely cured, by cutting off the edges with a large curing shrinkage rate,
The strain residual stress of the laminated base material 3 can be made uniform.
以下、本発明を添付の図面に基づいて説明する。Hereinafter, the present invention will be explained based on the accompanying drawings.
この実施例は金属張り積層板の製造についてのものであ
る。第1図に示すように巻取ロール11から紙やガラス
布のような基材2を巻戻し、フェノール樹脂、エポキシ
樹脂、エリア樹脂、不飽和ポリエステル樹脂等の熱硬化
性樹脂1のワニス槽5に通して基材2に熱硬化性樹脂1
を浸漬ロール12を介して含浸させる。次いで、所要枚
数(この実施例では4枚)の基材2を上下一対のスクイ
ズロール6間に通して圧着させて積層基材3を形成する
。この後、ヒータつとか予備加熱炉にて積層基材1を予
備加熱し、予備硬化させる。ここで予備硬化とは含浸さ
せた樹脂が流動しない程度をいう。尚、予備加熱は金属
箔8をラミネートした後に行ってもよい。次いでラミネ
ートロール7を介して銅箔、アルミニウム箔のような金
属箔8を基材の上下両面に貼着する。その後、第2図に
示すように予備硬化させるまでに積層基材3の両側に形
成した余剰樹脂から成る耳部4をカッター13により切
断する。次いで、この耳部4を切断した積層基材3を加
熱乾燥炉10に送り込み、無圧下、例えば120℃、8
分間で熱硬化性樹M1を完全に硬化させる。このように
して金属張り積層板Aを得る。このものを250 X
250+amに切断して試料A1とし、第3図に示すよ
うに、定盤上で三隅を押え付は不三点支持し、残りの一
点の持ち上がり高さH(mm)を測定したところ、0.
5〜2.On+mであった。This example concerns the production of metal-clad laminates. As shown in FIG. 1, a base material 2 such as paper or glass cloth is unwound from a take-up roll 11, and a varnish bath 5 of a thermosetting resin 1 such as phenol resin, epoxy resin, area resin, unsaturated polyester resin, etc. Thermosetting resin 1 is applied to base material 2 through
is impregnated via the dipping roll 12. Next, a required number of base materials 2 (four in this example) are passed between a pair of upper and lower squeeze rolls 6 and pressed together to form a laminated base material 3. Thereafter, the laminated base material 1 is preheated in a heater or a preheating furnace to be precured. Here, precuring refers to the degree to which the impregnated resin does not flow. Note that the preheating may be performed after laminating the metal foil 8. Next, metal foils 8 such as copper foil or aluminum foil are attached to the upper and lower surfaces of the base material via a laminating roll 7. Thereafter, as shown in FIG. 2, the edges 4 made of excess resin formed on both sides of the laminated base material 3 before being precured are cut off by a cutter 13. Next, the laminated base material 3 from which the ears 4 have been cut is sent into a heating drying oven 10 and heated under no pressure, for example, at 120° C.
The thermosetting resin M1 is completely cured in minutes. In this way, a metal-clad laminate A is obtained. 250 x this thing
Sample A1 was cut to 250+ am, and as shown in Fig. 3, the three corners were held down and supported at three points on a surface plate, and the lifting height H (mm) of the remaining point was measured, and it was found to be 0.
5-2. It was On+m.
はとんど反りやねじれが無いことが判る。これに対して
従来の方法で得た金属張り積層板を同様にして測定した
ところHは5.0〜10.0+amであった。It can be seen that there is almost no warping or twisting. On the other hand, when a metal-clad laminate obtained by a conventional method was similarly measured, H was 5.0 to 10.0+am.
この従来のものよりプリント配線基板を形成しても信頼
性に欠けて実用に供することができなかった。Even if a printed wiring board was formed using this conventional method, it lacked reliability and could not be put to practical use.
[発明の効果]
本発明にあっては、積層基材を予備加熱して含浸させた
樹脂が流動しない程度に予備硬化させた後、積層基材の
両側に余剰樹脂にて形成された耳部な切断するので、熱
硬化性す(脂のみから成る硬化収縮率の大きい耳部を切
断しておくことにより、積層基材のひずみ残留応力を均
一にでき、この後積層基材を加熱して樹脂を完全に硬化
させて得た積層板には反りやねヒれがほとんどないよう
にできる。[Effects of the Invention] In the present invention, after the laminated base material is preheated and the impregnated resin is precured to the extent that it does not flow, ears formed with excess resin on both sides of the laminated base material are formed. By cutting the edges that have a high curing shrinkage rate and are made only of thermosetting resin (fat), the strain and residual stress of the laminated base material can be made uniform, and the laminated base material is then heated. The laminate obtained by completely curing the resin has almost no warping or sagging.
