JPS61100478A - Thermal recording head - Google Patents
Thermal recording headInfo
- Publication number
- JPS61100478A JPS61100478A JP59222013A JP22201384A JPS61100478A JP S61100478 A JPS61100478 A JP S61100478A JP 59222013 A JP59222013 A JP 59222013A JP 22201384 A JP22201384 A JP 22201384A JP S61100478 A JPS61100478 A JP S61100478A
- Authority
- JP
- Japan
- Prior art keywords
- common
- substrates
- substrate
- fitted
- recording head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 239000000919 ceramic Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010893 paper waste Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は感熱記録ヘッド、＊に発熱抵抗体および配線パ
ターンを形成するセラミックチップサイズを小形化する
ことにより、製品全体を小形、軽量にしてコストの低減
をはかることができる感熱記録ヘッドだ関するものであ
る。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention reduces the size of the ceramic chip that forms the heating resistor and wiring pattern in a thermal recording head, thereby making the entire product smaller and lighter, thereby reducing costs. This invention relates to a thermal recording head that can reduce the amount of heat generated.
従来、感熱記録ヘッドを小形で、かつ安価に製作する手
段としては、例えば特開昭５８−２９６８６号公報に記
載されているように１発熱抵抗体を記 体の進行方向の
基板上端部面に設けろと共に、配線パターンをすべて基
板台側に形成する手段が公知である。しかし、このよう
な手段では前記基板自体が小形化されていないため、所
期の目的を十分に達成することが困難である。Conventionally, as a means of manufacturing a thermal recording head in a small size and at low cost, one heating resistor is placed on the upper end surface of the substrate in the direction of movement of the recording medium, as described in, for example, Japanese Patent Laid-Open No. 58-29686. There is a known method for forming all the wiring patterns on the board stand side. However, with such means, it is difficult to sufficiently achieve the intended purpose because the substrate itself is not miniaturized.
本発明は上記の点にかんがみ、セラミック基板自体を小
形化してセラミックチップ取得数を増加させ、小形、軽
量で、かつ低コストの感熱記録ヘッドを提供することを
目的とするものであるっ
〔発明の概要〕
本発明は上記目的を達成するため１表面上に発熱抵抗体
とドライバーＩＣを、エツジ側にコモン電極をそれぞれ
装着した二枚の小形基板と。In view of the above points, it is an object of the present invention to reduce the size of the ceramic substrate itself, increase the number of ceramic chips obtained, and provide a small, lightweight, and low-cost thermal recording head. [Overview] In order to achieve the above object, the present invention includes two small substrates each having a heating resistor and a driver IC mounted on one surface and a common electrode mounted on the edge side.
この両基板が並置して装着されイ）ヒートシンクとから
なり、前記両コモン電極をコモンバーを介して接続した
ことを特徴とするものである。The device is characterized in that both of the substrates are mounted side by side and include (a) a heat sink, and both of the common electrodes are connected via a common bar.
以下１本発明の一実施例を図面について説明する。第１
図は本実施例（感熱記録ヘッド）の平面図であり、同図
の小サイズに形成されたセラミック基板ＩＡの表面上に
は６発熱抵抗体２人とドライバーＩＣ３Ａが装置されて
いる。他方の基板ＩＢも前記基板ＩＡと同様に構成され
ており、この側基板ＬＡ、１Ｂは並列にヒートン／り９
に装着されている。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a plan view of this embodiment (thermal recording head), and two 6-heating resistors and a driver IC 3A are arranged on the surface of a small-sized ceramic substrate IA shown in the figure. The other board IB is also constructed in the same way as the board IA, and this side board LA and 1B are connected in parallel with a heaton/receptor 9.
is installed on.
上記基板ＬＡ、ＩＢのエツジ側（上端部）には、側基板
ＩＡ、ＩＢの発熱抵抗体２Ａ、２ＢＫ接続するコモン電
極４Ａ、４Ｂがそれぞれ取付けられている。この両コモ
ン電極４人、４Ｂの一方側、すなわちコモン電極４Ａの
左端側とコモン電極４Ｂの右端側は、第２図に示すよう
Ｋ 長脚５Ａを有するコモンバー５により連結され。Common electrodes 4A and 4B are attached to the edge sides (upper ends) of the substrates LA and IB, respectively, to connect the heating resistors 2A and 2BK of the side substrates IA and IB. One side of these four common electrodes 4B, that is, the left end side of the common electrode 4A and the right end side of the common electrode 4B, are connected by a common bar 5 having long legs 5A as shown in FIG.
また前記電極４Ａ、４Ｂの他方側は、サイドパー６Ａ、
６Ｂを介してＦＰＣ７Ａ、７Ｂにそれぞれ連結されてい
る。前記コモンバー５の実装は第３図に示すように、そ
の基部５αをセラミックＬＡ。Further, the other side of the electrodes 4A, 4B is a side par 6A,
They are connected to FPCs 7A and 7B via 6B. As shown in FIG. 3, the common bar 5 is mounted with its base 5α made of ceramic LA.
ＩＢの接合部に接着剤（はんだ）８を介して結合すると
共に、長脚５ｈを折り曲げてヒートシンク９に設けた溝
９αに挿入するように構成されている。It is configured to be connected to the joint portion of the IB via an adhesive (solder) 8, and to be inserted into a groove 9α provided in the heat sink 9 by bending the long leg 5h.
本実施例は上記のようにコモンバー５により。In this embodiment, the common bar 5 is used as described above.
