JPS6048398A - Thermal screen printing stencil paper - Google Patents
Thermal screen printing stencil paperInfo
- Publication number
- JPS6048398A JPS6048398A JP15649983A JP15649983A JPS6048398A JP S6048398 A JPS6048398 A JP S6048398A JP 15649983 A JP15649983 A JP 15649983A JP 15649983 A JP15649983 A JP 15649983A JP S6048398 A JPS6048398 A JP S6048398A
- Authority
- JP
- Japan
- Prior art keywords
- film
- paper
- thermal head
- perforation
- screen printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/245—Stencils; Stencil materials; Carriers therefor characterised by the thermo-perforable polymeric film heat absorbing means or release coating therefor
Landscapes
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
技術分野
本発明は多孔質支持体にポリエステルフィルムを貼合せ
た感熱孔版印刷用原紙に関する。さらに詳しくは、本発
明は従来の穿孔方法であるハロゲンランプおよびキセノ
ンランプなどの熱線を吸収させて画像部に穿孔する方式
ではなく、サーマルヘッドによシ穿孔する方式に供する
感熱孔版印刷用原紙に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a base paper for heat-sensitive stencil printing in which a polyester film is laminated to a porous support. More specifically, the present invention relates to a thermal stencil printing base paper which is used for a method of perforating with a thermal head, rather than a conventional perforation method of perforating the image area by absorbing heat rays from a halogen lamp or a xenon lamp. .
従来技術
従来よシ赤外線照射によって穿孔できる孔版印刷用原紙
が知られている。この代表的なものは熱可塑性合成樹脂
フィルムと多孔性薄葉紙を接着剤を用いて貼合せたもの
である。また、赤外線照射によって穿孔できる合成樹脂
フィルムとしては種々のものが提案されている。例えば
特公昭41−7623号公報にはプロピレン、ポリアミ
ド、ポリエチレン、塩化ビニル−塩化ビニリデン共重合
体を使用することが、特公昭47−1184号公報には
プロピレンとエチレン、ブテン−1、インプレン、テト
ラメチルブタジェンおよび塩化ビニルから選ばれた1種
との共重合体を使用することがそして特公昭52−49
69号公報にはビニル系合成樹脂フィルムを使用するこ
とが記載されている。しかしながら、これらの合成樹脂
フィルムを用いて孔版原紙を作製しサーマルプリンター
やサーマルファクシミリ用のサーマルヘッドにより穿孔
を行なった場合はとんど穿孔されないという問題がある
。これu赤外a照射(タングステンハロゲ゛ンランフ、
キセノンランプクの場合にはフィルムの画像部は大きな
熱エネルギーを受けるが、サーマルヘッドの場合には熱
エネルギーはせいぜい1mJ/ドツト程度であるため、
フィルムの厚みから生じる熱容量の差に起因するものと
考えられる。BACKGROUND OF THE INVENTION Conventionally, stencil printing paper which can be perforated by infrared irradiation is known. A typical example is a thermoplastic synthetic resin film and porous thin paper bonded together using an adhesive. Furthermore, various synthetic resin films that can be perforated by infrared irradiation have been proposed. For example, Japanese Patent Publication No. 41-7623 describes the use of propylene, polyamide, polyethylene, vinyl chloride-vinylidene chloride copolymer, and Japanese Patent Publication No. 47-1184 discloses the use of propylene, ethylene, butene-1, imprene, and tetrapropylene. It is possible to use a copolymer of methylbutadiene and one selected from vinyl chloride and
Publication No. 69 describes the use of a vinyl-based synthetic resin film. However, when stencil paper is prepared using these synthetic resin films and perforations are performed using a thermal head for a thermal printer or thermal facsimile, there is a problem that the perforations are almost never made. This U infrared a irradiation (tungsten halogen lamp,
In the case of a xenon lamp, the image area of the film receives a large amount of thermal energy, but in the case of a thermal head, the thermal energy is approximately 1 mJ/dot at most.
This is thought to be due to the difference in heat capacity caused by the thickness of the film.
