JPS6043012B2 - semiconductor assembly equipment - Google Patents
semiconductor assembly equipmentInfo
- Publication number
- JPS6043012B2 JPS6043012B2 JP55060296A JP6029680A JPS6043012B2 JP S6043012 B2 JPS6043012 B2 JP S6043012B2 JP 55060296 A JP55060296 A JP 55060296A JP 6029680 A JP6029680 A JP 6029680A JP S6043012 B2 JPS6043012 B2 JP S6043012B2
- Authority
- JP
- Japan
- Prior art keywords
- electric torch
- thin metal
- metal wire
- current
- semiconductor assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 この発明は半導体装置の組立工程に関するものである。[Detailed description of the invention] The present invention relates to an assembly process for semiconductor devices.
従来、この種の装置としては第１図に示すものてあつた
。図において１は電気トーチ電源、２は電気トーチで、
電気トーチ電源１と電気トーチ２とをむすぶケーブルで
ある。４はケーブルに流れる電流の電流検出器である。Conventionally, a device of this type has been shown in FIG. In the figure, 1 is the electric torch power supply, 2 is the electric torch,
This is a cable that connects an electric torch power source 1 and an electric torch 2. 4 is a current detector for the current flowing through the cable.
５はワイヤボンド用のキャピラリ−チップで、６はワイ
ヤボンドされる金属細線てある。5 is a capillary chip for wire bonding, and 6 is a thin metal wire to be wire bonded.
次に従来の装置の動作について第２図で説明する。Next, the operation of the conventional device will be explained with reference to FIG.
第２図ａおよびをにおいてフレームのダイパット９の上
には半導体素子８が載つており、半導体素子８とリード
１０との間を金属細線６て図に示すように接続する。次
に第２図ｃおよびｄにおいて、キャピラリ−チップ５が
ある高さまで上るとクランパ１１が金属細線６をはさみ
込んで、その結果リード１０にボンドされた箇所より金
属細線６が切断される。さらに切断された金属細線６の
下に電気トーチ２が移動して来て高電圧で金属細線６を
スパークさせてボール７を生成させる。この時、スパー
クしたかどうかは第１図に示す電流検出器４でスパーク
した際に流れる電流でチェックし、電流が流れなければ
ボール７が出きなかつたものとして装置を停止させる様
になつている。このように従来のワイヤボンダーの電流
検出器は電流が流れれば可とする様になつているために
、電気トーチと金属細線がショートしている場合におい
ては、電気トーチに高電圧をかけてもスパークは起らず
、又電流は流れるのでボールができたものとあやまつた
判断を起す欠点があつた。In FIGS. 2a and 2, a semiconductor element 8 is mounted on a die pad 9 of the frame, and a thin metal wire 6 is used to connect the semiconductor element 8 and a lead 10 as shown in the figure. Next, in FIGS. 2c and 2d, when the capillary chip 5 rises to a certain height, the clamper 11 pinches the thin metal wire 6, and as a result, the thin metal wire 6 is cut from the point where it is bonded to the lead 10. Further, an electric torch 2 moves below the cut thin metal wire 6 and sparks the thin metal wire 6 with high voltage to generate a ball 7. At this time, whether or not a spark has occurred is checked by the current flowing when a spark occurs using the current detector 4 shown in Fig. 1, and if no current flows, it is assumed that the ball 7 has not come out and the device is stopped. There is. In this way, the current detector of conventional wire bonders is designed to allow current to flow, so if there is a short circuit between the electric torch and the thin metal wire, it is necessary to apply a high voltage to the electric torch. However, since no spark was generated and current flowed, the problem was that it could be mistakenly thought that a ball had formed.
この発明は上記のような従来のものの欠点を除去するた
めになされたもので、スパークさせる前に電気トーチに
スパークが起らない程度の電圧をかけて電気トーチと金
属細線とのショートを検出可能とした半導体組立装置を
提供することを目的とするものである。以下、この発明
の一実施例を図について説明する。This invention was made to eliminate the drawbacks of the conventional ones as described above, and it is possible to detect a short circuit between the electric torch and a thin metal wire by applying a voltage to the electric torch to an extent that no spark occurs before sparking. The purpose of the present invention is to provide a semiconductor assembly device with the following features. An embodiment of the present invention will be described below with reference to the drawings.
なおこの発明の構成については第１図および・第２図の
従来のものの説明と全く同一につき省略する。なお構成
は第１図とは同様であるが、電流検出器４はスパーク前
とスパーク時の２回検出動作をする点が従来のものと相
異する。The structure of the present invention is exactly the same as that of the conventional structure shown in FIGS. 1 and 2, so the description thereof will be omitted. The configuration is the same as that shown in FIG. 1, but the current detector 4 is different from the conventional one in that the current detector 4 performs the detection operation twice, once before sparking and when sparking.
つぎにワイヤボンドの動作も第２図の従来と同様である
。Next, the operation of wire bonding is also the same as the conventional one shown in FIG.
