JPS601826A - Cathode material for electrolytic condenser - Google Patents
Cathode material for electrolytic condenserInfo
- Publication number
- JPS601826A JPS601826A JP10984083A JP10984083A JPS601826A JP S601826 A JPS601826 A JP S601826A JP 10984083 A JP10984083 A JP 10984083A JP 10984083 A JP10984083 A JP 10984083A JP S601826 A JPS601826 A JP S601826A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- cathode
- deposited film
- cathode material
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Physical Vapour Deposition (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 この発明は電解コンデンサ用陰極材料に関する。[Detailed description of the invention] This invention relates to cathode materials for electrolytic capacitors.
従来、電解コンデンサ用陰極月利としては、アルミニウ
ム箔にエツチングを施して表面積を拡大したものが用い
られていた。ところが、従来の陰極材オ′31では、ア
ルミニウム箔の材質、熱処理条件、エツチング条件など
によって陰極材料としての性能、主として静電容量にば
らつきが生じるという問題がある。また、エツチングは
湿式処理であるため廃液処理の問題がある。Conventionally, as a cathode capacitor for electrolytic capacitors, an aluminum foil whose surface area has been expanded by etching has been used. However, the conventional cathode material O'31 has a problem in that its performance as a cathode material, mainly its capacitance, varies depending on the material of the aluminum foil, heat treatment conditions, etching conditions, etc. Furthermore, since etching is a wet process, there is a problem in waste liquid treatment.
この発明は上記の問題を解決した電解コンデンサ用陰極
材料を提供することを目的とづる。The object of the present invention is to provide a cathode material for electrolytic capacitors that solves the above problems.
この発明による電解コンデンサ用陰極月利は、基材の表
面にQ電性金属からなる蒸着膜が形成されたものである
。The cathode capacitor for an electrolytic capacitor according to the present invention has a vapor deposited film made of a Q conductive metal formed on the surface of a base material.
上記において、基材としてはたとえばポリエステル等の
合成樹脂フィルム、たとえばアルミニウム箔等の導電性
金属箔および紙などが用いられる。基材として合成樹脂
フィルムおよび紙を用いたほうが金属箔を用いるよりも
安価になるので好ましい。In the above, as the base material, for example, a synthetic resin film such as polyester, conductive metal foil such as aluminum foil, paper, etc. are used. It is preferable to use a synthetic resin film or paper as the base material because it is cheaper than using metal foil.
導電性金属としては、Δu、Ag、−1’i、Cr、Z
n1Al、3i 1Ge、Go、Sn、 Ta、Fe
、Cu 、pb 、Ni 13i 、Mn等またはこれ
らの合金が使用されるが、その中でもAl1゜△q 、
Ti 、Crが代表的である。As conductive metals, Δu, Ag, -1'i, Cr, Z
n1Al, 3i 1Ge, Go, Sn, Ta, Fe
, Cu, pb, Ni 13i, Mn, etc. or alloys thereof, among which Al1゜△q,
Typical examples are Ti and Cr.
蒸着膜を形成する方法としては、イオンブレーティング
法、スパッタリング法、真空蒸着法などがある。蒸着膜
の形成は、アルゴン、ヘリウム等の不活性ガス雰囲気中
で行なうことが好ましい。なぜならば、1qられた蒸着
膜の表面に微細な凹部が均一かつ高密度に形成されて陰
極点
材料の表面Vが拡大され、静電容量が増大するからであ
る。また、基材として合成樹脂フィルム等の非導電性材
料を用いた場合には、蒸着膜の厚さを500Å以上にす
ることが好ましい。Examples of methods for forming a deposited film include an ion blasting method, a sputtering method, and a vacuum deposition method. It is preferable that the deposition film is formed in an atmosphere of an inert gas such as argon or helium. This is because fine recesses are uniformly and densely formed on the surface of the 1q deposited film, expanding the surface V of the cathode spot material and increasing the capacitance. Further, when a non-conductive material such as a synthetic resin film is used as the base material, it is preferable that the thickness of the deposited film is 500 Å or more.
500A未満であれば導電性が悪くなるからである。蒸
着膜を形成させるさいの蒸発源と暴利との距離は10〜
100C1llとすることが好ましい。また、蒸着速度
は10〜5000A/SeCとすることが好ましい。This is because if it is less than 500A, the conductivity will be poor. When forming a vapor deposited film, the distance between the evaporation source and the profiteer is 10~
It is preferable to set it as 100C1ll. Further, the deposition rate is preferably 10 to 5000 A/SeC.