また、従来の赤外線照射による穿孔では前記合成樹脂フ
ィルムのほとんどのものは15μ程度の厚さのものまで
よく開孔されるが、サーマルヘッドによる穿孔方法では
厚いフィルムの場合開孔率が極めて悪くなるので謄写印
刷によるインキの通シも悪く画像濃度が低くなる結果切
れ切れの線画で不連続な画像しか得られないという問題
がある。また感熱孔版原紙の場合、熱可塑性合成樹脂フ
ィルムと多孔質支持体(典具帖紙、レーヨン混抄和紙、
不織布、スクリーンなど)とが接着剤摺脂により貼合せ
たものが一般的である。この場合、合成樹脂フィルムま
たは支持体は熱によシ伸縮するとバイメタルの原理で一
方向へカールが生ずるという問題がある。Furthermore, when using the conventional perforation method using infrared irradiation, most of the synthetic resin films can be perforated up to a thickness of about 15 μm, but when using the perforation method using a thermal head, the perforation rate becomes extremely poor for thick films. Therefore, there is a problem in that ink penetration by mimeograph printing is poor and the image density is low, resulting in only discontinuous images with broken line drawings. In the case of heat-sensitive stencil paper, a thermoplastic synthetic resin film and a porous support (tengucho paper, rayon-mixed washi paper,
Non-woven fabrics, screens, etc.) are generally bonded together using adhesives and resins. In this case, there is a problem in that when the synthetic resin film or support expands and contracts due to heat, it curls in one direction due to the bimetallic principle.
特に延伸された合成樹脂フィルムでは温度、経時などに
より収縮するためフィルム面側ヘカールする。したがっ
て、サーマルヘッドによる穿孔に適した孔版印刷用原紙
の開発が望まれている。In particular, a stretched synthetic resin film shrinks due to temperature, time, etc., and thus curls toward the film surface. Therefore, it is desired to develop a stencil printing paper suitable for perforation by a thermal head.
目 的
本発明は上記現状に鑑みてなされたものであってその目
的はサーマルヘッド穿孔におけるフィルム開孔率の上昇
と印刷画質の向上、孔版原紙のカール防止、サーマルヘ
ッドに対するフィルムの融着および穿孔カスの付M量の
低減などにある。Purpose The present invention was made in view of the above-mentioned current situation, and its purpose is to increase the film porosity in thermal head perforation, improve printing image quality, prevent stencil paper from curling, fuse the film to the thermal head, and perforate the film. This includes reducing the amount of residue M.
構成
本発明は赤外線照射によって穿孔し得る種々の合成樹脂
フィルムのサーマルヘッド穿孔への適用性の検討結果か
ら得られた知見に基づくものである。すなわち、本発明
は感熱孔版印刷用原紙を構成する熱可塑性合成4rI(
脂フィルムとして厚さ4μ以下のポリエステルフィルム
を使用することを特徴とするものである。Structure The present invention is based on the findings obtained from the results of studies on the applicability of various synthetic resin films that can be perforated by infrared irradiation to thermal head perforation. That is, the present invention provides thermoplastic synthetic 4rI (
It is characterized in that a polyester film with a thickness of 4 μm or less is used as the fat film.
