JPS60228678A - Formation of metallic film on surface of high molecular material - Google Patents
Formation of metallic film on surface of high molecular materialInfo
- Publication number
- JPS60228678A JPS60228678A JP59084745A JP8474584A JPS60228678A JP S60228678 A JPS60228678 A JP S60228678A JP 59084745 A JP59084745 A JP 59084745A JP 8474584 A JP8474584 A JP 8474584A JP S60228678 A JPS60228678 A JP S60228678A
- Authority
- JP
- Japan
- Prior art keywords
- high molecular
- coating
- film
- molecular material
- nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は高分子材料表面に対する金属被膜形成方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming a metal film on the surface of a polymeric material.
従来、高分子材料の表面に化学めっき法により金属被膜
を形成させることは広く知られているが、この場合、高
分子材料表面に対する金属被膜の固着性が悪く、使用に
際し、金属被膜が剥離したり。Conventionally, it is widely known that a metal coating is formed on the surface of a polymeric material by chemical plating, but in this case, the adhesion of the metal coating to the surface of the polymeric material is poor, and the metal coating may peel off during use. Or.
導電性に劣る等の欠点がある。It has drawbacks such as poor conductivity.
本発明者らは、従来技術に見られる前記欠点を克服すべ
く種々研究を重ねた結果、高分子材料表面にあらかじめ
窒素を含有するポリマー又はオリゴマーの被膜を形成さ
せ、その上に化学めっき処理を施すことによりその目的
を達成し得ることを見出し、本発明を完成するに到った
。The present inventors have conducted various studies to overcome the above-mentioned drawbacks found in the prior art. As a result, the present inventors formed a film of a nitrogen-containing polymer or oligomer on the surface of a polymeric material in advance, and then applied chemical plating treatment to the surface of the polymeric material. The present inventors have discovered that the object can be achieved by applying the following methods, and have completed the present invention.
即ち、本発明によれば、高分子材料表面に対し、あらか
じめ窒素を含有するポリマー又はオリゴマーを被膜した
後、化学めっき処理を施すことを特徴とする高分子材料
表面に対する金属被膜形成方法が提供される。That is, according to the present invention, there is provided a method for forming a metal film on the surface of a polymeric material, which is characterized in that the surface of the polymeric material is coated with a nitrogen-containing polymer or oligomer in advance, and then subjected to chemical plating treatment. Ru.
本発明において高分子材料の表面被覆に用いる被覆材料
は、窒素を含有するポリマー又はオリゴマーである。こ
の被覆材料において、窒素は種々の形態で含有され、例
えば、アミン結合、イミン結合、アミド結合、イミド結
合、ウレタン結合、二1ヘリル結合等の形で含有される
。この場合、窒素は、ポリマー又はオリゴマーの主鎖及
び側鎖のいずれに含有されていてもよい。窒素含量は、
被覆材料中、窒素原子(N)換算で、少なくとも5重量
%、通常、10〜15重量%程度である。The coating material used to coat the surface of the polymeric material in the present invention is a nitrogen-containing polymer or oligomer. In this coating material, nitrogen is contained in various forms, such as amine bonds, imine bonds, amide bonds, imide bonds, urethane bonds, and 21-helical bonds. In this case, nitrogen may be contained in either the main chain or the side chain of the polymer or oligomer. The nitrogen content is
In the coating material, it is at least 5% by weight, usually about 10 to 15% by weight, calculated as nitrogen atoms (N).
本発明で被覆材料として用いるポリマー又はオリゴマー
には従来公知の種々のものが含まれ、例えば、以下に示
すものが挙げられる。Polymers or oligomers used as coating materials in the present invention include various conventionally known polymers, such as those shown below.
(1)下記に示す含窒素子ツマ−のオリゴマー、単独重
合体及び共重合体。(1) Oligomers, homopolymers and copolymers of nitrogen-containing polymers shown below.
アリルアミン、ビニルピリジン、アミノスチレン、ビニ
ルピロール、N−ビニルピロリドン、N−ビニルカルバ
ゾール
N,N−ジメチルアクリルアミド、アクリロニトリル、
ジメチルアミノプロピルメタクリルアミド等。Allylamine, vinylpyridine, aminostyrene, vinylpyrrole, N-vinylpyrrolidone, N-vinylcarbazole N,N-dimethylacrylamide, acrylonitrile,
Dimethylaminopropylmethacrylamide etc.
(2)アミノ酸類のオリゴマー、単独重合体及び共重合
体。(2) Oligomers, homopolymers and copolymers of amino acids.
(3)ゼラチン、アルブミン、カゼイン等のポリペプチ
ド類や、キチン、キ1−サン等の含窒素天然高分子。(3) Polypeptides such as gelatin, albumin, and casein, and nitrogen-containing natural polymers such as chitin and x1-san.
