JPS61137214A - Wafer for thin film magnetic head - Google Patents

Abstract

PURPOSE:To reduce the bearing work of a thin film magnetic head sharply and to improve mass-productivity by adjacently arraying different patterns necessary for bearing to constitute a wafer for a thin film magnetic head. CONSTITUTION:In the wafer 6 for the thin film magnetic head, respective thin film head elements 2 are two-dimensionally and regularly arranged (20X25 elements in a 2-inch square) and the gap azimuth angles of respective elements are alternately changed in the positive and negative directions in each string. If it is supposed that the front direction of the drawing is a head sliding surface, the string of A1-An... is negative azimuth (-theta) elements and the string of B1-Bn... is positive azimuth (+theta) elements. The dispersion of head characteristics in the wafer substrate is extremely low between adjacent chips, so that efficient bearing can be automatically obtained by combining these adjacent chips.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a wafer for a thin film magnetic head on which a large number of core chips of a thin film magnetic head suitable for recording/reproducing in a video tape recorder or the like are formed. .

[Background of the invention]

In recent years, magnetic tape for video tape recorders.

Metal tape has been proposed. It's here again.

Sendust and Permalloy, which have a high saturation magnetic flux density, are suitable magnetic heads for metal tapes.

Alternatively, a magnetic thin film such as amorphous is used as the core material.

A thin film magnetic head has been proposed. An example.

Publication No. 43-15255, Japanese Unexamined Patent Publication No. Sho.

Publication No. 52-74322, JP 57-1411000
The structure and manufacturing method shown in Publication No. 8 will be described.A core made of the above-mentioned basic thin film and a nonmagnetic gear tube spacer crossing this are deposited on a continuous common nonmagnetic substrate, and the core is closed in the plane. magnetic surface.

It is formed by forming a road. 15 The feature of this head is that the track width is covered with a magnetic thin film.

Since it is controlled by the film thickness, the track is as narrow as 10 μm.

This enables mechanical bonding during gap formation.

Gap is formed by layering thin films.

This improves the gap dimension accuracy and improves the accuracy of the gap.

It can be formed into layers and is extremely suitable for mass production.　　　　.

Each core chip obtained in this way was wound with wire.

and a thin film magnetic head. Next is the thinness of the given specifications.

Combine the membrane polishing head and mount it on a rotating cylinder.

The combination differs depending on the required system.

For example, (1) Combinations of different azimuth angles (+ for VH8).

6° and -6°) azimuth recording system.　　.

(2) Combinations of different track widths (approximately 60 μm and approximately 20 μm
10μm) long-term recording system.

(3) Distance from cylinder surface to track section (hereinafter referred to as
· Tracking optimization system by different combinations of (referred to as lower track height).

etc. have already been put into practical use. In addition, as a 5th development in the future, (4) Obiha division by different combinations of gap lengths.

recording system.

(5) Spatulas with different combinations of gear and depth.

Adjustment of the electrical characteristics (sensitivity and inductance) of the board.

・　3　・ stem.

It can be considered to be multi-functional such as. To get rid of it.

If the Rad number is two or more, it has one term or more.

A system with functions is also possible. That again.

Two of these heads or their layers are integrated into a single chip structure with five chips, and each of them operates independently.

It is also possible to have multiple gaps. .

However, in both cases, the combination of heads.

The process of determining the bearing (hereinafter referred to as bearing work) had the following drawbacks. 10 In other words, in order to obtain a suitable image quality, each pairing head should be
The electrical properties and mechanical shapes must be the same or have a predetermined difference. Therefore, specifically, inductors.

+/- 5 inches for track width and head output values, track width, and head output values.

It must be set within ±1 μm at the rack position. .

However, the thickness and magnetism of the magnetic thin film within the wafer substrate.

Temperature is thin film formation such as vapor deposition and sputtering i□.

Due to the beam non-uniformity of the loading, conventional technology suppresses the variation within the above tolerance across the entire wafer.

・　4　・ is not easy. So in reality, the wafer money.

Electrical characteristics such as output and track width of the chip.

Inspect the mechanical shape and approximate characteristics of the head.

Bearing in mind. Many for this task.

It took a great deal of effort and time to offset the value of the thin-film five-layer magnetic head based on sea urchin flies.

was.

[Purpose of the invention]

The purpose of the present invention is to overcome the above-mentioned drawbacks of the prior art.

Instead, it is an object of the present invention to provide a wafer shape that greatly reduces the bearing work of a thin film magnetic head and improves mass productivity.