上記知見によれば、サーマルヘッドによる孔版原紙の穿
孔においては合成樹脂フィルムの溶融点以外にフィルム
の熱容量が才孔の程度(開孔率)を支配していることが
見出された。つまりフィルムの熱容Mはフィルムの厚さ
に関係し、フィルムは薄いほどよく開孔する。しかしな
がら、ポリエステル以外のフィルムではほとんどのもの
が厚さが10μ以上であって工業的に生産されている最
も薄いものでも4〜6μであるのが現状である。厚さが
4μ以上のフィルムでは融点が低くとも開化率が非常に
悪い。捷だ、ポリエステル以外のフィルムでは温度およ
び湿度の影響を受け易くフィルムの伸縮が大きいことも
知見した。したがって、多孔質支持体とラミネートして
孔版原紙とした場合には温度、湿度および経時によるカ
ールが大きい。さらに、サーマルヘッドとの融着はフィ
ルムの融点が低い程またフィルムが厚くなる程大きくな
る傾向があり、またカスの付着についてはフィルムが厚
い程カスが多くなることを知見した。したがって、サー
マルヘッドにある一定のエネルギー(温夏)を与えて穿
孔した場合フィルムの溶融点が高くフィルムの厚さが薄
い程これらの現象に対しては有利である。しかし、フィ
ルムの溶融点はサーマルヘッドの温度より低くないと穿
孔されない。According to the above findings, it has been found that in perforation of stencil paper by a thermal head, the degree of perforation (porosity) is controlled not only by the melting point of the synthetic resin film but also by the heat capacity of the film. In other words, the heat capacity M of the film is related to the thickness of the film, and the thinner the film, the more holes are formed. However, the current situation is that most films other than polyester have a thickness of 10 microns or more, and even the thinnest film produced industrially has a thickness of 4 to 6 microns. A film with a thickness of 4 μm or more has a very poor opening rate even if the melting point is low. It was also discovered that films other than polyester are easily affected by temperature and humidity and have large expansion and contraction. Therefore, when laminated with a porous support to form a stencil paper, curling is large due to temperature, humidity and aging. Furthermore, it has been found that the lower the melting point of the film and the thicker the film, the greater the degree of fusion with the thermal head, and that the thicker the film, the more debris adheres to the film. Therefore, when perforating a film by applying a certain amount of energy (temperature) to the thermal head, the higher the melting point of the film and the thinner the film, the more advantageous it is to prevent these phenomena. However, the melting point of the film must be lower than the temperature of the thermal head to be perforated.
本発明は種々の知見に基づいてなされたことは上述した
とおシであって、熱可塑性合成樹脂フィルムと多孔質支
持体とを貼合せてなる感熱孔版印刷用原紙をサーマルヘ
ッドによる穿孔に適用させるために、前記合成樹脂フィ
ルムとして厚さが4μ以下好ましくは1〜3μの範囲に
あるポリエステルフィルムを使用することにある。ポリ
エステルフィルムの厚さを4μ以下に限定した主な理由
は上記知見からも明らかなようにサーマルヘッド穿孔圧
おけるフィルム開孔率を大きくし印刷画質を改良するた
めである。As mentioned above, the present invention has been made based on various findings, and it applies a thermal stencil printing base paper made by laminating a thermoplastic synthetic resin film and a porous support to perforation using a thermal head. Therefore, a polyester film having a thickness of 4 microns or less, preferably 1 to 3 microns, is used as the synthetic resin film. As is clear from the above findings, the main reason for limiting the thickness of the polyester film to 4 μm or less is to increase the film porosity under the thermal head perforation pressure and improve the print image quality.
本発明に使用される多孔質支持体としては、多孔性薄葉
紙(典具帖)、多孔質の合成繊維抄造紙、各種織布、不
織布などを用いることができる。また、多孔質支持体と
ポリエステルフィルムとの貼合せは接着剤を用いまたは
用いずに(例えば熱接着)行なうことができる。また、
サーマルヘッドとの融着(ステッキング)を防止するた
めにラミネート後のフィルム表面に弗素系樹脂などのオ
ーバーコート層を設けてもよい。As the porous support used in the present invention, porous thin paper (tengucho), porous synthetic fiber paper, various woven fabrics, non-woven fabrics, etc. can be used. Further, the porous support and the polyester film can be bonded together with or without using an adhesive (for example, by thermal bonding). Also,
In order to prevent fusion (sticking) with the thermal head, an overcoat layer of fluorine resin or the like may be provided on the surface of the laminated film.
実施例
以下に実施例をあけて本発明をさらに説明するがこれに
限定されるものではない。EXAMPLES The present invention will be further explained with reference to Examples below, but the present invention is not limited thereto.