(4)エチレンイミン、オキサゾリン類、オキサゾリジ
ン類等の含窒素環状モノマーのオリゴマー、単独重合体
及び共重合体。(4) Oligomers, homopolymers, and copolymers of nitrogen-containing cyclic monomers such as ethyleneimine, oxazolines, and oxazolidines.
(5)ウレタン樹脂等のウレタン結合を有するオリゴマ
ー及び重合体。(5) Oligomers and polymers having urethane bonds such as urethane resins.
(6)メラミン樹脂、尿素樹脂等。(6) Melamine resin, urea resin, etc.
本発明を実施するには、先ず、高分子材料に対し、前記
の窒素を含有する被覆材料を用いて表面被覆する。この
場合、高分子材料の形状は任意であり、例えば、繊維状
、フィルム状、板状、筒状等が含まれる。また、高分子
材料としては、従来公知の種々の高分子材料が使用され
、例えは、ポリエチレン、ポリプロピレン、ポリスチレ
ン等のポリオレフィンの他、ポリエステル、ポリアミド
(ナイロン)、ポリアクリロニトリル、ポリ塩化ビニリ
デン、ポリ塩化ビニル、ポリ酢酸ビニル、ポリスルフォ
ン、アクリル系樹脂、フェノール樹脂、二手しンーア一
コヒーレン
天然ゴム、ウレタンゴム、 。To carry out the present invention, first, the surface of a polymeric material is coated using the nitrogen-containing coating material described above. In this case, the shape of the polymeric material is arbitrary, and includes, for example, a fibrous shape, a film shape, a plate shape, a cylindrical shape, and the like. In addition, as the polymer material, various conventionally known polymer materials are used, such as polyolefins such as polyethylene, polypropylene, and polystyrene, as well as polyester, polyamide (nylon), polyacrylonitrile, polyvinylidene chloride, and polychloride. Vinyl, polyvinyl acetate, polysulfone, acrylic resin, phenolic resin, two-handed plastic coherence natural rubber, urethane rubber, etc.
ゴム、シリコンゴム、アクリル系ゴム等があり、また、
綿、絹、羊毛等の天然繊維、キュプラ、アセテ−1−、
レーヨン等の再生セルロース等がある。There are rubber, silicone rubber, acrylic rubber, etc.
Natural fibers such as cotton, silk, and wool, cupro, acetate,
There are regenerated cellulose such as rayon.
高分子材料に対する被覆材料の被覆方法としては、高分
子材料表面に被覆材料を層状に被覆し得る方法であれば
任意であり、従来公知の種々の方法が採用される。この
ような被覆方法としては、例えば、被覆材料溶液中に浸
漬して塗布する方法、この被覆材料溶液をスプレー塗布
する方法、及び3−
高分子材料表面をあらかじめ、前処理(クロム酸処理、
サンドエツチング処理、光照射処理、プラズマ照射等)
した後、被覆材料溶液を塗布する方法等の単純塗布方法
の他、高分子材料表面に含窒素モノマーを塗布し、放射
線や、紫外線、レーザー等を照射したり、プラズマ、熱
等殻作用させて、含窒素モノマーを高分子材料表面にグ
ラフト重合させる方法等がある。高分子材料に対する被
覆材料の被覆量は、好ましくは単分子膜形成量であるが
、一般には高分子材料1.00重量部に対し、固形物換
算で、0.1〜2.0重量部、好ましくは0.5〜1.
5重量部である。The method for coating the polymer material with the coating material may be any method as long as it can coat the surface of the polymer material with the coating material in a layered manner, and various conventionally known methods may be employed. Such coating methods include, for example, coating by dipping in a coating material solution, spray coating with this coating material solution, and 3- pretreatment (chromic acid treatment,
(sand etching treatment, light irradiation treatment, plasma irradiation, etc.)
After that, in addition to simple coating methods such as applying a coating material solution, nitrogen-containing monomers are applied to the surface of the polymer material and irradiated with radiation, ultraviolet rays, lasers, etc., or subjected to plasma, heat, etc. , a method of graft polymerizing a nitrogen-containing monomer onto the surface of a polymer material, etc. The coating amount of the coating material on the polymeric material is preferably the amount to form a monomolecular film, but generally 0.1 to 2.0 parts by weight in terms of solids per 1.00 parts by weight of the polymeric material. Preferably 0.5-1.
5 parts by weight.