[Summary of the invention]

In the present invention, variations in head characteristics within a wafer substrate are extremely small between adjacent chips, and when these adjacent chips are combined, it is automatically improved.

We focused on the fact that it enables a good bearing. vinegar.

In other words, conventionally all the wafers had the same pattern.

In contrast, in the present invention, bare

We decided to create a wafer structure for thin-film magnetic heads in which the different patterns necessary for the ring are arranged closely.

It has characteristics.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings.

Ru. FIG. 1 shows a 5 evaporator for a thin film magnetic head according to the present invention.
This is a perspective view showing a large number of thin film head elements with different azimuth angles on a wafer-shaped non-magnetic substrate 1.

2 is formed. Each thin-film head element 2 includes a.

A magnetic thin film 3.3', which serves as a material, forms a closed magnetic path at a predetermined inclination angle (azimuth angle) with respect to the normal/linear direction of the non-magnetic substrate 1 via gaps 4, and a winding wire is formed in the center. It has a hole 5. A 2-inch square photosensitive glass is used as the non-magnetic substrate 1, and winding holes 5 are previously punched at predetermined positions by photo-etching.

Ta. The magnetic thin films 3 and 3' are formed by sputtering Sendust or Amo-5 Rufus alloy (Co-based).

The film was deposited to correspond to the desired track width (approximately 30 μm thick). Gi.

YAP 4 is a non-magnetic film such as 5iO1 with a thickness of 0.3 to 0.5 μm.
The thickness was formed by sputtering. Based on Gap 4.

This embodiment is a method of sandwiching the adhesive thin films 3 and 3'.

Now, one side with the position of gap 4 as the boundary.

A first magnetic thin film 3 is formed at the gap position.

A magnetic thin film 3 is formed along the line using a diamond tool.

The end face is mirror-cut to a specified azimuth angle.

A gap surface is obtained, and a non-magnetic film 5 is deposited on this surface, followed by a second magnetic thin film 3' on the remaining opposite side.

Embedded.

In the above-mentioned wafer 6 for thin film magnetic head, each domain.

The membrane head elements 2 are arranged in a regular two-dimensional arrangement (in the example, 20 x 25 elements in a 2-inch square wafer), and the gap azimuth angle of each of the 10 elements is switched between positive and negative in each row. be. That is, fig.

If the front direction is the head sliding surface, then Al + At
l...

The column is negative azimuth (-θ), and the columns R1, Bt... are positive.

It is an element consisting of azimuth (10). To obtain a thin film magnetic head from Unibaka, which takes 1°.

You can do it by following the steps below. First, the thin film magnetic head wafer 6 is divided along the dividing line 7 to obtain the connected chips 8 shown in FIG. 1(b). The connecting tip 8 is connected to a pair of thin films with adjacent positive and negative azimuth angles.

7. Contains rad elements 2a + 2b. Next is the dividing line.

The connecting chip 8 is divided along the line 9 and shown in FIG. 1(c).

A pair of thin film magnetic Herad chips 10a and 10b were obtained.

Ru. Next, as shown in FIG. 1(d), the sliding surfaces of these head tips and knobs are internally ground, and the windings 11 are applied to the winding holes 5 to obtain thin film foundation heads 12a and 12b. No.

1(e) shows these pair of thin film magnetic heads 12a, 1.
2b is attached to the rotating cylinder 13 at the 180 degree position to complete the pair ring.

In this embodiment, the 1° thin film magnetic heads 12a and 12b that will finally be assembled with bearings are thin film magnetic heads.

They are obtained from adjacent positions on the wafer 6 for use. .

The distance is about 1 to 2 fi, so sputtering.

There is no difference in film thickness or magnetic properties during the trough.

It was possible to automatically match the electrical characteristics such as the head 15 output and inductance, as well as the mechanical shape such as the width of the head.

Alternating the azimuth angle of the thin film head elements 2 on the thin film magnetic head wafer 6 row by row can be easily realized by switching the inclination direction of the cutting surface of the diamond cutting tool. In addition, the chip bearings are in the form of a connected chip 8, so the relationship is preserved until the final process, making work easier.

There is also less occurrence of dust.

FIG. 2 (Al is a perspective view showing another embodiment of the thin film magnetic head wafer 6 in which each element has a different azimuth angle.

It is a diagram. In the figure, they are arranged on a non-magnetic substrate 1.

The inclination of each formed thin film head element 2 gap 4.

The diagonal directions are all the same, but the position of the winding hole 5.