即ち第１図において、電気トーチ２がキャピラリ−チッ
プ５の下に来た時、ケーブルに電気トーチ２と金属細線
６がスパークを起さない程度の電圧をかける。この時電
気トーチ２と金属細線６がショートしていれば電流が流
れ、ショートがしてなければ電流は流れない。それを電
流検出器４でチェックし、電流が流れていれば装置を停
止させる。電流が流れなければスパークさせるための正
常な電圧を再度かける。それで再度電流検出を行い、電
流が流れればスパークしたと判断し、電流が流れなけれ
ばスパークしなかつたと判断して装置を止めるようにす
るものである。上記の実施例では第１図の様にスパーク
させるためのケーブル３を金属細線６のショートチェッ
クと共用させているが、第３図のように金属細線６のシ
ョートチェックを別途チェック用電源（図示せず）を介
してケーブル１２と別の電流検出器４を取付けても良い
。以上の様にこの発明によれば金属細線が電気トーチに
ショートした時に起るスパークしない現象を前もつてチ
ェックする事により、ボールができた事を確実に精度高
く検出できるという効果があるものである。That is, in FIG. 1, when the electric torch 2 comes under the capillary tip 5, a voltage is applied to the cable to the extent that the electric torch 2 and the thin metal wire 6 do not cause sparks. At this time, if the electric torch 2 and the thin metal wire 6 are short-circuited, a current will flow, and if there is no short-circuit, no current will flow. This is checked with a current detector 4, and if current is flowing, the device is stopped. If no current flows, reapply the normal voltage for sparking. Then, the current is detected again, and if current flows, it is determined that a spark has occurred, and if no current flows, it is determined that there was no spark, and the device is stopped. In the above embodiment, as shown in Fig. 1, the cable 3 for sparking is also used for short-circuit checking of the thin metal wire 6, but as shown in Fig. 3, a separate check power source (Fig. A cable 12 and another current detector 4 may also be attached via a cable (not shown). As described above, according to the present invention, the formation of a ball can be reliably detected with high accuracy by checking in advance for the phenomenon that no spark occurs when a thin metal wire short-circuits with an electric torch. be.
第１図は従来及び本発明のワイヤボンド装置の構造を示
す簡略説明図、第２図はワイヤボンド装置の動作状態を
示す各工程における動作説明図、第３図は本発明の他の
実施例を示すワイヤボンド装置の構造を示す簡略説明図
である。
図中同一符号は同一又は相当部分を示す。
１は電気トーチ電源、２は電気トーチ、３はケーブル、
４は金属細線検出器、５はキャピラリ−チップ、６は金
属細線、７はボール、８は半導体素子、９はダイパット
、１０はリード、１１はワイヤクランパ、１２は金属細
線ショートチェック用ケーブル。FIG. 1 is a simplified explanatory diagram showing the structure of a conventional wire bonding device and the present invention, FIG. 2 is an operational explanatory diagram showing the operating state of the wire bonding device in each step, and FIG. 3 is another embodiment of the present invention. FIG. 2 is a simplified explanatory diagram showing the structure of a wire bonding device. The same reference numerals in the figures indicate the same or corresponding parts. 1 is the electric torch power supply, 2 is the electric torch, 3 is the cable,
4 is a thin metal wire detector, 5 is a capillary chip, 6 is a thin metal wire, 7 is a ball, 8 is a semiconductor element, 9 is a die pad, 10 is a lead, 11 is a wire clamper, and 12 is a thin metal wire short check cable.
Claims (1)
ーで、金属細線を電気トーチでボールを作る際スパーク
させる前に１度電気トーチにスパークしない程度の電圧
をかけ、電気トーチと金属細線がタッチしているかどう
かをチェックする事を特徴とする半導体組立装置。1. With a wire bonder used in the semiconductor assembly process, when making a ball with an electric torch from a thin metal wire, before making a spark, apply a voltage to the electric torch once that does not cause a spark, and check whether the electric torch and the thin metal wire are touching. A semiconductor assembly device that is characterized by checking whether the
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55060296A JPS6043012B2 (en) | 1980-05-07 | 1980-05-07 | semiconductor assembly equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55060296A JPS6043012B2 (en) | 1980-05-07 | 1980-05-07 | semiconductor assembly equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56157040A JPS56157040A (en) | 1981-12-04 |
| JPS6043012B2 true JPS6043012B2 (en) | 1985-09-26 |
Family
ID=13138049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55060296A Expired JPS6043012B2 (en) | 1980-05-07 | 1980-05-07 | semiconductor assembly equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6043012B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04108204A (en) * | 1990-08-28 | 1992-04-09 | Mitsubishi Electric Corp | Acoustic equipment |
-
1980
- 1980-05-07 JP JP55060296A patent/JPS6043012B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04108204A (en) * | 1990-08-28 | 1992-04-09 | Mitsubishi Electric Corp | Acoustic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56157040A (en) | 1981-12-04 |
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