次に、前記のようにして、窒素を含有するポリマー又は
オリゴマーで被覆された高分子材料表面に対し、常法に
より化学めっき処理を施す。この場合の化学めっき処理
は、例えば、貴金属イオンを含む溶液と接触させて、貴
金属を付着結合させ、貴金属層を形成させる。この貴金
属層は、後続の化学めっき液からそれに含まれる金属イ
オンを高分子材料表面に析出させる際の触媒的効果を示
す4−
ものである。この場合の貴金属としては、パラジウム、
白金、金等が用いられるが、好ましくはパラジウムであ
る。この貴金属イオンを含む溶液は、従来公知の方法に
従って調製することができ、例えば、貴金属の可溶性塩
、例えばハロゲン化物を、塩酸等の可溶化剤の存在下で
水中に溶解させることによって調製される。貴金属の付
着量は、高分子材料の表面に対し、0.1g/背、通常
0.01〜0.2g/ポ程度である。この貴金属イオン
を含む溶液により表面処理された高分子材料表面は、水
洗され、次の化学めっき処理に付される。Next, the surface of the polymeric material coated with the nitrogen-containing polymer or oligomer as described above is subjected to chemical plating treatment by a conventional method. In this case, the chemical plating treatment involves, for example, contacting with a solution containing noble metal ions to adhere and bond the noble metal to form a noble metal layer. This noble metal layer exhibits a catalytic effect when the metal ions contained therein are deposited on the surface of the polymeric material from the subsequent chemical plating solution. In this case, the precious metals include palladium,
Platinum, gold, etc. are used, but palladium is preferred. This solution containing noble metal ions can be prepared according to conventionally known methods, for example, by dissolving a soluble salt of a noble metal, such as a halide, in water in the presence of a solubilizing agent such as hydrochloric acid. . The amount of noble metal deposited on the surface of the polymer material is 0.1 g/back, usually about 0.01 to 0.2 g/post. The surface of the polymer material that has been surface-treated with the solution containing noble metal ions is washed with water and subjected to the next chemical plating treatment.
本発明で用いる化学めっき液としては、従来公知の種々
のものを採用することができる。また、めっき液中に対
して、高分子材料の表面に金属皮膜形成のために添加す
る金属としては、種々の金属を挙げることができ、例え
ば、Nl, Cot Ag+ LFe, Cu,Zn等
が挙げられる。また、これら単独の金属の他、合金、例
えばNi−Co, Nj ’J, Nj. Fe。As the chemical plating solution used in the present invention, various conventionally known ones can be employed. In addition, various metals may be added to the plating solution to form a metal film on the surface of the polymeric material, such as Nl, Cot Ag+ LFe, Cu, Zn, etc. It will be done. In addition to these individual metals, alloys such as Ni-Co, Nj'J, Nj. Fe.
Co−W, Co−Fe等から構成させることもできる
が、合金皮膜を形成させる場合には、めっき液には、所
望に応じた複数の金属塩を添加すればよい。化学めっき
液は、一般的には、金属塩、還元剤、錯化剤、緩衝剤、
安定剤等を含む。この場合、還元剤としては、次亜リン
酸ナトリウム、水素化はう素す1−リウム、アミノボラ
ン、ホルマリン等が採用され、錯化剤や緩衝剤としては
、ギ酸、酢酸、コハク酸、クエン酸、酒石酸、リンゴ酸
、グリシン、エチレンジアミン、EDTA、トリエタノ
ールアミン、酒石酸ナトリウム・カリウムなどが採用さ
れる。Although it can be made of Co-W, Co-Fe, etc., when forming an alloy film, a plurality of metal salts may be added to the plating solution as desired. Chemical plating solutions generally contain metal salts, reducing agents, complexing agents, buffering agents,
Contains stabilizers, etc. In this case, sodium hypophosphite, 1-lium borohydride, aminoborane, formalin, etc. are used as reducing agents, and as complexing agents and buffers, formic acid, acetic acid, succinic acid, citric acid, etc. are used. , tartaric acid, malic acid, glycine, ethylenediamine, EDTA, triethanolamine, sodium/potassium tartrate, etc. are employed.
化学めっき液の代表的組成として、例えば、Nj。A typical composition of the chemical plating solution is, for example, Nj.
Co等の金属塩10−200g/Q、次亜リン酸塩0.
3〜50g/ Q 、 pH緩衝剤5〜300g/ Q
からなるものを挙げることができ、また、好ましくは、
このようなめつき液に対して、さらに補助添加剤として
グリシン5〜200g/ Qを添加することができる。Metal salt such as Co 10-200g/Q, hypophosphite 0.
3-50g/Q, pH buffer 5-300g/Q
Preferably,
To such a plating solution, 5 to 200 g/Q of glycine can be further added as an auxiliary additive.
また、他のめっき液としては、金属塩10〜20h/Q
、酒石酸カリウム・す1−リウム10〜ioOg/Q、
またはEDTA10〜120g/ Q、水酸化アルカ1
月0〜60g/ fl、炭酸アルカリ5−50g/Q、
ホルマリン10〜200m Qからなるものを挙げるこ
とができ、その代表的なめっき金属として銅を挙げるこ
とができる。化学めっき処理は、通常、温度20〜95
°Cで行われる。In addition, other plating solutions include metal salt 10-20h/Q
, potassium sulfur tartrate 10~ioOg/Q,
Or EDTA10-120g/Q, alkali hydroxide 1
Monthly 0-60g/fl, alkali carbonate 5-50g/Q,
Examples include formalin 10 to 200mQ, and copper is a typical plating metal. Chemical plating treatment is usually performed at a temperature of 20 to 95
Performed at °C.
