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JPS605144U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS605144U
JPS605144U JP1983096202U JP9620283U JPS605144U JP S605144 U JPS605144 U JP S605144U JP 1983096202 U JP1983096202 U JP 1983096202U JP 9620283 U JP9620283 U JP 9620283U JP S605144 U JPS605144 U JP S605144U
Authority
JP
Japan
Prior art keywords
circuit board
semiconductor equipment
membrane circuit
heat sink
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983096202U
Other languages
Japanese (ja)
Inventor
若生　忠樹
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1983096202U priority Critical patent/JPS605144U/en
Publication of JPS605144U publication Critical patent/JPS605144U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は基体に全面メッキを施した従来の放熱板の断面
図、第２図は膜回路基板搭載部分にさらにメッキを施し
た本考案の一実施例による放熱板の断面図である。 １１．２１・・・・・・放熱板本体、ｉｌ、２２・・・
・・・全面メ゛ツキ層、１３．２３・・・・・・膜回路
基板、２４・・・・・・部分メッキ層。FIG. 1 is a cross-sectional view of a conventional heat sink in which the entire surface of the base is plated, and FIG. 2 is a cross-sectional view of a heat sink according to an embodiment of the present invention in which the membrane circuit board mounting portion is further plated. 11.21... Heat sink body, il, 22...
...Full surface plating layer, 13.23...Membrane circuit board, 24...Partial plating layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 膜回路基板とこれが搭載される放熱板とを有し、この放
熱板には前記膜回路基板が半田付けされる部分に相当す
る部分に酸化され難い金属メッキ層が形成されているこ
とを特徴とする半導体装置。It has a membrane circuit board and a heat sink on which the membrane circuit board is mounted, and the heat sink has a metal plating layer that is difficult to oxidize formed on a portion corresponding to a portion to which the membrane circuit board is soldered. semiconductor devices.
JP1983096202U 1983-06-22 1983-06-22 semiconductor equipment Pending JPS605144U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983096202U JPS605144U (en) 1983-06-22 1983-06-22 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983096202U JPS605144U (en) 1983-06-22 1983-06-22 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS605144U true JPS605144U (en) 1985-01-14

Family

ID=30229373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983096202U Pending JPS605144U (en) 1983-06-22 1983-06-22 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS605144U (en)

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