この発明による電解コンデンυ用陰極+J Eは上述の
ように構成されているので、基材の月質に無関係に静電
容量を大ぎくづることができる。Since the cathode +JE for electrolytic condenser υ according to the present invention is constructed as described above, the capacitance can be increased to a large extent regardless of the quality of the base material.
しかも、従来の陰極材料のように性能、主として静電容
量にばらつきが生じることもない。また、エツチング処
理を行なう必要がないので、廃液処即の問題もない。Moreover, unlike conventional cathode materials, there is no variation in performance, mainly in capacitance. Furthermore, since there is no need to perform etching treatment, there is no problem with waste liquid disposal.
つぎに、この発明の実施例を比較例とともに示す。Next, examples of the present invention will be shown together with comparative examples.
実施例1
1X10 ”’1orr以下に保った真空槽内の上部に
、厚さ0.1mmのポリエステル・フィルム製基材を配
置しておく。一方、真空槽内の下部でかつ基材の下方に
、チタンからなる蒸着物質を備えた蒸発源を配置してお
く。基材と蒸発源との距離は25cmである。ついで、
蒸発源がらチタンを蒸発させ、30 A / seaの
速度で基材の表面にチタンからなる厚さ1.0μmの蒸
着膜を形成した。こうして、ポリエステル・フィルム製
基材の表面にチタン製蒸着膜を形成してなる陰極材料を
得た。蒸着膜の表面は平滑であった。Example 1 A polyester film base material with a thickness of 0.1 mm is placed in the upper part of a vacuum chamber maintained at a pressure of 1 x 10" or less. , an evaporation source with a vapor deposition material made of titanium is placed.The distance between the substrate and the evaporation source is 25 cm.Then,
Titanium was evaporated from the evaporation source to form a 1.0 μm thick vapor deposited titanium film on the surface of the substrate at a rate of 30 A/sea. In this way, a cathode material was obtained in which a titanium vapor-deposited film was formed on the surface of a polyester film base material. The surface of the deposited film was smooth.
実施例2
蒸着物質として銀を用いたほかは上記実施例1と同様な
条件で、ポリエステル・フィルム製基材の表面に銀製蒸
着膜を形成してなる陰極材料を1F1だ。この蒸着膜の
表面も平滑であった。Example 2 A cathode material 1F1 was prepared by forming a silver vapor deposition film on the surface of a polyester film base material under the same conditions as in Example 1 above, except that silver was used as the vapor deposition substance. The surface of this deposited film was also smooth.
実施例3
アルゴンガス圧9X10 ’Torrに保った真空槽内
の上部に、厚さ0.1mn+のポリエステル・フィルム
製基材を配置しておく。一方、真空槽内の下部でかつ基
材の下方に銀からなる蒸着物質を備えた蒸発源を配置し
ておく。基材と蒸発源との距離は25cmである。そし
て、イオンブレーティング法により基材の表面に銀から
なる厚さ1.0μmの蒸着膜を形成した。こうして、ポ
リエステル・フィルム製基材の表面に銀製蒸着膜を形成
してなる陰極材料を1qだ。蒸着膜の表面には微細な凹
部が均一かつ高密度に形成されていた。Example 3 A polyester film base material with a thickness of 0.1 mm+ is placed at the top of a vacuum chamber maintained at an argon gas pressure of 9×10' Torr. On the other hand, an evaporation source containing a silver vapor deposition material is placed in the lower part of the vacuum chamber and below the substrate. The distance between the substrate and the evaporation source is 25 cm. Then, a deposited film of silver with a thickness of 1.0 μm was formed on the surface of the base material by an ion-blating method. In this way, 1 q of cathode material is obtained by forming a silver vapor-deposited film on the surface of a polyester film base material. Fine depressions were uniformly and densely formed on the surface of the deposited film.
実施例4
基材として表面をクリーニングしたJワさ0゜1mmの
A1100)1製アルミニウム箔を用い、蒸着物質とし
てクロムを用いたほかは上記実施例1と同様な条件で、
アルミニウム箔製基材の表面にクロム製蒸@膜を形成し
てなる陰極4J 1lijlを得た。この蒸着膜の表面
は平滑であった。Example 4 The conditions were the same as in Example 1 above, except that A1100)1 aluminum foil with a J width of 0°1 mm whose surface had been cleaned was used as the base material, and chromium was used as the vapor deposition substance.