本発明においては、前記したように、高分子材料の表面
性状は化学めっき処理に適するように窒素を含有するポ
リマー又はオリゴマーで被覆されていることから、その
表面に対する化学めっき処理による金属被膜の形成は極
めて容易で、かつ得られる金属被膜は高分子材料表面に
強く固着する。In the present invention, as described above, since the surface of the polymeric material is coated with a nitrogen-containing polymer or oligomer to make it suitable for chemical plating, a metal film is formed on the surface by chemical plating. is extremely easy to obtain, and the resulting metal coating strongly adheres to the surface of the polymeric material.
本発明の場合は、新鮮な化学めっき液はもちろん、使用
済みの化学めっき廃液も、化学めっき液として用いるこ
とができ、さらに、銅やニッケルのエツチングに際して
得られるエツチング廃液を、希釈(1〜100倍)後、
錯化剤及び還元剤を加えて、本発明における化学めっき
液として用いることができる。本発明によれば、このよ
うな化学めっき処理廃液やエツチング廃液からでも効率
よく高分子材料表面上に金属を皮膜状に析出させること
ができるので、著しく低コス+−で目的の金属皮膜を高
分子材料表面に形成させることができる。In the case of the present invention, not only fresh chemical plating solution but also used chemical plating waste solution can be used as the chemical plating solution. times) after
It can be used as a chemical plating solution in the present invention by adding a complexing agent and a reducing agent. According to the present invention, metal can be efficiently deposited in the form of a film on the surface of a polymer material even from such chemical plating waste liquid or etching waste liquid, so that the desired metal film can be formed at a significantly low cost. It can be formed on the surface of molecular materials.
7一
本発明により得られる表面に金属皮膜を有する高分子材
料は、金属光沢を示すと共に、導電性を有し、種々の分
野に利用される。71 The polymer material having a metal film on the surface obtained by the present invention exhibits metallic luster and has electrical conductivity, and is used in various fields.
本発明で得られる金属被膜を有する高分子材料は、導電
性の繊維や、フィルムあるいはシー1−や容器等の形で
電磁波シールド材料として適用される。The polymeric material having a metal coating obtained by the present invention is applied as an electromagnetic shielding material in the form of conductive fibers, films, sheets, containers, etc.
本発明の方法は、IC集積回路の作成における導電性被
膜形成方法としても応用することができる。The method of the present invention can also be applied as a method for forming a conductive film in the production of IC integrated circuits.
即ち、本発明によれば、プラスチック基板上に、被覆材
料を印刷インクの形で所要画像状に塗布し、その塗布面
を貴金属塩溶液を用いて処理した後、化学めっき処理を
施す。このようにして、プラスチック基板」二には、そ
の被覆材料を塗布した跡に金属被膜が形成される。That is, according to the present invention, a coating material is applied in the form of a printing ink onto a plastic substrate in the desired image, and the coated surface is treated with a noble metal salt solution and then subjected to a chemical plating treatment. In this way, a metal coating is formed on the plastic substrate 2 where the coating material was applied.
また、本発明の方法は、圧電素子や圧電センサーの作成
技術として応用することができる。即ち、本発明によれ
ば、天然ゴムや合成ゴム等で作成した柔軟性シート表面
に強く固着した導電性金属被膜を形成することができる
が、このような金属被8−
膜を有する柔軟性シー1〜は圧力に応じてその導電性が
変化する。Furthermore, the method of the present invention can be applied as a technique for producing piezoelectric elements and piezoelectric sensors. That is, according to the present invention, it is possible to form a conductive metal coating that is strongly adhered to the surface of a flexible sheet made of natural rubber, synthetic rubber, etc.; The conductivity of Nos. 1 to 1 changes depending on the pressure.
さらに、本発明の方法は、筋電計や心電計用の電極作成
技術として応用することができる。即ち、本発明によれ
ば、柔軟性高分子シー1への表面に導電性金属被膜を形
成させることができるが、このような高分子シートは皮
膜に対する貼着が容易である。Furthermore, the method of the present invention can be applied as a technique for producing electrodes for electromyographs and electrocardiographs. That is, according to the present invention, a conductive metal film can be formed on the surface of the flexible polymer sheet 1, and such a polymer sheet can be easily attached to the film.
次に本発明を実施例によりさらに詳細に説明する。Next, the present invention will be explained in more detail with reference to Examples.
なお、以下において示す体積固有抵抗及び表面抵抗は、
次のようにして測定されたものである。In addition, the volume resistivity and surface resistance shown below are
It was measured as follows.
体積固有抵抗:
縦横それぞれ2.5cmの正方形に裁断しためつき布の
上下から、1..98cJの円盤状銅電極を40g/c
+#の圧締圧ではさみ、この間の電流A及び電圧Vを測
定し、その測定値に基づき、厚み方向の体積固有抵抗を
、次の計算式からめた。Volume resistivity: 1. .. 40g/c of 98cJ disc-shaped copper electrode
A clamping pressure of +# was applied, and the current A and voltage V during this time were measured, and based on the measured values, the volume resistivity in the thickness direction was calculated using the following formula.
