JPS6088574U - Chip carrier type package connection structure - Google Patents
Chip carrier type package connection structureInfo
- Publication number
- JPS6088574U JPS6088574U JP18012083U JP18012083U JPS6088574U JP S6088574 U JPS6088574 U JP S6088574U JP 18012083 U JP18012083 U JP 18012083U JP 18012083 U JP18012083 U JP 18012083U JP S6088574 U JPS6088574 U JP S6088574U
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- carrier type
- type package
- connection structure
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connecting Device With Holders (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図および第2図はそれぞれ従来のチップキャリア型
パッケージの実装例を示した図、第3図は本考案が適用
される選択呼出受信機のブロック構成図、第4図〜第6
図はそれぞれ本考案によるチップキャリア型パッケージ
接続構造の一実施例を分解図、断面図、平面図で示し、
第7図、第8図はそれぞれ本考案による第2の実施例を
分解図、断面図で示し、第9図は本考案の第3の実施例
をパッケージ兼ソケットについて斜視図を示す。
1・・・チップキャリア型パッケージ、2・・・印刷配
、線板、3・・・電極、4・・・印刷配線板の導体
部、5・・・接合半田、6・・・ソケット、7・・・接
触片、201・・・パッケージ兼ソケット、202・・
・電極、203゜203′・・・導電コネクタ、205
・・・電極端子、206・・・押え板、207・・・ボ
ンディングワイヤ、208・・・ICチップ、209・
・・絶縁板、301・・・固定カバー。
第6図−2
占=−−−−ゴ4田
ぐン〜1 and 2 are diagrams each showing an example of mounting a conventional chip carrier type package, FIG. 3 is a block configuration diagram of a selective call receiver to which the present invention is applied, and FIGS. 4 to 6
The figures show an exploded view, a cross-sectional view, and a plan view of an embodiment of the chip carrier type package connection structure according to the present invention, respectively.
7 and 8 respectively show a second embodiment of the present invention in an exploded view and a sectional view, and FIG. 9 shows a third embodiment of the present invention in a perspective view of a package/socket. DESCRIPTION OF SYMBOLS 1... Chip carrier type package, 2... Printed wiring, wire board, 3... Electrode, 4... Conductor part of printed wiring board, 5... Joining solder, 6... Socket, 7 ...Contact piece, 201...Package and socket, 202...
・Electrode, 203゜203'...Conductive connector, 205
...electrode terminal, 206...pressing plate, 207...bonding wire, 208...IC chip, 209...
...Insulating plate, 301...Fixed cover. Figure 6-2 Fortune-telling =---Go 4 Tagun~
Claims (1)
路を集積化された第2の回路に電気的番、こ接続する構
造において、前記第2の回路を封止するパッケージの一
面に前記チップキャリア型パッケージの収納部を設け、
該収納部に前記チップキャリア型パッケージの第1の電
極に対応させた第2の電極を設け、前記第1の電極と前
記第2の電極の間に導電性コネクタを介在させ、前記チ
ップキャリア型パッケージと前記封止パッケージとを保
持手段により圧接状態にて保持して成るチップキャリア
型パッケージ接続構造。 2 実用新案登録請求の範囲第1項記載のチップキャリ
ア型パッケージ接続構造において、前記第2の回路に接
続される第3の回路と前記第2の回路を印刷配線板に実
装することを特徴とするチップキャリア型パッケージ接
続構造。[Claims for Utility Model Registration] 1. In a structure in which a first circuit sealed in a chip carrier type package is electrically connected to an integrated second circuit, the second circuit is sealed. A storage section for the chip carrier type package is provided on one side of the package,
A second electrode corresponding to the first electrode of the chip carrier type package is provided in the storage part, a conductive connector is interposed between the first electrode and the second electrode, and the chip carrier type package is provided with a second electrode corresponding to the first electrode of the chip carrier type package. A chip carrier type package connection structure comprising a package and the sealed package held in pressure contact by a holding means. 2 Utility Model Registration The chip carrier type package connection structure according to claim 1, characterized in that a third circuit connected to the second circuit and the second circuit are mounted on a printed wiring board. Chip carrier type package connection structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18012083U JPS6088574U (en) | 1983-11-24 | 1983-11-24 | Chip carrier type package connection structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18012083U JPS6088574U (en) | 1983-11-24 | 1983-11-24 | Chip carrier type package connection structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6088574U true JPS6088574U (en) | 1985-06-18 |
JPH0220847Y2 JPH0220847Y2 (en) | 1990-06-06 |
Family
ID=30390633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18012083U Granted JPS6088574U (en) | 1983-11-24 | 1983-11-24 | Chip carrier type package connection structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6088574U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005044967A (en) * | 2003-07-28 | 2005-02-17 | Hitachi Cable Ltd | Electric circuit element with optical component |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4814961U (en) * | 1971-06-30 | 1973-02-20 | ||
JPS6022348A (en) * | 1983-07-18 | 1985-02-04 | Rohm Co Ltd | Semiconductor device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH419186A (en) * | 1965-03-05 | 1966-08-31 | Escher Wyss Ag | Rotor for a centrifugal machine, in particular a steam or gas turbine |
-
1983
- 1983-11-24 JP JP18012083U patent/JPS6088574U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4814961U (en) * | 1971-06-30 | 1973-02-20 | ||
JPS6022348A (en) * | 1983-07-18 | 1985-02-04 | Rohm Co Ltd | Semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005044967A (en) * | 2003-07-28 | 2005-02-17 | Hitachi Cable Ltd | Electric circuit element with optical component |
Also Published As
Publication number | Publication date |
---|---|
JPH0220847Y2 (en) | 1990-06-06 |
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