例 1
現在市販されている延伸された各種の熱可塑性合成樹脂
フィルムのうちからフィルムの厚みが薄いものを選択し
以下の手順により孔版印刷用原紙を作製した。Example 1 A thin film was selected from various stretched thermoplastic synthetic resin films currently on the market, and a stencil printing base paper was prepared according to the following procedure.
扁1 塩化ビニリデン 10
2 塩化ビニル(硬質)15
3 (軟質)15
5 ポリプロピレン 9
6 l 4
7 ナイロン6 15
8 ポリスチレン 30
9 ポリエチレン(低圧)15
10 ポリアクリロニトリル 10
11 ポリエステル 6
12 I 4
13 〃 2
上記の各種フィルムに酢酸ビニル系の接着剤をワイヤー
パーにて塗布し、さらに厚さ40μの多孔性薄葉紙(典
具帖)f!:重ねウェットラミネートによって貼合せ、
孔版原紙を作製した。Flat 1 Vinylidene chloride 10 2 Vinyl chloride (hard) 15 3 (soft) 15 5 Polypropylene 9 6 l 4 7 Nylon 6 15 8 Polystyrene 30 9 Polyethylene (low pressure) 15 10 Polyacrylonitrile 10 11 Polyester 6 12 I 4 13 〃 2 Above Vinyl acetate-based adhesive is applied to various types of films using a wire paper, and porous thin paper (tengucho) f! :Laminated by layered wet lamination,
A stencil paper was made.
上述のようにして作製した孔版原紙にサーマルヘッド(
リコーザーマルファクシミリRIFAX5320Hによ
る原稿読み取りとサーマルヘッド書込穿孔、ヘッドエネ
ルギー1. OmJ /ドツト固定)により9孔ヲ行な
ってサーマルステンシル’に作ffLこれを用いて謄写
印刷機(リコーハイプリンターE−80)で印刷し各種
フィルムの適用性を評価した。その結果を以下の表1に
示す。A thermal head (
Document reading and thermal head writing and punching using the Recosamar facsimile RIFAX5320H, head energy 1. A thermal stencil was made by making 9 holes using OmJ/dot fixation) and printed using a mimeograph machine (Ricoh High Printer E-80) to evaluate the applicability of various films. The results are shown in Table 1 below.
上記の結果から、フィルムの溶融点が低いものでもフィ
ルムの厚さが厚い場合にはサーマルヘッドによって開孔
を行なうと開孔性が劣ることが明らかである。これは厚
さの差異に起因する熱容州のためと考えられる。From the above results, it is clear that even if the film has a low melting point, if the film is thick, the hole-opening performance is poor when the holes are formed using a thermal head. This is thought to be due to thermal expansion caused by the difference in thickness.
例 2
典具帖紙よりなる厚さ40μの多孔質支持体に酢酸ビニ
ル系接着剤(2g/rn2)を用いて厚さの異なる5種
類のポリエステルをラミネートした。サーマルヘッドと
のスデツキング全防止する目的でラミネート後のフィル
ム表面に耐熱温度が480 ℃の弗素系樹脂をオーバー
コートして孔版印刷用原紙全作製した。Example 2 Five types of polyesters having different thicknesses were laminated onto a 40 μm thick porous support made of Tengucho paper using a vinyl acetate adhesive (2 g/rn2). In order to completely prevent sliding with the thermal head, the surface of the laminated film was overcoated with a fluorine-based resin having a heat resistance temperature of 480° C., thereby producing a complete base paper for stencil printing.
サンプル屋 フィルムの厚み(μ)
11.5
2
36.0
45.5
4
次に、これらのサンプルについてサーマルヘッドの印加
電圧(電力)および通電時間を変化させて与えたエネル
ギーと開孔状態(写真観察)と印刷画質との関係を調べ
たところ下記の結果が得られた。表2は通電時間を3.
0m8にした時の結果を示しそして表3は通電時間f、
2.0msにした時の結果を示す。Sample shop Film thickness (μ) 11.5 2 36.0 45.5 4 Next, for these samples, the applied voltage (power) and energization time of the thermal head were varied to determine the energy and pore opening state (photo). When we investigated the relationship between (observation) and print image quality, we obtained the following results. Table 2 shows the energizing time of 3.