体積固有抵抗(0cm)
八 布の1季さくcm)
表面抵抗:
エポキシ樹脂に銅板を接着した電極を作成し、この電極
間に、銅板電極間の距離2cm、電極寸法30m X
1cmの条件下で、めっき布(2,5cm X 2.5
cm)を3kgの圧締圧ではさみ、この電極間の電流A
と電圧Vを測定し、その測定値に基づき、表面抵抗を次
の計算式によりめる。Volume resistivity (0cm) 8 cm) Surface resistance: Create an electrode by bonding a copper plate to epoxy resin, and place the electrodes between the electrodes, the distance between the copper plate electrodes is 2cm, and the electrode size is 30m.
Under the condition of 1 cm, plated cloth (2.5 cm x 2.5
cm) with a clamping pressure of 3 kg, and the current A between the electrodes is
and the voltage V, and based on the measured values, calculate the surface resistance using the following formula.
表面抵抗(Ω/口)
実施例1
試料として、ポリエステル繊維シート(2,5cmX2
.5cm)を用い、これを4−ビニルピリジン重合体(
分子量約20万)の0.1%メタノール溶液中に10分
間浸漬した後、引上げ、乾燥する。次に、この試料を濃
度0.15g/[のPdcQ2溶液中に10分間浸漬し
た後、引上げ、充分に水洗して過剰のPdcflzを除
去し、次いでニッケルめっき浴中に75℃で10分間浸
漬して化学めっき処理を施した。Surface resistance (Ω/mouth) Example 1 As a sample, a polyester fiber sheet (2.5 cm x 2
.. 5 cm), and then convert it into a 4-vinylpyridine polymer (
After being immersed in a 0.1% methanol solution with a molecular weight of about 200,000 for 10 minutes, it was pulled out and dried. Next, this sample was immersed in a PdcQ2 solution with a concentration of 0.15 g/[ for 10 minutes, then pulled out, thoroughly washed with water to remove excess Pdcflz, and then immersed in a nickel plating bath at 75°C for 10 minutes. Chemical plating treatment was applied.
得られた試料は、その繊維表面にニッケル被膜が強固に
付着したものである。この試料において、ニッケル付着
量は、繊維面積6.25cn? (2,5cm X 2
.5cm)に対し1.6mgであり、またその体積固有
抵抗(Ω・印)は、420であった。The obtained sample had a nickel coating firmly adhered to the fiber surface. In this sample, the amount of nickel deposited is 6.25 cn on the fiber area. (2.5cm x 2
.. 5 cm), and its volume resistivity (Ω· mark) was 420.
なお、前記ニッケルめっき浴の成分組成は次の通りであ
る。The composition of the nickel plating bath is as follows.
硫酸ニッケル・6H20・・・・・・・・・・・25g
IQ次亜リン酸ナトリウム・・・・・・・・・30gI
Qリンゴ酸・・・・・・・・・・・・・・・・・・・・
・30g/Qコハク酸・・・・・・・・・・・・・・・
・・・・・・16gIQpH・・・・・・・・・・・・
・・・・・・・・・・・・・・・・・4.5実施例2
実施例1において、ニッケルめっき浴中における試料浸
漬時間を種々変化させた以外は同様にして実験を行った
。その浸漬時間と、得られる試料におけるニッケル付着
量及び体積固有抵抗との関係を次表に示す。−
表−1
11一
実施例3
実施例1において、ニッケルめっき浴の代りに銅めっき
液を用いた以外は同様にして実験を行った。めっき温度
20°C1めっき浴浸漬時間10分の条件で銅めっきを
行った結果、錆付着量18mg/6.25d繊維の試料
が得られ、その体積固有抵抗は30Ω・cmであった。Nickel sulfate・6H20・・・・・・・・・25g
IQ Sodium Hypophosphite・・・・・・30gI
Q Malic acid・・・・・・・・・・・・・・・・・・
・30g/Q succinic acid・・・・・・・・・・・・・・・
・・・・・・16gIQpH・・・・・・・・・・・・
・・・・・・・・・・・・・・・・・・4.5 Example 2 The experiment was conducted in the same manner as in Example 1 except that the sample immersion time in the nickel plating bath was varied. . The relationship between the immersion time and the amount of nickel deposited and volume resistivity of the resulting sample is shown in the following table. - Table 1 11-Example 3 An experiment was conducted in the same manner as in Example 1 except that a copper plating solution was used instead of the nickel plating bath. Copper plating was performed at a plating temperature of 20° C. and a plating bath immersion time of 10 minutes. As a result, a sample of fiber with a rust adhesion of 18 mg/6.25 d was obtained, and its volume resistivity was 30 Ω·cm.
なお、前記鋼めっき液の成分組成は次の通りである。The composition of the steel plating solution is as follows.
