JPS6099881A - Carrier for flat type ic package - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a carrier that is a housing for a flat IC package.

Conventional configurations and their problems In recent years, equipment has rapidly become smaller, and in order to respond to market needs such as ultra-Y, rectangular, and ultra-miniaturization, electronic component mounting fields have also become denser. I'm here.

Along with this, even in flat IC packages,
J: Flat IC packages with thinner lead wires or lead wires with a narrower pitch are increasingly being used. As a result, manual attachment becomes troublesome and reduces the reliability of attachment.1. It is also becoming difficult to meet demands in terms of reliability. For this purpose, flat type I is used as a carrier for flat type IC packages.
A type j'', I!4, which can stably hold the C pan cage and is suitable for automation, is desired.

Traditional Fujino!・As shown in FIG. 1, the carrier for the IC card cage uses the protrusion 3 for positioning the IC card 1, and separates it from the upper surface of the side plate of the tray 4. A tray 4 has been proposed in which the leading end 6 of the tray 4 is slightly protruded into the ICC storage chamber.

One tray 4 is prepared for 91 flat IC packages, and when the flat IC package 9 is stored in the storage chamber 7, the tip 6 of the protrusion 3 is connected to the flat IC package 9.
It is pushed down by the bottom of the C package 9 and curved downward while being fitted into the chamber and torn. At the position where the layer fitting is completed, the tip 6 is restored to three sides, forming a flat IC.
Lock the surface to the pan cage e-. In this way, the flat IC package 9 is prevented from falling off in the direction of opening 1'' of the upper surface of the tray 4.

However, with the above configuration, 15.1 trays 4
One flat IC package 9 cannot be stored in the
The management of the flat IC package 9 becomes complicated, and the soil used to form the protrusion 3 and the tip 6 must be provided, resulting in a complicated shape and high molding cost. Furthermore, the storage of the flat IC package 9 in the tray 4,
However, it is difficult to take out the tray 4, which makes automation difficult.

OBJECTS OF THE INVENTION In view of the above-mentioned drawbacks, the present invention provides a flat IC package that can be easily stored and taken out, and at the same time, the storage form is positioned and can be stored stably. , and provides a complete range of carriers suitable for automation.

Departure I,! A plurality of grooves for storing flat IC packages in a linear direction at predetermined intervals; and protrusions located within the grooves and having inclined surfaces at predetermined angles at predetermined positions in four directions; , a tray portion having arrow portions provided at predetermined intervals on a wall surface of the four long strips in the longitudinal direction formed by the plurality of grooved portions; and a cylindrical cover movably surrounding the tray portion. With this, it is possible to supply flat-shaped IC packages with their positions adjusted using a tray section with a simple structure, and it is also easy to remove flat-type IC packages from the tray section by 1+y, making it easy to automate. It has the unique effect of making it easier.

DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will now be described with reference to FIGS. 2 to 4. The flat IC package 1o is composed of a flat insulating plate 11 containing an IC, and I/CIJ- wires 2 projecting horizontally from the side 111 of the flat insulating plate 11. On the other hand, as shown in the figure, the carrier 12 that stores the IC storage chambers 8 is composed of a flat tray 5 having IC storage chambers 8 at regular intervals in the center and a cover 13 for the tray 5. 5J cutout 1 for tray 5 drawer on the top of the side wall in the center
4. 2) Insert the flat type IC package into the IC storage chamber 8 from above and store the ICIJ-cord wires 2 in almost contact with the inner walls 15 in the four directions to adjust the position, thereby forming each flat type IC package. This is a configuration for positioning.

Further, the present invention utilizes the cover 13 as a means for preventing the flat-type IC vanocouge 10 from falling out of the upper open portion of the IC storage chamber 8.

As shown in the embodiment of FIG. 3, a flat IC is mounted on the tray 5.
When the package 10 is stored, due to the slope of the four inner walls 15 of the component storage chamber 8, the flat IC pancake comes into contact with the bottom surface 1 of the storage chamber, and when the storage is completed, the four directions are regulated to side 1σ and the position IP1 It becomes a determined state. Furthermore, by fitting the cover 13 into the tray 5, the housed flat IC package 1o is prevented from leaving the upper opening of the positioned JL/storage chamber 8.

On the other hand, when taking out the flat IC package 1o,
As shown in FIG. 4, first, with the cover 13 fixed, press one end of the tray 5 that is not covered by the cover 13 so that the notch 14 on the upper surface of the side wall of the tray 5 comes out from the cover 13. Next, the claw 1 provided at the tip of the automatic ejecting mechanism 17 is inserted into the notch 14 on the upper surface of the side wall of the tray 5.
8 and in this state, by moving the claw 18 by one pinch, the flat IC package 10 is automatically removed from the cover 13. Repeat this operation sequentially for 9Hb, t
- The flat IC packages 10 can be pulled out from the cover 13 one after another without any hassle.

As described above, the present invention has IC storage chambers 8 and notches 14 at regular intervals, and by simply fitting the cover 13, it becomes a means for storing a flat IC package and preventing it from falling out. The means for taking out the IC package 10 'Jf11] can be simply constructed, and the structure can be extremely simple without requiring any other modifications or additions. Furthermore, flat carving C package storage room 8
Due to the slope of the four side walls, it can be suitably used for positioning a flat IC package.

Note that in this embodiment, the fusit-type IC package 1
o has Riet lines in four directions, one shape is the moon, and
A shape having lead wires in two directions may also be used.

Unfortunately, in this example, the storage form of the flannel type IC package is as shown in Figure 6, where the lead wire 2 ends ψ; As shown in Figure 6 and Figure 7, inside the lead wire corner 1111119 rl'
Alternatively, the peripheral direction of the flat IC package body 11 may be regulated.

Effects of the Invention As described above, the present invention provides for
By providing a tray section in which a convex section with inclined surfaces in four directions is formed among a plurality of four strip sections for storing packages, and a 1r ( )-shaped cover of the tray section that is slidable on the tray section, a flat It makes it easy to store and take out IC packages into and out of the tray, making it easy to use as a parts supply unit for automation, and the tray allows for easy storage and removal of IC packages from the tray.・The position of the IC package can be adjusted with a simple method, and after being stored in the flat IC back tray, the parts are stored inside the cylindrical cover. Therefore, it is possible to prevent parts from being damaged or falling off, and the effect is remarkable.

[Brief explanation of the drawing]

Figure 1 r1, perspective view of fusible IC package, Figure 2 I: 1. Figure 3 is a perspective view of the carrier of the nosit-shaped C package in the first embodiment of the present invention (with the horn bar removed). Fig. 4 is a perspective view of the 7-lat type IC package used in the same embodiment, and Fig. 5 is a concept of an automatic ejecting mechanism for taking out components from the carrier of the 7-lat type IC package in the same embodiment. Figure 6 shows the flat type IC shown in Figure 3.
FIG. 7 is a perspective view showing a conceptual diagram of the operation of taking out the tray in FIG. 6 using the automatic take-out mechanism. FIG. 8 is a sectional view of the tray in this embodiment. Fig. 9 is a cross-sectional view of the tray in the second embodiment showing the case where the method of regulating the flat and throat-shaped IC package is changed, and Fig. 1J510 is a sectional view of the tray in the third embodiment when the method of regulating the groove-shaped IC package is also changed. FIG. 2-...IJ-to wire, 5...Tray, 8...
・Storage chamber, 10...Flat type IC package,
13...-horn bar, 14...notch, 15...
... Inner h near y side, 17-... automatic ejecting mechanism. Name of agent: Patent attorney Toshio Nakao and 1 other person
11゛4 Figure 2 Figure 3 Figure 5 Figure 4 Figure 5 456 Figure 9 Figure 10

Claims (1)

[Claims] A tray part having a plurality of four parts for storing a flat IC package in each recess for a predetermined distance in the manual direction; a cylindrical cover slidably surrounding the tray part; A mechanical feeding retaining part provided on the predetermined 1+il IR, and a convex part having a predetermined angle of extrusion i, li old 10'52 at predetermined positions in each of the four directions inside the four parts. A flat IC package carrier with a distinctive feature.