Table 3 shows the results when the current was set to 0m8.
The results are shown when the time is set to 2.0 ms.
表 2 表 3 0連続して良く開孔し印刷画質がよい。Table 2 Table 3 0 Consecutive holes are well formed and the print quality is good.
Δ 不連続に開孔し印刷画像の線画はドツトノミターン
のように切れ切れではあるかはつH識別可能。Δ The line drawings in the printed image are discontinuously apertured and can be identified as discontinuous lines like dotted lines.
× 全く開孔されずインキが通らない。× The holes are not opened at all and ink cannot pass through.
上記の結果から、孔版原紙の穿孔状態はフィルムの厚さ
とサーマルヘッドのエネルギーニヨって変化することが
わかる。しかし実際には同じエネルギーを与える場合(
エネルギーー電力×時間)通電時間を長くするよりも電
力(電圧)を大きくした方がよく開孔し′iたサーマル
ヘッドの出力もヘッド寿命との関係で限度がある(現状
でI″j、最高1.5 mJ /ドツト程度)。上記の
結果にかかわらず厚さ4μ以下のポリエステルフィルム
であれば本発明で意図する所期の効果全達成できる。From the above results, it can be seen that the perforation state of the stencil paper changes depending on the thickness of the film and the energy of the thermal head. However, if you actually give the same energy (
(Energy - Power × Time) It is better to open holes by increasing the power (voltage) than by increasing the energization time.The output of the thermal head is also limited in relation to the head life (currently I''j, maximum (approximately 1.5 mJ/dot).Despite the above results, all the desired effects of the present invention can be achieved with a polyester film having a thickness of 4 μm or less.
効果
以上のようにして構成された本発明の感熱孔版印刷用原
紙は下記の効果を奏する。Effects The heat-sensitive stencil printing base paper of the present invention constructed as described above has the following effects.
■ フィルムの才孔がムラなく連続してよく開孔される
ため謄写印刷を行なった場合インキの通りがよく線画が
連続している。また、ベタ画像部の画像濃度も高く画質
が上る。■ The holes in the film are evenly and consecutively perforated, so when mimeographed, the ink passes through easily and the line drawings are continuous. Further, the image density of the solid image portion is also high, and the image quality is improved.
■ 孔版原紙の経時罠よるカール15g起らない。■ 15g of curling due to aging of the stencil paper does not occur.
■ ラミネート強要が高い<sq+)オvフイy系のフ
ィルムと異なりコロナ放電処理などをイテなわなくとも
ウェットラミネートやドライラミネートが可能である)
。■ Lamination requirement is high (<sq+) Unlike off-air film, wet lamination or dry lamination is possible without corona discharge treatment etc.)
.
特許出願人 株式会社 リ コ −Patent applicant Rico Co., Ltd.
