JPS61199001U - - Google Patents
Info
- Publication number
- JPS61199001U JPS61199001U JP8287685U JP8287685U JPS61199001U JP S61199001 U JPS61199001 U JP S61199001U JP 8287685 U JP8287685 U JP 8287685U JP 8287685 U JP8287685 U JP 8287685U JP S61199001 U JPS61199001 U JP S61199001U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lands
- circuit board
- printed circuit
- component electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ないし第３図は本考案の一実施例を示す
図であり、第１図は電子部品がプリント基板に半
田付けされる状態を示す要部断面図、第２図およ
び第３図は電子部品を示す斜視図、第４図および
第５図は他の実施例を示す電子部品の斜視図であ
る。
１……電子部品、３……電子部品電極、４……
溝、５……突起、６……プリント基板、８……ラ
ンド、１０……接着剤、１２……溶融半田。
1 to 3 are diagrams showing one embodiment of the present invention, in which FIG. 1 is a sectional view of main parts showing a state in which electronic components are soldered to a printed circuit board, and FIGS. 2 and 3 are views showing an embodiment of the present invention. FIG. 4 and FIG. 5 are perspective views of electronic components showing other embodiments. 1...Electronic component, 3...Electronic component electrode, 4...
Groove, 5... Protrusion, 6... Printed circuit board, 8... Land, 10... Adhesive, 12... Molten solder.
Claims (1)
板に接着剤により仮固定してから当該ランドに半
田付けする電子部品において、プリント基板に接
着する面にその電子部品電極の近くに電子部品電
極に対応して、前記電子部品電極やランドへの接
着剤および半田の流動を防止する凹または凸型の
堰を形成したことを特徴とする電子部品。 In electronic components that are temporarily fixed with an adhesive to a printed circuit board on which conductor pattern lands are formed and then soldered to the lands, a surface that is to be adhered to the printed circuit board is provided near the electronic component electrodes corresponding to the electronic component electrodes. . An electronic component characterized in that a concave or convex weir is formed to prevent adhesive and solder from flowing to the electronic component electrodes and lands.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8287685U JPS61199001U (en) | 1985-05-31 | 1985-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8287685U JPS61199001U (en) | 1985-05-31 | 1985-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61199001U true JPS61199001U (en) | 1986-12-12 |
Family
ID=30630990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8287685U Pending JPS61199001U (en) | 1985-05-31 | 1985-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61199001U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10256432A (en) * | 1997-03-14 | 1998-09-25 | Nec Corp | Resin-sealing type semiconductor package |
| JP2001351802A (en) * | 2000-06-06 | 2001-12-21 | Rohm Co Ltd | Electronic parts |
| WO2021201290A1 (en) * | 2020-04-03 | 2021-10-07 | Ｄｏｗａエレクトロニクス株式会社 | Method for manufacturing optical semiconductor package, and optical semiconductor package |
-
1985
- 1985-05-31 JP JP8287685U patent/JPS61199001U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10256432A (en) * | 1997-03-14 | 1998-09-25 | Nec Corp | Resin-sealing type semiconductor package |
| JP2001351802A (en) * | 2000-06-06 | 2001-12-21 | Rohm Co Ltd | Electronic parts |
| WO2021201290A1 (en) * | 2020-04-03 | 2021-10-07 | Ｄｏｗａエレクトロニクス株式会社 | Method for manufacturing optical semiconductor package, and optical semiconductor package |
| JP2021163950A (en) * | 2020-04-03 | 2021-10-11 | Ｄｏｗａエレクトロニクス株式会社 | Method for manufacturing optical semiconductor package and optical semiconductor package |
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