コモン電極４Ａ、４Ｂを介して基板ＩＡ、ＩＢを接続し
、この側基板ＩＡ、ＩＢにそれぞれ装着した発熱抵抗体
２Ａ、２Ｂに印加された電流が双方の基板ＩＡ、ＩＢの
コモン電極４Ａ、４Ｂの両者に流れるようにしたので、
コモン電極４Ａ。The substrates IA and IB are connected via common electrodes 4A and 4B, and the current applied to the heating resistors 2A and 2B attached to these side substrates IA and IB, respectively, is transferred to the common electrodes 4A and 4B of both substrates IA and IB. I made it flow in both directions, so
Common electrode 4A.
４Ｂのパターン幅を約１／２に縮小することができた。The pattern width of 4B could be reduced to about 1/2.
また、基板ＬＡ、ＩＢの接合部ては、常温ないし７０°
Ｃの熱膨張により０．１３ ａｍ程度のギャップカ生ス
るため、コモンバー５の基部５αのはんだ接続部８にせ
ん断力が作用する。そこで、コモンバー５の長脚５ｂを
十分に長くしてＥＩ値で約２６ｋｇｍ１ｔとすることに
より、その熱膨張および収縮による熱応力を十分に吸収
することができる。Also, the joint part of the boards LA and IB should be kept at room temperature or 70°C.
Since a gap of about 0.13 am is generated due to the thermal expansion of C, a shearing force acts on the solder connection portion 8 of the base portion 5α of the common bar 5. Therefore, by making the long legs 5b of the common bar 5 sufficiently long to have an EI value of about 26 kgmlt, the thermal stress caused by the thermal expansion and contraction can be sufficiently absorbed.
さらに、前記長脚５ｈをヒートシンク９の溝９αに挿入
するよ５したため、ハンドリングなどの外力が付加され
るのを阻止することがで六石。Furthermore, since the long legs 5h are inserted into the grooves 9α of the heat sink 9, external forces such as handling can be prevented from being applied.
一方、基板ＬＡ、ＩＢのエツジ側のコモン電極４Ａ、４
Ｂの幅により、むだ紙の量が大幅に左右されるため、小
サイズ基板ＩＡ、１Ｂの接合部のコモン［極４Ａ 、
４ Ｂヲコモンバー５により接続し、印画電流を両側に
分流させることにより、コモン電極４Ａ、４Ｂのパター
ンサイズを小さく形成することかで錠ろ。On the other hand, the common electrodes 4A, 4 on the edge side of the substrates LA, IB
Since the amount of waste paper is greatly affected by the width of B, the common [pole 4A,
4B is connected by the common bar 5, and the printing current is shunted to both sides, thereby forming the pattern size of the common electrodes 4A and 4B to be small.
以と説明したように１本発明によれば、セラミック基板
自体を小形化してセラミックチップ取得数を増加（約１
４％）させることにより、感熱記録ヘッドを小形、軽量
で、かつ安価に製作することができる。As explained above, according to the present invention, the ceramic substrate itself is miniaturized to increase the number of ceramic chips obtained (approximately 1
4%), the thermal recording head can be made small, lightweight, and inexpensive.
第１図は本発明の感熱記録ヘッドの一実施例を示す平面
図、第２図および第３図は第１図のコモンバーの平面図
およびコモンバー接続部の断面図である。
ＩＡ、ＩＢ・・・基板、 ２Ａ、２Ｂ・・発熱抵
抗体３Ａ、３Ｂ・・・ドライバーＩＣ
４Ａ、４Ｂ・・・コモンｔ％、５・・・コモンバー５ｂ
・・・長脚、 ９・・・ヒートシンク。
ど）＼
、二 １゜FIG. 1 is a plan view showing an embodiment of the thermal recording head of the present invention, and FIGS. 2 and 3 are a plan view of the common bar of FIG. 1 and a sectional view of the common bar connection portion. IA, IB... Board, 2A, 2B... Heating resistor 3A, 3B... Driver IC 4A, 4B... Common t%, 5... Common bar 5b
...Long legs, 9...Heat sink. d)\ , 2 1゜
Claims (1)
にコモン電極をそれぞれ装着した二枚の小形基板と、こ
の両基板が並置して装着されるヒートシンクとからなり
、前記両コモン電極をコモンバーを介して接続したこと
を特徴とする感熱記録ヘッド。 ２、上記コモンバーは、これに付加される熱疲労を吸収
するように構成したことを特徴とする特許請求の範囲第
１項記載の感熱記録ヘッド。[Scope of Claims] 1. Consists of two small substrates each having a heating resistor and a driver IC mounted on the surface thereof and a common electrode mounted on the edge side, and a heat sink to which these two boards are mounted side by side, A thermal recording head characterized in that both of the common electrodes are connected via a common bar. 2. The thermal recording head according to claim 1, wherein the common bar is configured to absorb thermal fatigue added to the common bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59222013A JPH0645248B2 (en) | 1984-10-24 | 1984-10-24 | Thermal recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59222013A JPH0645248B2 (en) | 1984-10-24 | 1984-10-24 | Thermal recording head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61100478A true JPS61100478A (en) | 1986-05-19 |
| JPH0645248B2 JPH0645248B2 (en) | 1994-06-15 |
Family
ID=16775740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59222013A Expired - Lifetime JPH0645248B2 (en) | 1984-10-24 | 1984-10-24 | Thermal recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0645248B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5741666U (en) * | 1980-08-20 | 1982-03-06 | ||
| JPS5769072A (en) * | 1980-10-17 | 1982-04-27 | Hitachi Ltd | Preparation of thermal print head |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5483157A (en) * | 1977-12-16 | 1979-07-03 | Matsushita Electric Ind Co Ltd | Air conditioner |
-
1984
- 1984-10-24 JP JP59222013A patent/JPH0645248B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5741666U (en) * | 1980-08-20 | 1982-03-06 | ||
| JPS5769072A (en) * | 1980-10-17 | 1982-04-27 | Hitachi Ltd | Preparation of thermal print head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0645248B2 (en) | 1994-06-15 |
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