JPS61180712U - - Google Patents
Info
- Publication number
- JPS61180712U JPS61180712U JP6347985U JP6347985U JPS61180712U JP S61180712 U JPS61180712 U JP S61180712U JP 6347985 U JP6347985 U JP 6347985U JP 6347985 U JP6347985 U JP 6347985U JP S61180712 U JPS61180712 U JP S61180712U
- Authority
- JP
- Japan
- Prior art keywords
- pot
- runner
- plunger
- protrusion
- runners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図及び第２図は本考案の実施例を示す各動
作状態での金型部分断面図、第３図は従来の樹脂
モールド装置にける金型の平面図、第４図は第３
図のＡ―Ａ線に沿う拡大断面図、第５図及び第６
図は第３図の金型による樹脂モールド装置の各動
作状態での部分断面図、第７図及び第８図は従来
の他の樹脂モールド装置の部分断面図である。
１０，１１…金型、１２…ポツト、１３…ラン
ナ、１４…ゲート、１５…キヤビテイ、１６…プ
ランジヤ、１７…樹脂タブレツト、ｃ…突起。
1 and 2 are partial sectional views of a mold in each operating state showing an embodiment of the present invention, FIG. 3 is a plan view of a mold in a conventional resin molding device, and FIG.
Enlarged sectional view along line A-A in the figure, Figures 5 and 6
The figures are partial sectional views of a resin molding device using the mold shown in FIG. 3 in various operating states, and FIGS. 7 and 8 are partial sectional views of other conventional resin molding devices. DESCRIPTION OF SYMBOLS 10, 11...Mold, 12...Pot, 13...Runner, 14...Gate, 15...Cavity, 16...Plunger, 17...Resin tablet, c...Protrusion.
Claims (1)
ポケツトと連通して複数のランナを形成すると共
にランナをゲートを介してキヤビテイに連通し、
ポツト内に供給した樹脂タブレツトをプランジヤ
ーにてランナに圧送する装置であつて、ポツトと
プランジヤー端面の対向面のいずれか一方に突部
を設けたものにおいて、上記突部はその周壁がラ
ンナ開口部と対向する部分ではポツト内周面から
離隔し、ランナ開口部間と対向する部分ではポツ
ト内周面と近接するように形成したことを特徴と
する樹脂モールド装置。 The abutting surfaces of the upper and lower molds communicate with pockets passing through one of the upper and lower molds to form a plurality of runners, and the runners are connected to the cavity via a gate,
A device for force-feeding resin tablets supplied into a pot to a runner using a plunger, in which a protrusion is provided on one of the facing surfaces of the pot and the end face of the plunger, and the protrusion has a circumferential wall that is connected to the runner opening. A resin molding device characterized in that a portion facing the runner opening is spaced apart from the inner peripheral surface of the pot, and a portion facing between the runner openings is formed close to the inner peripheral surface of the pot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985063479U JPH0246987Y2 (en) | 1985-04-27 | 1985-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985063479U JPH0246987Y2 (en) | 1985-04-27 | 1985-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61180712U true JPS61180712U (en) | 1986-11-11 |
| JPH0246987Y2 JPH0246987Y2 (en) | 1990-12-11 |
Family
ID=30593665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985063479U Expired JPH0246987Y2 (en) | 1985-04-27 | 1985-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246987Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07290491A (en) * | 1994-04-27 | 1995-11-07 | Nec Corp | Mold |
| JP2011104799A (en) * | 2009-11-13 | 2011-06-02 | Sekisui Plastics Co Ltd | Molding apparatus for foamed-molded article |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601834A (en) * | 1983-06-20 | 1985-01-08 | Toshiba Corp | Resin sealing device for semiconductor device |
-
1985
- 1985-04-27 JP JP1985063479U patent/JPH0246987Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601834A (en) * | 1983-06-20 | 1985-01-08 | Toshiba Corp | Resin sealing device for semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07290491A (en) * | 1994-04-27 | 1995-11-07 | Nec Corp | Mold |
| JP2011104799A (en) * | 2009-11-13 | 2011-06-02 | Sekisui Plastics Co Ltd | Molding apparatus for foamed-molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0246987Y2 (en) | 1990-12-11 |