Claims (1)
貼合せサーマルヘッドにより穿孔できるようにしたこと
を特徴とする、感熱孔版印刷用原紙。A base paper for thermal stencil printing, characterized in that a polyester film having a thickness of 4 μm or less is laminated to a porous support and can be perforated with a thermal head.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15649983A JPS6048398A (en) | 1983-08-29 | 1983-08-29 | Thermal screen printing stencil paper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15649983A JPS6048398A (en) | 1983-08-29 | 1983-08-29 | Thermal screen printing stencil paper |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2224359A Division JPH085258B2 (en) | 1990-08-28 | 1990-08-28 | Method for producing plate for heat-sensitive stencil printing |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6048398A true JPS6048398A (en) | 1985-03-16 |
JPH0365280B2 JPH0365280B2 (en) | 1991-10-11 |
Family
ID=15629091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15649983A Granted JPS6048398A (en) | 1983-08-29 | 1983-08-29 | Thermal screen printing stencil paper |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6048398A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6292892A (en) * | 1985-10-18 | 1987-04-28 | Ricoh Co Ltd | Thermal stencil paper |
JPS62156995A (en) * | 1985-12-28 | 1987-07-11 | Ricoh Co Ltd | Thermal transfer recording material |
JPS62253492A (en) * | 1986-01-24 | 1987-11-05 | Toray Ind Inc | Film for heat sensitive mimeograph print stencil paper |
JPS62282983A (en) * | 1985-07-15 | 1987-12-08 | Asahi Chem Ind Co Ltd | Film for high sensitivity heat-sensitive screen printing stencil |
JPS6321190A (en) * | 1986-07-14 | 1988-01-28 | Asia Genshi Kk | Thermal stencil paper |
US4957378A (en) * | 1986-09-09 | 1990-09-18 | Ricoh Company, Ltd. | Printing-plate preparation apparatus employed in screen printing machine including a non-adhesive platen surface and a manuscript reading unit. |
WO1991009742A1 (en) * | 1989-12-22 | 1991-07-11 | Dai Nippon Insatsu Kabushiki Kaisha | Thermosensitive stencil paper |
US5184549A (en) * | 1990-12-29 | 1993-02-09 | Brother Kogyo Kabushiki Kaisha | Stamp device with a printing element, movable ink supplying device, and plate making device employing an elongate heat sensitive stencil paper |
US5195832A (en) * | 1991-05-10 | 1993-03-23 | Brother Kogyo Kabushiki Kaisha | Electrical stamp device with ink temperature compensation for stencil paper perforation |
US5216951A (en) * | 1990-06-14 | 1993-06-08 | Ricoh Company, Ltd. | Thermal plate making apparatus |
CN104118194A (en) * | 2013-04-28 | 2014-10-29 | 昆山允升吉光电科技有限公司 | Production process of emulsion-free solar screen |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4830570A (en) * | 1971-08-20 | 1973-04-21 | ||
JPS495934A (en) * | 1972-05-23 | 1974-01-19 | ||
JPS512513A (en) * | 1974-06-25 | 1976-01-10 | Toray Industries | KOBANINSATSUYOGENSHI |
JPS5349519A (en) * | 1976-06-08 | 1978-05-06 | Asahi Dow Ltd | Method of producing plates for heat sensitized mimeographic plates |
JPS5433043A (en) * | 1977-08-18 | 1979-03-10 | Riso Kagaku Corp | Heat sensitive recording method |
JPS5433117A (en) * | 1977-08-18 | 1979-03-10 | Riso Kagaku Corp | Method of making recorded image |
JPS557467A (en) * | 1978-07-03 | 1980-01-19 | Fuji Kagakushi Kogyo Co Ltd | Heat-sensitive transfer material |
JPS55103957A (en) * | 1979-02-02 | 1980-08-08 | Toshiba Corp | Processing system for mimeograph |
JPS55152077A (en) * | 1979-05-18 | 1980-11-27 | Toshiba Corp | Thermal transfer recorder |
JPS57182495A (en) * | 1981-05-08 | 1982-11-10 | Tomoegawa Paper Co Ltd | Heat-sensitive stencile |
JPS5892595A (en) * | 1981-11-28 | 1983-06-01 | Pentel Kk | Base paper for heat sensitive stencil printing |
JPS58153697A (en) * | 1982-03-10 | 1983-09-12 | Tomoegawa Paper Co Ltd | Heat-sensitive stencile paper |
