JPS6088605U - Microwave integrated circuit device mounting parts - Google Patents
Microwave integrated circuit device mounting partsInfo
- Publication number
- JPS6088605U JPS6088605U JP18118383U JP18118383U JPS6088605U JP S6088605 U JPS6088605 U JP S6088605U JP 18118383 U JP18118383 U JP 18118383U JP 18118383 U JP18118383 U JP 18118383U JP S6088605 U JPS6088605 U JP S6088605U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- microwave integrated
- device mounting
- mounting parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Waveguides (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図A、 Bは、従来の実施例でAは平面図、゛
Bは正面断面図、第2図A、 Bは第2の実施例でAは
正面断面図、Bは側面断面図、第3図A、 Bは第2の
実施例でAは正面断面図、Bは側面断面図、第4図A、
Bは第3の実施例でAは正面断面図、Bは側面断面図
。
図において、1・・・・・・MIC,2・・・・・・抑
え板、3・・・・・・基板、4・・・・・・ケース、5
・・・・・・ネジ、6・・曲フタ、10・・・・・・取
付部品、11・・・・・・MIC,12・・・・・・基
板、13・・・・・・取付部品、14・・・・・・取付
部品、15・・・・・・取付部品、16・・・・・・取
付部品、17・・曲ケース。1A and 1B are conventional embodiments, A is a plan view,
B is a front sectional view, FIG. 2 A is a second embodiment, A is a front sectional view, B is a side sectional view, FIG. B is a side sectional view, Fig. 4A,
B is a third embodiment, A is a front sectional view, and B is a side sectional view. In the figure, 1... MIC, 2... Holding plate, 3... Board, 4... Case, 5
...Screw, 6...Curved lid, 10...Mounting parts, 11...MIC, 12...Board, 13...Mounting Parts, 14... Mounting parts, 15... Mounting parts, 16... Mounting parts, 17... Curved case.
Claims (1)
基板の半田面側に高周波特性及び温度特性が優れた絶縁
材を用いた固定具を具備したことを特徴とするマイクロ
波集積回路装置取付部品。A microwave integrated circuit device mounting part for mounting the microwave integrated circuit device on a board, characterized in that a fixing tool made of an insulating material with excellent high frequency characteristics and temperature characteristics is provided on the solder side of the board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18118383U JPS6088605U (en) | 1983-11-24 | 1983-11-24 | Microwave integrated circuit device mounting parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18118383U JPS6088605U (en) | 1983-11-24 | 1983-11-24 | Microwave integrated circuit device mounting parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6088605U true JPS6088605U (en) | 1985-06-18 |
Family
ID=30392669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18118383U Pending JPS6088605U (en) | 1983-11-24 | 1983-11-24 | Microwave integrated circuit device mounting parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6088605U (en) |
-
1983
- 1983-11-24 JP JP18118383U patent/JPS6088605U/en active Pending
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