JPS60181038U - Flat package integrated circuit - Google Patents
Flat package integrated circuitInfo
- Publication number
- JPS60181038U JPS60181038U JP6810484U JP6810484U JPS60181038U JP S60181038 U JPS60181038 U JP S60181038U JP 6810484 U JP6810484 U JP 6810484U JP 6810484 U JP6810484 U JP 6810484U JP S60181038 U JPS60181038 U JP S60181038U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- flat package
- package integrated
- socket
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connecting Device With Holders (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図aは本考案の一実施例の平面図、同図すは同図a
のF−P型集積回路をソケットに装着した状態を示す断
面図、第2図a、 bは本考案の他の実施例の平面図お
よびソケットに装着した状態の断面図、第3図a、 b
は本考案のさらに他の実施例の平面図およびソケットに
装着した状態の断面図、第4図は従来のF−P型集積回
路の平面図、第5図は、装着相手のソケットの蓋を開い
た状態を示す平面図、第6図は第5図のソケットに第4
図のF−P型集積回路を装着した状態を示す断面図であ
る。
1.5・・・・・・パッケージ本体の位置決め用凸起、
2・・・・・・パッケージ本体の位置決め用凹み、2・
・・・・・ソケットの位置決め用凹み、4,6・・・・
・・ソケットの位置決め用凸起、7・・・・・・パッケ
ージ本体、8・・・・・・ICのリードピン、9・・・
・・・ソケットのリードピン、10・・・・・・押さえ
部材、11,13,15,21・・・・・・F−P型I
C,12,14,16・・・・・・ソケット。Figure 1a is a plan view of an embodiment of the present invention;
2a and 2b are plan views of other embodiments of the present invention, and sectional views of the F-P type integrated circuit installed in the socket, and Figures 3a and b
4 is a plan view of a conventional F-P type integrated circuit, and FIG. 5 is a plan view of another embodiment of the present invention and a cross-sectional view of the device installed in a socket. A plan view showing the open state, Fig. 6 shows the socket in Fig. 5 with the fourth socket.
FIG. 2 is a sectional view showing a state in which the FP type integrated circuit shown in the figure is installed. 1.5...Protrusion for positioning the package body,
2... Recess for positioning the package body, 2.
...Recess for socket positioning, 4,6...
...Protrusion for positioning the socket, 7...Package body, 8...IC lead pin, 9...
... Socket lead pin, 10 ... Holding member, 11, 13, 15, 21 ... F-P type I
C, 12, 14, 16... socket.
Claims (1)
トに設けられた位置決め固定用の凹みまたは凸起にそれ
ぞれ嵌合する凸起または凹みが設けられていることを特
徴とするフラットパッケージ型集積回路。1. A flat package integrated circuit characterized in that the front or back surface of the package body is provided with protrusions or recesses that fit into positioning and fixing recesses or protrusions provided in a socket to which it is attached.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6810484U JPS60181038U (en) | 1984-05-10 | 1984-05-10 | Flat package integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6810484U JPS60181038U (en) | 1984-05-10 | 1984-05-10 | Flat package integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60181038U true JPS60181038U (en) | 1985-12-02 |
Family
ID=30602547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6810484U Pending JPS60181038U (en) | 1984-05-10 | 1984-05-10 | Flat package integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60181038U (en) |
-
1984
- 1984-05-10 JP JP6810484U patent/JPS60181038U/en active Pending
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