JPS592895A (en) * | 1982-06-29 | 1984-01-09 | Tomoegawa Paper Co Ltd | Heat-sensitive perforated plate base paper |
JPS59143679A (en) * | 1983-02-07 | 1984-08-17 | Riso Kagaku Corp | Stencil type plate-making printer |
JPS6019592A (en) * | 1983-07-13 | 1985-01-31 | General Kk | Thermal stencil paper |
JPS6019591A (en) * | 1983-07-13 | 1985-01-31 | General Kk | Heat-sensitive stencil paper |
-
1983
- 1983-08-29 JP JP15649983A patent/JPS6048398A/en active Granted
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4830570A (en) * | 1971-08-20 | 1973-04-21 | ||
JPS495934A (en) * | 1972-05-23 | 1974-01-19 | ||
JPS512513A (en) * | 1974-06-25 | 1976-01-10 | Toray Industries | KOBANINSATSUYOGENSHI |
JPS5349519A (en) * | 1976-06-08 | 1978-05-06 | Asahi Dow Ltd | Method of producing plates for heat sensitized mimeographic plates |
JPS5433043A (en) * | 1977-08-18 | 1979-03-10 | Riso Kagaku Corp | Heat sensitive recording method |
JPS5433117A (en) * | 1977-08-18 | 1979-03-10 | Riso Kagaku Corp | Method of making recorded image |
JPS557467A (en) * | 1978-07-03 | 1980-01-19 | Fuji Kagakushi Kogyo Co Ltd | Heat-sensitive transfer material |
JPS55103957A (en) * | 1979-02-02 | 1980-08-08 | Toshiba Corp | Processing system for mimeograph |
JPS55152077A (en) * | 1979-05-18 | 1980-11-27 | Toshiba Corp | Thermal transfer recorder |
JPS57182495A (en) * | 1981-05-08 | 1982-11-10 | Tomoegawa Paper Co Ltd | Heat-sensitive stencile |
JPS5892595A (en) * | 1981-11-28 | 1983-06-01 | Pentel Kk | Base paper for heat sensitive stencil printing |
JPS58153697A (en) * | 1982-03-10 | 1983-09-12 | Tomoegawa Paper Co Ltd | Heat-sensitive stencile paper |
JPS592895A (en) * | 1982-06-29 | 1984-01-09 | Tomoegawa Paper Co Ltd | Heat-sensitive perforated plate base paper |
JPS59143679A (en) * | 1983-02-07 | 1984-08-17 | Riso Kagaku Corp | Stencil type plate-making printer |
JPS6019592A (en) * | 1983-07-13 | 1985-01-31 | General Kk | Thermal stencil paper |
JPS6019591A (en) * | 1983-07-13 | 1985-01-31 | General Kk | Heat-sensitive stencil paper |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62282983A (en) * | 1985-07-15 | 1987-12-08 | Asahi Chem Ind Co Ltd | Film for high sensitivity heat-sensitive screen printing stencil |
JPS6292892A (en) * | 1985-10-18 | 1987-04-28 | Ricoh Co Ltd | Thermal stencil paper |
JPS62156995A (en) * | 1985-12-28 | 1987-07-11 | Ricoh Co Ltd | Thermal transfer recording material |
JPS62253492A (en) * | 1986-01-24 | 1987-11-05 | Toray Ind Inc | Film for heat sensitive mimeograph print stencil paper |
JPS6321190A (en) * | 1986-07-14 | 1988-01-28 | Asia Genshi Kk | Thermal stencil paper |
US4957378A (en) * | 1986-09-09 | 1990-09-18 | Ricoh Company, Ltd. | Printing-plate preparation apparatus employed in screen printing machine including a non-adhesive platen surface and a manuscript reading unit. |
WO1991009742A1 (en) * | 1989-12-22 | 1991-07-11 | Dai Nippon Insatsu Kabushiki Kaisha | Thermosensitive stencil paper |
US5216951A (en) * | 1990-06-14 | 1993-06-08 | Ricoh Company, Ltd. | Thermal plate making apparatus |
US5184549A (en) * | 1990-12-29 | 1993-02-09 | Brother Kogyo Kabushiki Kaisha | Stamp device with a printing element, movable ink supplying device, and plate making device employing an elongate heat sensitive stencil paper |
US5195832A (en) * | 1991-05-10 | 1993-03-23 | Brother Kogyo Kabushiki Kaisha | Electrical stamp device with ink temperature compensation for stencil paper perforation |
CN104118194A (en) * | 2013-04-28 | 2014-10-29 | 昆山允升吉光电科技有限公司 | Production process of emulsion-free solar screen |
Also Published As
Publication number | Publication date |
---|---|
JPH0365280B2 (en) | 1991-10-11 |
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