That is, the directions of the thin film head elements 2 are alternately reversed. In the drawing, the rows Al* A2... are towards the front, B1. The columns B2, . . . are arranged in the depth direction, and therefore the azimuth angle is alternately switched between positive and negative. Next, it is divided along the dividing line 7 to form a connecting chain as shown in FIG. 2(b).

It was set as Tsubu 8. This connecting chip 8 includes a pair of thin film head elements 2a and 2b on the positive and negative sides and a pair of 5 squares.

I'm here. Furthermore, by dividing this along the dividing line 9, a pair of positive and negative azimuth thin film magnetic heads can be bearing in the same manner as in the above embodiment. As can be seen from this example,
The element arrangement of the evaporator stopper for thin-film magnetic heads is in the left-right and front-rear directions.

Any deviation is possible and can be easily dealt with by changing the mask pattern etc. during thin film formation.

FIG. 3(a) shows the thickness of each element with different azimuth angles.

This is a perspective view showing another embodiment of a wafer 6 for a film magnetic head, and shows two independent gaps in one chip.

This is the case of a double gear type structure including a double gear. .

That is, the thin film head element 2' consists of three pieces of magnetic thin film.
, 5', 3', two gaps 4.4', and two winding holes 5.5'. The two gaps 4*4'+n each operate independently and are at an azimuth angle to each other in order to realize the special playback function of a video tape recorder.

are different combinations of positive and negative, and their positive and negative.

A pair of double gear-shaped thin film magnets in reverse order.

It is necessary to bear the air head. In addition, in the 5th figure 3, the AHe AH... row is gi when viewed from the sliding surface.

Yaps 4 and 4' are V-shaped, and Bt * 82... columns are convex.

Two types of thin film head elements 2' are arranged and formed alternately. Thereafter, it is divided as shown in FIGS. 12(b) to 2(d) to bear a pair of double-gap type thin film magnetic heads 11'a and 12'b. Furthermore, there are two or more pieces in one chip.

It is also possible to include independent gaps. .

JLh A pair of heads with different azimuth angles.

Although a ring has been described, the present invention is applicable to two rings.

It can also be applied to other systems that combine the number and type of heads.

The element arrangement shown in the embodiments of FIGS. 1 to 3 is as follows.

Connects adjacent chips in the left/right direction or front/back direction.

It memorized its bearing partner in the form of a chip.

This is the most reliable method. However, in reality, the variation in timing between 10 sea urchins is small even when they are adjacent to each other or further apart, and bearings between them often do not cause any practical problems. Therefore, the element arrangement is.

It is not necessarily subject to the constraints imposed by bearings.

You may change the order. For example, the above embodiment.

In this case, using that symbol, A1tA鵞eBt+Bt+
As.

...and A1, A2, A3* B1 * Bt * B
Arrangements such as 31... are also allowed.

Let's go. In this case, each chip shows a pair of bearings.

If you apply wasu markings, you will lose sight of the bearing partner.

There's nothing wrong with that. The above is explained in the following example □Example 11
The same applies to the case of . .

Figure 4 shows thin film magnets with different track widths for each element.

It is a perspective view showing the implementation of the sea urchin for the air head.

The film thickness of the magnetic thin film 3 is s A1 * A1... tA in the column,
B1+ "B wealth..." was set as je (for example, tA
-=6oμm, tB=3σμm). From this, □ Thin films with different track widths tA, f, and n.

Magnetic heads were obtained, and these were mounted. Switching the film thickness of the magnetic thin film 3 on a column-by-column basis can be achieved with high accuracy by mass-substrate or mask etching techniques. .

゛Figure 5 shows thin films with different track heights for each element.

A perspective view showing an example of a wafer 6 for a magnetic head.

be. In the figure, the magnetic thin film of each thin film head element 2 is shown.

The distance from the deposited ml of the film 3 to the bottom surface of the non-magnetic substrate 1, 5", is At,' At10. Wll't',-!
J.A., 81. Bs, Wl "Q g yo 48 yo 5, from this, thin film magnetism with different track heights JA and JLB.

□Get the heads and make these bearings. This place.

In this case, the upper surface of the non-magnetic substrate 1 is stepped.

Or, create a step by applying another non-magnetic material.

．． 12° Bye.

As yet another example, the gap between each element.

When the length is different and when the gap depth is different.

is possible (drawings omitted). Before you get this.

The first one can be easily realized by mask sputtering method for applying the gap material, and the latter five can be easily realized by changing the position of the winding hole.

Wear.

In the above embodiments, the azimuth angle of the head element.