硫酸銅・・・・・・・・・・・・・・・・・・25 g
/ QEDTA・・・・・・・・・・・・・・・・・
・・・・60gIQ(化学名:エチレンジアミン−4−
酢酸ナトリウム)
35%ホルマリン・・・・・・・・・・73.5mΩ/
Qp■・・・・・・・・・・・自・・・・・・・・・・
・13実施例4
実施例1において、ポリエステル繊維シートの代りに種
々の高分子繊維を用いた以外は同様にして実験を行った
。その結果を次表に示す。Copper sulfate・・・・・・・・・・・・・・・25 g
/ QEDTA・・・・・・・・・・・・・・・
...60gIQ (chemical name: ethylenediamine-4-
Sodium acetate) 35% formalin 73.5mΩ/
Qp■・・・・・・・・・・・・Self・・・・・・・・・
-13 Example 4 An experiment was conducted in the same manner as in Example 1 except that various polymer fibers were used instead of the polyester fiber sheet. The results are shown in the table below.
12−
表−2
実施例5
実施例1において、試料として、プラスチックシート(
2,5cm X 2.5CI11)を用いた以外は同様
にして実験を行った。シート上に形成された金属被膜の
固着性を調べた。その結果を次表に示す。12-Table-2 Example 5 In Example 1, a plastic sheet (
The experiment was conducted in the same manner except that a 2.5 cm x 2.5 CI11) was used. The adhesion of the metal coating formed on the sheet was investigated. The results are shown in the table below.
表−3
実施例6
実施例1と同様にして得られた表面抵抗2.8Ω/口の
ニッケル付着ポリエステル繊維シー1”(15cmx1
5cm)を、プラスチックシート(ABS樹脂)(縦1
5cm x横15cmX厚さ0 、2 cm )の表面
に貼着した。Table 3 Example 6 A sheet of nickel-adhered polyester fiber sheet 1" (15 cm
5cm) and a plastic sheet (ABS resin) (vertical 1
It was attached to a surface measuring 5 cm x width 15 cm x thickness 0.2 cm).
次にこのシートに対し、そのシールド効果を測定した。Next, the shielding effect of this sheet was measured.
測定装置としては、評価器(TR17301)とスペク
トルアナライザー(TR4172)を用いた。その結果
を表−4及び表−5に示す。また、表−4及び表−5に
は、比較のために、ニッケル付着ポリエステル繊維シー
トを貼着しないプラスチックシートについての測定結果
も示す。As measuring devices, an evaluator (TR17301) and a spectrum analyzer (TR4172) were used. The results are shown in Tables 4 and 5. For comparison, Tables 4 and 5 also show the measurement results for plastic sheets to which the nickel-attached polyester fiber sheet was not attached.
表−4
(電界シールド効果)
表−5
(磁界シールド効果)
なお、表−4及び表−5において、シールド効果は数値
の大きい程良好なことを意味する。Table 4 (Electric field shielding effect) Table 5 (Magnetic field shielding effect) In Tables 4 and 5, the larger the numerical value, the better the shielding effect.
実施例7
実施例1と同様にして得られたニッケル付着量1 、9
mg/ cT#及び表面抵抗2.8Ω/口のニッケル付
着ボ15−
リエステル繊維シート(15c+nX15cm)に、エ
チレン/酢酸ビニル共重合体樹脂(酢酸ビニル含量33
重量%)の軟化フィルムを重ね、冷却ロール間を通して
圧着した。この場合、軟化フィルム樹脂は、ニッケル付
着ポリエステル繊維シートの繊維空隙部内を充填し、フ
ィルム中にニッケル付着ポリエステル繊維が補強材とし
て含有された複合フィルムが形成された。この複合フィ
ルムは、樹脂フィルムや、無機質ボード、金属板に熱融
着させることができる。Example 7 Nickel deposition amount 1, 9 obtained in the same manner as Example 1
Ethylene/vinyl acetate copolymer resin (vinyl acetate content 33
% by weight) were stacked and pressed together by passing between cooling rolls. In this case, the softened film resin filled the fiber voids of the nickel-attached polyester fiber sheet, forming a composite film in which the nickel-attached polyester fibers were contained as a reinforcing material. This composite film can be heat-sealed to a resin film, an inorganic board, or a metal plate.
この複合フィルムを、ABS樹脂板表面に加圧下で13
0℃で熱融着させて積層板を得た。次に、この積層板の
電磁波透過損を、4 G Hz帯用矩形導波管を用いて
測定した結果、装置の測定限界である40dBが得られ
た。This composite film was applied to the surface of the ABS resin plate for 13 minutes under pressure.
A laminate was obtained by heat-sealing at 0°C. Next, the electromagnetic wave transmission loss of this laminate was measured using a rectangular waveguide for the 4 GHz band, and as a result, a measurement limit of 40 dB was obtained.
