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JPS6088574U - Chip carrier type package connection structure - Google Patents

Chip carrier type package connection structure

Info

Publication number
JPS6088574U
JPS6088574U JP18012083U JP18012083U JPS6088574U JP S6088574 U JPS6088574 U JP S6088574U JP 18012083 U JP18012083 U JP 18012083U JP 18012083 U JP18012083 U JP 18012083U JP S6088574 U JPS6088574 U JP S6088574U
Authority
JP
Japan
Prior art keywords
chip carrier
carrier type
type package
connection structure
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18012083U
Other languages
Japanese (ja)
Other versions
JPH0220847Y2 (en
Inventor
愼二郎 梅津
吉澤 重雄
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP18012083U priority Critical patent/JPS6088574U/en
Publication of JPS6088574U publication Critical patent/JPS6088574U/en
Application granted granted Critical
Publication of JPH0220847Y2 publication Critical patent/JPH0220847Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図はそれぞれ従来のチップキャリア型
パッケージの実装例を示した図、第3図は本考案が適用
される選択呼出受信機のブロック構成図、第4図〜第6
図はそれぞれ本考案によるチップキャリア型パッケージ
接続構造の一実施例を分解図、断面図、平面図で示し、
第7図、第8図はそれぞれ本考案による第2の実施例を
分解図、断面図で示し、第9図は本考案の第3の実施例
をパッケージ兼ソケットについて斜視図を示す。 1・・・チップキャリア型パッケージ、2・・・印刷配
  、線板、3・・・電極、4・・・印刷配線板の導体
部、5・・・接合半田、6・・・ソケット、7・・・接
触片、201・・・パッケージ兼ソケット、202・・
・電極、203゜203′・・・導電コネクタ、205
・・・電極端子、206・・・押え板、207・・・ボ
ンディングワイヤ、208・・・ICチップ、209・
・・絶縁板、301・・・固定カバー。 第6図−2 占=−−−−ゴ4田 ぐン〜
1 and 2 are diagrams each showing an example of mounting a conventional chip carrier type package, FIG. 3 is a block configuration diagram of a selective call receiver to which the present invention is applied, and FIGS. 4 to 6
The figures show an exploded view, a cross-sectional view, and a plan view of an embodiment of the chip carrier type package connection structure according to the present invention, respectively.
7 and 8 respectively show a second embodiment of the present invention in an exploded view and a sectional view, and FIG. 9 shows a third embodiment of the present invention in a perspective view of a package/socket. DESCRIPTION OF SYMBOLS 1... Chip carrier type package, 2... Printed wiring, wire board, 3... Electrode, 4... Conductor part of printed wiring board, 5... Joining solder, 6... Socket, 7 ...Contact piece, 201...Package and socket, 202...
・Electrode, 203゜203'...Conductive connector, 205
...electrode terminal, 206...pressing plate, 207...bonding wire, 208...IC chip, 209...
...Insulating plate, 301...Fixed cover. Figure 6-2 Fortune-telling =---Go 4 Tagun~

Claims (1)

【実用新案登録請求の範囲】 1 チップキャリア型パッケージに封止された第1の回
路を集積化された第2の回路に電気的番、こ接続する構
造において、前記第2の回路を封止するパッケージの一
面に前記チップキャリア型パッケージの収納部を設け、
該収納部に前記チップキャリア型パッケージの第1の電
極に対応させた第2の電極を設け、前記第1の電極と前
記第2の電極の間に導電性コネクタを介在させ、前記チ
ップキャリア型パッケージと前記封止パッケージとを保
持手段により圧接状態にて保持して成るチップキャリア
型パッケージ接続構造。 2 実用新案登録請求の範囲第1項記載のチップキャリ
ア型パッケージ接続構造において、前記第2の回路に接
続される第3の回路と前記第2の回路を印刷配線板に実
装することを特徴とするチップキャリア型パッケージ接
続構造。
[Claims for Utility Model Registration] 1. In a structure in which a first circuit sealed in a chip carrier type package is electrically connected to an integrated second circuit, the second circuit is sealed. A storage section for the chip carrier type package is provided on one side of the package,
A second electrode corresponding to the first electrode of the chip carrier type package is provided in the storage part, a conductive connector is interposed between the first electrode and the second electrode, and the chip carrier type package is provided with a second electrode corresponding to the first electrode of the chip carrier type package. A chip carrier type package connection structure comprising a package and the sealed package held in pressure contact by a holding means. 2 Utility Model Registration The chip carrier type package connection structure according to claim 1, characterized in that a third circuit connected to the second circuit and the second circuit are mounted on a printed wiring board. Chip carrier type package connection structure.
JP18012083U 1983-11-24 1983-11-24 Chip carrier type package connection structure Granted JPS6088574U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18012083U JPS6088574U (en) 1983-11-24 1983-11-24 Chip carrier type package connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18012083U JPS6088574U (en) 1983-11-24 1983-11-24 Chip carrier type package connection structure

Publications (2)

Publication Number Publication Date
JPS6088574U true JPS6088574U (en) 1985-06-18
JPH0220847Y2 JPH0220847Y2 (en) 1990-06-06

Family

ID=30390633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18012083U Granted JPS6088574U (en) 1983-11-24 1983-11-24 Chip carrier type package connection structure

Country Status (1)

Country Link
JP (1) JPS6088574U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005044967A (en) * 2003-07-28 2005-02-17 Hitachi Cable Ltd Electric circuit element with optical component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4814961U (en) * 1971-06-30 1973-02-20
JPS6022348A (en) * 1983-07-18 1985-02-04 Rohm Co Ltd Semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH419186A (en) * 1965-03-05 1966-08-31 Escher Wyss Ag Rotor for a centrifugal machine, in particular a steam or gas turbine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4814961U (en) * 1971-06-30 1973-02-20
JPS6022348A (en) * 1983-07-18 1985-02-04 Rohm Co Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005044967A (en) * 2003-07-28 2005-02-17 Hitachi Cable Ltd Electric circuit element with optical component

Also Published As

Publication number Publication date
JPH0220847Y2 (en) 1990-06-06

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