JPS60125373A - Production of deposited film - Google Patents
Production of deposited filmInfo
- Publication number
- JPS60125373A JPS60125373A JP23247983A JP23247983A JPS60125373A JP S60125373 A JPS60125373 A JP S60125373A JP 23247983 A JP23247983 A JP 23247983A JP 23247983 A JP23247983 A JP 23247983A JP S60125373 A JPS60125373 A JP S60125373A
- Authority
- JP
- Japan
- