JPS6088369A - Thermal shock testing apparatus - Google Patents

Abstract

PURPOSE:To allow a test chamber to reach the temp. of a cooling test condition within a short time with reduced freezing capacity, by injecting a coolant into the test chamber directly before a cooling test to cool the interior of the test chamber and, thereafter, recirculating cold air into the test chamber from a cryogenic chamber. CONSTITUTION:Liquefied carbon dioxide is injected into a test chamber 1 from a jet nozzle 16 directly prior to a cooling test to cool the test chamber to a temp. near to a cooling test temp. Subsequently, a solenoid valve 17 is closed and injection is stopped while dampers 10, 11 are opened and cold air of a cryogenic chamber 2 is recirculated into the test chamber 1 by a blower 5. Because a laboratory is precooled to a temp. near to the cooling test temp., the temp. of the test chamber 1 reaches the cooling test temp. within a short time even if the freezing capacity of the cryogenic chamber is small.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a thermal shock test device that alternately circulates cold air and hot air in a test chamber to cool and heat a test object such as a semiconductor. In particular, the present invention relates to a structure that can change a high temperature state in a test chamber to a low temperature state in a short time using a small freezing volume.

[Background of the Invention] In the thermal shock test equipment in this building, repeated tests on the tested products are carried out by changing the temperature of the test chamber from low temperature to room temperature to high temperature, and the temperature in the test room at low temperatures is -b5. °C, the test chamber at high temperature is maintained at 150'C.

Incidentally, recently there has been a trend to complete thermal shock tests on test items in a short time, and for this purpose it is necessary to change the high temperature test chamber to a low temperature state in a short time.

Conventional thermal shock testing equipment has two methods: (1) using a large-capacity refrigerator; (2) sending cold air cooled by the refrigerator in a low-temperature room to the test chamber; A method of injecting a coolant such as liquefied carbon dioxide gas is used to return to the cooling test conditions in a short time.

However, the former method not only increases the size of the test apparatus as a whole, requiring a larger installation space, but also has the problem of increasing power consumption.

In addition, in the latter method, liquefied carbon dioxide gas is -56'c
Since it has the property of becoming a gas and losing its cooling power in the vicinity, when it is injected into a cold room, it warms the cold air (generally -70 to -75'C) that has been cooled in the cold room. Moreover, if the air is injected into a test chamber, the cold air in the test chamber will be warmed, which means that the inside of the test chamber will not be kept at the temperature required for the cooling test.

[Purpose of the invention]

An object of the present invention is to provide a thermal shock test device that can change the cooling test temperature of a test chamber to a false one in a short time with a small division capacity by effectively utilizing a coolant such as liquefied carbon dioxide gas. It is in.

[Summary of the invention]

In order to achieve this objective, the thermal shock test apparatus of the present invention is provided with a device that injects a coolant such as liquefied carbon dioxide into the test chamber, and immediately before the cooling test in the cold and hot repetition test, the coolant is injected from the device. It is characterized in that the test chamber is injected into the test chamber to cool the inside of the test chamber, and then the cold air from the low-temperature chamber is circulated into the test chamber.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a partially sectional plan view of a thermal shock test apparatus according to the present invention, and FIG. 2 is a partially sectional front view thereof. A cold room 2 is arranged behind the test chamber 1, and a cooler 3, a heater 4, and a blower 5 for blowing cold air to the test chamber III are provided in the cold room 2. Also, test room 1
A high-temperature chamber is provided at the bottom of the chamber, and within this high-temperature chamber 6 are provided a heater 7, a heat storage tank 8, and a blower 9 for supplying hot air to the test chamber 1.

The cold air to the test chamber 1 circulates as shown by the solid arrow, that is, the cold air cooled by the cooler 3 is sent to the damper 1υ by the blower 5.
After passing through the test chamber 1 and passing through the test ¥1, the damper 11 is oiled and returned to the low temperature chamber 2. When the cold air supply signal to the test chamber 1 is not output, the damper 10 and the damper 11 are closed, and the cold air is circulated in the cold room 2 in an agitated state by the blower 5, so that the temperature is lower than the cooling test temperature. keep it.

In addition, hot air to the test chamber 1 is prepared as shown by the broken line arrow, that is, the hot air heated by the heat of the heating tank 67 and the heat storage tank 8 is sent into the test chamber 1 through the damper 12 by the blower 9. After passing through the test chamber 1, the hot air passes through the damper 13 and returns to the high temperature chamber 6. At seven times when the hot air supply signal to the test chamber 1 is not output, the damper 12 and the damper 13 are closed.
The hot air is circulated in the greenhouse 6 in an agitated state by the blower 9.

Also, the room temperature rush into test room 1 flows as shown by the thick arrow.
In other words, room temperature air is sucked in by a blower (both not shown) through the suction port on the ceiling of the apparatus, bends around the damper 14, and is blown into the test room 1, and after passing through the test room 1, the damper 15 and sent to the upper part of the device. 1, damper 1 when the supply signal of room temperature rush to test chamber 1 is not output.
4 and damper 15 are closed.

On the other hand, a ti injection nozzle 1b is provided on the population side of the test chamber 1, and this injection nozzle 16 is connected to a pipe 18 having a solenoid valve 17.
It is connected to the liquefied carbon dioxide gas cylinder/vessel 19 via the liquefied carbon dioxide gas tank 19, so that liquefied carbon dioxide gas can be injected into the WJS laboratory 1. Then, the opening and closing of the electromagnetic valve 17 is controlled so that the injection of liquefied kMM2O into the test chamber 1 is performed immediately before the cooling test in the cold and hot repeat test. In addition, 2 in the figure
0 indicates the door to the test room.

Next, the operation when performing a thermal shock test on a semiconductor using the thermal shock test apparatus according to the present invention will be explained. FIG. 3 shows the relationship between temperature changes in the test chamber 1, the low temperature chamber 2, and the high temperature chamber 6 and time. A semiconductor to be tested is placed in test chamber 1. At this time, the cooling test temperature (-1i5'c) inside the cold room 2
The temperature inside the high-temperature chamber is maintained at a temperature (180'c) lower than the heating test temperature (+!l) U'c). Next, when the cold room 2 reaches a predetermined temperature (-75), the test is started, a cooling test, a room temperature test, a heating test are carried out, and the room temperature test is performed again. Then, from a certain time (X) before the end of this tail temperature test (test time T), liquefied carbon dioxide is discharged from the injection nozzle 16.
Inject gas into the test chamber 1 to cool the inside of the test chamber 1 to near the cooling test temperature. Next, cold air from the low-temperature chamber 2 is sent into the test chamber 1 to begin a cooling test.

Therefore, in the present invention, immediately before the cooling test, ? Since the liquefied carbon dioxide sludge can be used to cool the specimen near the cooling test temperature, the refrigeration capacity in the low-temperature silkworm 2 is small and the temperature can be changed to the entire cooling test temperature in the test chamber i.

〔Effect of the invention〕

As explained above, according to the present invention, the test chamber can be cooled to the temperature and pressure under the test conditions in a short period of time with a reasonable refrigeration capacity. As a result, the consumption of liquefied carbon dioxide is small, and a small cold stock machine can be used, so the entire test equipment becomes a compact VC, which does not require a small installation space, and the consumption ratio is also low. It also requires less dexterity.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional plan view of the thermal shock test device according to the 4-invention, and FIG. 2 is an IE side view of the same partially sectional view.
Figure 3 is a diagram showing the relationship between each temperature change and time for test room, low temperature (greenhouse), and hot water temperature. 1... Test room 2... Low temperature plan 6... Still greenhouse 16
... Injection nozzle 19 ... Liquefied carbon dioxide gas cylinder l
゛Representative Patent Attorney Akio Takahashi (, 1 ＼ 11-9 Engraving of drawings (no changes in ``3'') Fig. 3 □ Face + 17 1981 ``41r Application No. 195972 Name of Chinese Invention Thermal Shock Testing Apparatus Oil Person who stops: I'L, LJ+1lulA Patent applicant and partner ・
SL 111 Hayashi Shikichi JL: IJ Standing Manufacturer Folding Agent Subject of personal correction Contents of drawing corrections Corrections will be made as shown in attached Figure 3.

Claims (1)

[Claims] A cooling and cooling system that is equipped with a test chamber, a low temperature chamber, and a high temperature chamber, and performs cold and hot reversal tests on test items such as semiconductors by alternately blowing cold air from the low temperature chamber and hot air from the high temperature chamber into the test chamber. This is an impact testing device, which is equipped with a device that injects a coolant such as liquefied carbon dioxide into the test chamber, and immediately before the cooling test in the cold/heat cycle test, the coolant is injected into the test chamber from the device and the inside of the test chamber is injected. Thermal shock test device that measures cooling.