実施例8
実施例1において、被覆材料として、ポリビニルピリジ
ン溶液に代えて、種々の0.1%重合体溶液を用いた以
外は同様にして実験を行った。その結果を表−6に示す
。Example 8 An experiment was conducted in the same manner as in Example 1, except that various 0.1% polymer solutions were used as the coating material instead of the polyvinylpyridine solution. The results are shown in Table-6.
16−
表−6
+11・・・・・比較例
悼2・・・・・実施例1
実施例9
ポリエチレンフィルムを4−ビニルピリジンモノマー液
中に充分浸漬させて膨潤させた後、液中から取出し、ガ
ラス板上に載置し、低圧水銀ランプによる紫外線光源下
1cmの距離で24時間照射し、ポリスチレンフィルム
表面上で4−ビニルピリジンをグラフト重合させた。16- Table 6 +11...Comparative example 2...Example 1 Example 9 After sufficiently immersing a polyethylene film in a 4-vinylpyridine monomer solution to swell it, take it out from the solution. The film was placed on a glass plate and irradiated with ultraviolet light from a low-pressure mercury lamp at a distance of 1 cm for 24 hours to graft-polymerize 4-vinylpyridine on the surface of the polystyrene film.
このフィルムをO,1,5gIQのPd(112溶液に
浸漬後、実施例1と同様にしてニッケルめっきを施した
結果、プラスチックフィルムの4−ビニルピリジングラ
フト重合面に、ニッケル被膜が形成された。またこの場
合、紫外線照射に際し、銅網をフィルム上に載置すると
、照射部分がよくニッケルめっきされ、プラスチック上
にはニッケル被膜が網状に形成された。This film was immersed in an O, 1.5 g IQ Pd (112) solution, and then nickel plated in the same manner as in Example 1. As a result, a nickel film was formed on the 4-vinylpyridine graft polymerization surface of the plastic film. Furthermore, in this case, when the copper net was placed on the film during ultraviolet irradiation, the irradiated area was well plated with nickel, and a nickel film was formed in the form of a net on the plastic.
実施例10
厚さ0.2mmのポリウレタンゴムシー1〜を、4−ビ
ニルピリジンモノマーの10%メタノール溶液中に30
分間浸漬した後、液中から取上げ、Co−60によるδ
線照射下、LH−Radの照射を行い、シーI−面にビ
ニルピリジンをグラフト重合させた。次に。Example 10 Polyurethane rubber sheets 1~ with a thickness of 0.2 mm were dissolved in a 10% methanol solution of 4-vinylpyridine monomer for 30 min.
After being immersed for a minute, it was taken out of the solution and δ due to Co-60 was removed.
Under radiation irradiation, LH-Rad irradiation was performed to graft-polymerize vinylpyridine on the C-I surface. next.
このシー1〜を濃度0.15g/flのPdC,(12
溶液中に浸漬させた後、実施例1と同様にしてニッケル
めっきを施したところ、ウレタンゴムシート表面にニッ
ケル被膜が形成された。This Sea 1~ is PdC at a concentration of 0.15g/fl, (12
After being immersed in the solution, nickel plating was performed in the same manner as in Example 1, and a nickel film was formed on the surface of the urethane rubber sheet.
実施例11
実施例2において、ポリエステル繊維シー1へにニッケ
ル1.2mg/6.25cJを付着させて得られる体積
固有抵抗600Ω・cmのものにさらに銀を付着させた
。Example 11 In Example 2, 1.2 mg/6.25 cJ of nickel was deposited on the polyester fiber sheet 1, which had a volume resistivity of 600 Ω·cm, and silver was further deposited thereon.
この場合、銀付着量7. ]−mg/6.25cJのも
のは体積固有抵抗163Ω・cm、及び銀付着量13.
7mg/6.25oにのものは体積固有抵抗142Ω・
cmを示した。In this case, the amount of silver deposited is 7. ]-mg/6.25cJ has a volume resistivity of 163Ω・cm and a deposited amount of silver of 13.
The one with 7mg/6.25o has a volume resistivity of 142Ω・
cm is shown.
なお、前記の付着に用いた銀めっき浴の成分組成は次の
通りである。The composition of the silver plating bath used for the above deposition is as follows.