Although we focused on a single parameter such as track width, the present invention is also applicable to the case of 10 multiple parameters that combine these parameters.゛.

Furthermore, another application of the present invention is to thin films.

To the electric film '#ffi with a different configuration of the magnetic circuit of the Radiation element.

There is an application to Rado Hatsueha. Namely, upper ayu.

The thin film head element in the example is on a non-magnetic substrate surface.

On the other hand, the gap planes are almost perpendicular, making it a magnetic thin film.

The magnetic circuit is arranged approximately parallel to the surface of the non-magnetic substrate. In contrast, the thin film head element 2' shown in FIG. The gap plane 4° is almost parallel to the non-magnetic substrate 1.
The magnetic circuit is non-magnetic.

It is made almost orthogonal to the sexual substrate 1. Not yet.

The thin film head element 2' shown in FIG. 7 includes a magnetic thin film 3. .

3' and 31, the gap plane 4 is substantially perpendicular to the non-magnetic substrate 15, and the magnetic circuit is also substantially perpendicular to the non-magnetic substrate 1.

This is what we exchanged. Any thin film head element.

2' is also placed on the wafer substrate according to the method of the present invention.

Rad shapes are arranged so that various parameters are different.

If so, exactly the same effect can be obtained regarding bearings10.

〔Effect of the invention〕

As described above, according to the present invention, in thin film magnetic heads manufactured in large numbers from wafers, the mechanical/curved shape and electrical characteristics are automatically well matched, and various 3. .

Head balance such as azimuth angle and track width.

It accommodates a set of thin-film magnetic heads consisting of a combination of

can be obtained easily. For this reason, it is traditionally indispensable.

100% inspection of head characteristics and bearing production.

This greatly reduces the work involved and facilitates the mass production of thin film magnetic herads.

It has a great effect in terms of

[Brief explanation of drawings]

FIG. 1(a) shows a thin film magnetic head according to the present invention. FIGS. 1(b) to 1(e) are perspective views showing one embodiment of Eva. Figures 4, 2 to 5 of the head bearing of the present invention
The figure shows a wafer for a thin film magnetic head according to the present invention. FIGS. 6 and 7 are perspective views showing other embodiments. Other shapes of thin film head elements are shown in the present invention. FIG. 1... Nonmagnetic substrate, 2... Thin film head element,
1. . 3.3'...magnetic thin film, 4...gap, 5...
... Winding hole, 6... Wafer for thin film magnetic envelope head, 11... Winding wire, 12... Thin film magnetic head. Figure 12, Figure 3, and Figure 1, Figure 5, Table of Contents, Figure 7, Procedural Amendment (Method), Table of Cases, 1987, Patent Application No. 257576, Name of the Invention, Wafer Correction for Thin Film Magnetic Heads. Relationship between cases Patent applicant name (510) i+Hitachi Co., Ltd.
Manufacturer's agent Drawing to be corrected (Fig. 1) Contents of correction As shown in the attached sheet

Claims (1)

[Claims] 1. A thin film in which a large number of thin film head elements each having a magnetic thin film as a core material and having at least one set of operating gaps and a winding portion are two-dimensionally arranged on a wafer-shaped non-magnetic substrate. 1. A wafer for a thin film magnetic head, characterized in that the shape parameters of the thin film head elements are made different for each row. 2. The shape parameters include the azimuth angle of the working gap, the track width, the distance from the predetermined surface of the non-magnetic substrate to one end of the track, the thickness of the non-magnetic material constituting the working gap, and the width of the working gap. The wafer for a thin film magnetic head according to claim 1, wherein the wafer has a depth of at least one of the depths up to the winding portion. 3. The working gap surface of the thin film head element is substantially orthogonal to the nonmagnetic substrate surface, and the magnetic circuit made of the magnetic thin film is disposed substantially parallel to the nonmagnetic substrate surface. A wafer for a thin film magnetic head according to item 1 or 2. 4. A patent claim characterized in that the working gap surface of the thin film head element is substantially parallel to the surface of the nonmagnetic substrate, and the magnetic circuit made of the magnetic thin film is disposed substantially perpendicular to the surface of the nonmagnetic substrate. A wafer for a thin film magnetic head according to the range 1 or 2. 5. A patent claim characterized in that the operating gap surface of the thin film head element is substantially perpendicular to the surface of the nonmagnetic substrate, and the magnetic circuit made of the magnetic thin film is disposed substantially perpendicular to the surface of the nonmagnetic substrate. A wafer for a thin film magnetic head according to the range 1 or 2.