A cathode 4J 1lijl was obtained in which a vaporized chromium film was formed on the surface of an aluminum foil base material. The surface of this deposited film was smooth.
実施例5
基材として表面をクリーニングした厚さ0゜1mmのA
1100+−1製アルミニウム箔を用い、蒸着物質とし
てスズを用いたほかは上記実施例1と同様な条件で、ア
ルミニウム箔製基材の表面にスズ製蒸着膜を形成してな
る陰極材料を得た。この蒸着膜の表面も平滑であった。Example 5 A with a thickness of 0°1 mm whose surface was cleaned as a base material
A cathode material was obtained by forming a tin vapor deposited film on the surface of an aluminum foil base material under the same conditions as in Example 1 above, except that 1100+-1 aluminum foil was used and tin was used as the vapor deposition substance. . The surface of this deposited film was also smooth.
実施例6
暴利として表面をクリーニングした厚さ0゜1mmのA
11001−11i1アルミニウム箔を用い、蒸着物質
としてスズを用いたほかは上記実施例3と同様な条件で
、アルミニウム箔製基材の表面にスズ製蒸着膜を形成し
てなる陰極材料を得た。この蒸着膜の表面には微細な凹
部が均一かつ高密度に形成されていた。Example 6 A with a thickness of 0°1 mm whose surface was cleaned for profiteering
A cathode material was obtained by forming a tin vapor deposited film on the surface of an aluminum foil base material under the same conditions as in Example 3 above, except that 11001-11i1 aluminum foil was used and tin was used as the vapor deposition material. Fine depressions were uniformly and densely formed on the surface of this deposited film.
比較例1
厚さQ、1mn+の純度99.8wt%のアルミニウム
箔を、液温60℃の2wt%塩酸溶液中で1〕0.20
A150cm2の電流密度で300秒間エツチングして
陰極材料を得た。Comparative Example 1 An aluminum foil with a purity of 99.8 wt% and a thickness Q of 1 mm+ was heated to 1]0.20 in a 2 wt% hydrochloric acid solution at a liquid temperature of 60°C.
A cathode material was obtained by etching for 300 seconds at a current density of A150 cm2.
上記のようにして得た7種の陰極材料の静電容量を、そ
れぞれ液温30℃の10wI%ホウ酸アンモニウム溶液
中で測定した。その結果を下表にまとめて示す。The capacitances of the seven types of cathode materials obtained as described above were each measured in a 10wI% ammonium borate solution at a liquid temperature of 30°C. The results are summarized in the table below.
以上の結果から明らかなように、この発明による電解コ
ンデンザ用陰極材料は、従来の陰極材料に比較して静電
容量が大きくなっている。As is clear from the above results, the electrolytic capacitor cathode material according to the present invention has a larger capacitance than conventional cathode materials.
以 上 外4名that's all 4 other people
Claims (1)
た電解コンデンサ用陰極材料。A cathode material for electrolytic capacitors in which vaporized @flR made of conductive metal is formed on the surface of a base material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10984083A JPS601826A (en) | 1983-06-17 | 1983-06-17 | Cathode material for electrolytic condenser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10984083A JPS601826A (en) | 1983-06-17 | 1983-06-17 | Cathode material for electrolytic condenser |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS601826A true JPS601826A (en) | 1985-01-08 |
JPH0377651B2 JPH0377651B2 (en) | 1991-12-11 |
Family
ID=14520530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10984083A Granted JPS601826A (en) | 1983-06-17 | 1983-06-17 | Cathode material for electrolytic condenser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS601826A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61180420A (en) * | 1985-02-05 | 1986-08-13 | 昭和アルミニウム株式会社 | Cathode material for electrolytic capacitor |
US6519137B1 (en) | 1999-09-10 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor and production method thereof, and conductive polymer polymerizing oxidizing agent solution |
-
1983
- 1983-06-17 JP JP10984083A patent/JPS601826A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61180420A (en) * | 1985-02-05 | 1986-08-13 | 昭和アルミニウム株式会社 | Cathode material for electrolytic capacitor |
JPH0337293B2 (en) * | 1985-02-05 | 1991-06-05 | Showa Aruminiumu Kk | |
US6519137B1 (en) | 1999-09-10 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor and production method thereof, and conductive polymer polymerizing oxidizing agent solution |
Also Published As
Publication number | Publication date |
---|---|
JPH0377651B2 (en) | 1991-12-11 |
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