シアン化銀す1−リウム・ ・・・・!b:/ Qシア
ン化す1−リウム ・・・・・5g/ Q水酸化す1〜
リウム ・・・・・1.6./(1水素化はう素す1〜
リウム・・・・・5g/Q温度 ・・・・・70°C
特許出願人 工業技術院長 川 1)裕 部指定代理人
工業技術院製品科学研究所長高橋危司Silver cyanide 1-lium...! b:/Q 1-lium cyanide...5g/Q 1-lium hydroxide
Rium...1.6. /(1hydrogenation is 1~
Lium...5g/QTemperature...70°C Patent applicant: Director of the Agency of Industrial Science and Technology Kawa 1) Yube Designated representative: Keiji Takahashi, Director of Product Science Research Institute, Agency of Industrial Science and Technology
Claims (1)
るポリマー又はオリゴマーを被覆した後、化学めっき処
理を施すことを特徴とする高分子材料表面に対する金属
被膜形成方法。(1) A method for forming a metal film on the surface of a polymeric material, which comprises coating the surface of the polymeric material in advance with a nitrogen-containing polymer or oligomer, and then subjecting the surface to chemical plating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59084745A JPS60228678A (en) | 1984-04-26 | 1984-04-26 | Formation of metallic film on surface of high molecular material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59084745A JPS60228678A (en) | 1984-04-26 | 1984-04-26 | Formation of metallic film on surface of high molecular material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60228678A true JPS60228678A (en) | 1985-11-13 |
JPH0445585B2 JPH0445585B2 (en) | 1992-07-27 |
Family
ID=13839224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59084745A Granted JPS60228678A (en) | 1984-04-26 | 1984-04-26 | Formation of metallic film on surface of high molecular material |
Country Status (1)
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JP (1) | JPS60228678A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03193881A (en) * | 1989-12-22 | 1991-08-23 | Sankei Giken Kogyo Kk | Electroless plating method |
JPH05132784A (en) * | 1991-11-11 | 1993-05-28 | Tokyo Rika Univ | Method for plating vinyl chloride resin |
EP0510711A3 (en) * | 1991-04-25 | 1996-09-11 | Jeffrey M Calvert | Processes and compositions for electroless metallization |
JP2006256031A (en) * | 2005-03-16 | 2006-09-28 | Chisso Corp | Substrate for electroless plating, electroless-plated substrate and its manufacturing method |
JP2007262495A (en) * | 2006-03-28 | 2007-10-11 | Nippon Chem Ind Co Ltd | Electroconductive electroless-plated powder and production method therefor |
JP2008189831A (en) * | 2007-02-06 | 2008-08-21 | Ebara Udylite Kk | Method of conditioning insulation resin and its utilization |
JP2013124390A (en) * | 2011-12-14 | 2013-06-24 | Toyota Motor Corp | Electroless plating treatment method and electroless plating treatment material |
CN104342733A (en) * | 2014-10-28 | 2015-02-11 | 蚌埠富源电子科技有限责任公司 | Nickel plating method of stainless-steel-base glass sealing element |
JP2015190056A (en) * | 2014-03-31 | 2015-11-02 | 株式会社サーテックカリヤ | Electroless-plating method, and electroless-plated article |
CN110656326A (en) * | 2019-09-19 | 2020-01-07 | 山东非金属材料研究所 | Preparation method of polyvinylidene fluoride piezoelectric film surface electrode |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5361453A (en) * | 1992-09-11 | 1994-11-08 | Gerber Garment Technology, Inc. | Bristle bed cleaner for sheet material cutting machine |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50154375A (en) * | 1974-06-04 | 1975-12-12 |
-
1984
- 1984-04-26 JP JP59084745A patent/JPS60228678A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50154375A (en) * | 1974-06-04 | 1975-12-12 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03193881A (en) * | 1989-12-22 | 1991-08-23 | Sankei Giken Kogyo Kk | Electroless plating method |
EP0510711A3 (en) * | 1991-04-25 | 1996-09-11 | Jeffrey M Calvert | Processes and compositions for electroless metallization |
JPH05132784A (en) * | 1991-11-11 | 1993-05-28 | Tokyo Rika Univ | Method for plating vinyl chloride resin |
JP2006256031A (en) * | 2005-03-16 | 2006-09-28 | Chisso Corp | Substrate for electroless plating, electroless-plated substrate and its manufacturing method |
JP4692032B2 (en) * | 2005-03-16 | 2011-06-01 | チッソ株式会社 | Electroless plating substrate, electroless plated substrate and method for producing the same |
JP2007262495A (en) * | 2006-03-28 | 2007-10-11 | Nippon Chem Ind Co Ltd | Electroconductive electroless-plated powder and production method therefor |
KR101305574B1 (en) * | 2006-03-28 | 2013-09-09 | 니폰 가가쿠 고교 가부시키가이샤 | Conductive powder plated by electroless plating and process for producing the same |
JP2008189831A (en) * | 2007-02-06 | 2008-08-21 | Ebara Udylite Kk | Method of conditioning insulation resin and its utilization |
JP2013124390A (en) * | 2011-12-14 | 2013-06-24 | Toyota Motor Corp | Electroless plating treatment method and electroless plating treatment material |
JP2015190056A (en) * | 2014-03-31 | 2015-11-02 | 株式会社サーテックカリヤ | Electroless-plating method, and electroless-plated article |
CN104342733A (en) * | 2014-10-28 | 2015-02-11 | 蚌埠富源电子科技有限责任公司 | Nickel plating method of stainless-steel-base glass sealing element |
CN110656326A (en) * | 2019-09-19 | 2020-01-07 | 山东非金属材料研究所 | Preparation method of polyvinylidene fluoride piezoelectric film surface electrode |
Also Published As
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---|---|
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