JPS6113940U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6113940U JPS6113940U JP9902184U JP9902184U JPS6113940U JP S6113940 U JPS6113940 U JP S6113940U JP 9902184 U JP9902184 U JP 9902184U JP 9902184 U JP9902184 U JP 9902184U JP S6113940 U JPS6113940 U JP S6113940U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- heat sink
- semiconductor equipment
- abstract
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例の断面図、第２図および第３
図は本考案の他の実施例の断面図、第４図は従来の一例
の断面図である。
１・・・放熱板、３・・・ペレット、６・・・樹脂、訃
・・突出部。Figure 1 is a sectional view of one embodiment of the present invention, Figures 2 and 3 are
The figure is a sectional view of another embodiment of the present invention, and FIG. 4 is a sectional view of a conventional example. 1... Heat sink, 3... Pellet, 6... Resin, butt... Protruding part.
Claims (1)
と、を有し、この放熱板の他面が露出するように、放熱
板とベレットとが樹脂封止された半導体装置において、 ペレットを取り囲むように放熱板の一部が突出して設け
られていることを特徴とする半導体装置。[Claims for Utility Model Registration] It has a pellet and a heat sink to which the pellet is fixed to its entire surface, and the heat sink and the pellet are sealed with resin so that the other surface of the heat sink is exposed. 1. A semiconductor device characterized in that a part of a heat sink is provided to protrude so as to surround a pellet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9902184U JPS6113940U (en) | 1984-06-29 | 1984-06-29 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9902184U JPS6113940U (en) | 1984-06-29 | 1984-06-29 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6113940U true JPS6113940U (en) | 1986-01-27 |
Family
ID=30658537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9902184U Pending JPS6113940U (en) | 1984-06-29 | 1984-06-29 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6113940U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03293748A (en) * | 1990-04-11 | 1991-12-25 | Rohm Co Ltd | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51129177A (en) * | 1975-05-02 | 1976-11-10 | Mitsubishi Electric Corp | Resin hook type semi conductor device |
-
1984
- 1984-06-29 JP JP9902184U patent/JPS6113940U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51129177A (en) * | 1975-05-02 | 1976-11-10 | Mitsubishi Electric Corp | Resin hook type semi conductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03293748A (en) * | 1990-04-11 | 1991-12-25 | Rohm Co Ltd | Semiconductor device |
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