JPS6081695U - Heat dissipation structure of sealed electronic device housing - Google Patents
Heat dissipation structure of sealed electronic device housingInfo
- Publication number
- JPS6081695U JPS6081695U JP17402783U JP17402783U JPS6081695U JP S6081695 U JPS6081695 U JP S6081695U JP 17402783 U JP17402783 U JP 17402783U JP 17402783 U JP17402783 U JP 17402783U JP S6081695 U JPS6081695 U JP S6081695U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- heat dissipation
- dissipation structure
- device housing
- sealed electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図および第３図は、従来の密閉型電子機器
筐体の放熱構造を説明するためのヒートパイプを用いた
概略構成図、電子機器をユニット化した構成図および放
熱フィンを付設した概略構成図、第４図は、本考案に係
る密閉型電子機器筐体の放熱構造の一実施例を説明する
ためのａは斜視図、−ｂは平面図、第５図は、密閉型電
子機器筐体内の温度分布を示したもので、ａは放熱手段
を施さない筐体、ｂは本考案の放熱手段を施した筐体、
Ｃはヒートパイプを付設した筐体である。
図において、１は筐体、２はヒートパイプ、３はユニッ
ト、４はケーブル、５は放熱フィン、６は密閉型電子機
器筐体、７は通風孔、８は放熱フィン、９は空気をそれ
ぞれ示す。Figures 1, 2, and 3 are a schematic configuration diagram using a heat pipe to explain the heat dissipation structure of a conventional sealed electronic device case, a configuration diagram in which the electronic device is unitized, and a configuration diagram showing a heat dissipation fin. The attached schematic configuration diagram, FIG. 4, is a perspective view, -b is a plan view, and FIG. This figure shows the temperature distribution inside the case of a type electronic device, where a is a case without heat dissipation means, b is a case with a heat dissipation means of the present invention,
C is a housing equipped with a heat pipe. In the figure, 1 is the housing, 2 is the heat pipe, 3 is the unit, 4 is the cable, 5 is the heat radiation fin, 6 is the sealed electronic device housing, 7 is the ventilation hole, 8 is the heat radiation fin, and 9 is the air. show.
Claims (1)
筐体に複数の通風孔を設け、該通風孔の、内面に複数の
放熱フィンを突出せしめたことを特徴とする密閉型電子
機器筐体の放熱構造。1. A heat dissipation structure for a sealed electronic device casing, characterized in that the electronic device casing is provided with a plurality of ventilation holes, and a plurality of heat radiation fins are made to protrude from the inner surface of the ventilation holes. Heat dissipation structure of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17402783U JPS6081695U (en) | 1983-11-09 | 1983-11-09 | Heat dissipation structure of sealed electronic device housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17402783U JPS6081695U (en) | 1983-11-09 | 1983-11-09 | Heat dissipation structure of sealed electronic device housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6081695U true JPS6081695U (en) | 1985-06-06 |
Family
ID=30378965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17402783U Pending JPS6081695U (en) | 1983-11-09 | 1983-11-09 | Heat dissipation structure of sealed electronic device housing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6081695U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010003932A (en) * | 2008-06-20 | 2010-01-07 | Mitsubishi Electric Corp | Electronic apparatus, and heat sink |
-
1983
- 1983-11-09 JP JP17402783U patent/JPS6081695U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010003932A (en) * | 2008-06-20 | 2010-01-07 | Mitsubishi Electric Corp | Electronic apparatus, and heat sink |
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