第1図は本発明の一実施例を実施するための装置を示す
概略図、第2図(、)(b)は同上における耳部の切断
工程を示す断面図、第3図は反り及びねじれの測定方法
を示す説明図であって、1は熱硬化性樹脂、2は基材、
3は複層基材、4は耳部である。
代理人 弁理士 石 1)艮 七
手続補正書(方式)
昭和60年2月15日Fig. 1 is a schematic diagram showing an apparatus for carrying out an embodiment of the present invention, Fig. 2 (,) (b) is a cross-sectional view showing the cutting process of the ear part in the above, and Fig. 3 is a warpage and twisting. FIG. 1 is an explanatory diagram showing a method for measuring , in which 1 is a thermosetting resin, 2 is a base material,
3 is a multilayer base material, and 4 is an ear portion. Agent Patent Attorney Ishi 1) Ai Seven Procedural Amendments (Forms) February 15, 1985
Claims (1)
させて積層基材を形成し、次いでこの積層基材を予備加
熱して含浸させた樹脂が流動しない程度に予備硬化させ
、この後積層基材の両側に余剰樹脂にて形成された耳部
を切断し、次いで積層基材を加熱して樹脂を完全に硬化
させることを特徴とする積層板の製造方法。(1) A required number of base materials impregnated with a thermosetting resin are pressed together to form a laminated base material, and then this laminated base material is preheated to precure to an extent that the impregnated resin does not flow; A method for producing a laminate board, which comprises: cutting the edges formed of excess resin on both sides of the laminate base material, and then heating the laminate base material to completely cure the resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59142922A JPS6120728A (en) | 1984-07-10 | 1984-07-10 | Preparation of laminate board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59142922A JPS6120728A (en) | 1984-07-10 | 1984-07-10 | Preparation of laminate board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6120728A true JPS6120728A (en) | 1986-01-29 |
JPH0463769B2 JPH0463769B2 (en) | 1992-10-12 |
Family
ID=15326747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59142922A Granted JPS6120728A (en) | 1984-07-10 | 1984-07-10 | Preparation of laminate board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6120728A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009109003A1 (en) * | 2008-03-03 | 2009-09-11 | Depco-Trh Pty Ltd | Heat reflective laminate |
CN103029305A (en) * | 2011-10-10 | 2013-04-10 | 汉达精密电子(昆山)有限公司 | Making method of carbon fiber housing |
CN103029306A (en) * | 2011-10-10 | 2013-04-10 | 汉达精密电子(昆山)有限公司 | Making method of carbon fiber housing |
CN107304008A (en) * | 2016-04-21 | 2017-10-31 | 住友化学株式会社 | The carrying method and device of resin film, the manufacture method of stacked film and device |
CN113194640A (en) * | 2021-04-28 | 2021-07-30 | 中国科学院微电子研究所 | Manufacturing method of low-warpage high-density packaging substrate |
WO2023204999A1 (en) * | 2022-04-22 | 2023-10-26 | Illinois Tool Works Inc. | Full foil face assemblies and methods for manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
-
1984
- 1984-07-10 JP JP59142922A patent/JPS6120728A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009109003A1 (en) * | 2008-03-03 | 2009-09-11 | Depco-Trh Pty Ltd | Heat reflective laminate |
CN103029305A (en) * | 2011-10-10 | 2013-04-10 | 汉达精密电子(昆山)有限公司 | Making method of carbon fiber housing |
CN103029306A (en) * | 2011-10-10 | 2013-04-10 | 汉达精密电子(昆山)有限公司 | Making method of carbon fiber housing |
CN107304008A (en) * | 2016-04-21 | 2017-10-31 | 住友化学株式会社 | The carrying method and device of resin film, the manufacture method of stacked film and device |
CN113194640A (en) * | 2021-04-28 | 2021-07-30 | 中国科学院微电子研究所 | Manufacturing method of low-warpage high-density packaging substrate |
CN113194640B (en) * | 2021-04-28 | 2022-07-08 | 中国科学院微电子研究所 | Manufacturing method of low-warpage high-density packaging substrate |
WO2023204999A1 (en) * | 2022-04-22 | 2023-10-26 | Illinois Tool Works Inc. | Full foil face assemblies and methods for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0463769B2 (en) | 1992-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4302501A (en) | Porous, heat resistant insulating substrates for use in printed circuit boards, printed circuit boards utilizing the same and method of manufacturing insulating substrates and printed circuit boards | |
JPS6120728A (en) | Preparation of laminate board | |
JPS5951912B2 (en) | Continuous manufacturing method and device for laminate | |
JP2889474B2 (en) | Composite laminate and method for producing the same | |
JPS6189032A (en) | Manufacture of laminate | |
JPS6040215A (en) | Preparation of prepreg | |
JPH0334677B2 (en) | ||
JPH048515A (en) | Manufacture of laminated plate | |
JPS59209829A (en) | Manufacture of laminate | |
JPS63285997A (en) | Method and device for manufacturing multi-layer substrate | |
JPH08290527A (en) | Continuous manufacture of laminated sheet | |
JPS61206647A (en) | Manufacture of laminated board | |
JPH0367618B2 (en) | ||
JPS59129491A (en) | Method of producing laminated board for printed circuit board | |
JPS6231513B2 (en) | ||
JPH02286333A (en) | Continuous manufacture of laminated sheet | |
JPH01136743A (en) | Manufacture of laminated plate | |
JPH0771839B2 (en) | Laminated board manufacturing method | |
JPS61176195A (en) | Manufacture of radiating electric insulation substrate | |
JPH04201311A (en) | Manufacture of laminated sheet | |
JPH01283988A (en) | High thermal conductivity board and manufacture thereof | |
JPS595004A (en) | Manufacture of flitch | |
JPH09201906A (en) | Manufacture of laminated sheet | |
JPH01136744A (en) | Manufacture of laminated plate | |
JPS6120743A (en) | Manufacture of laminated board |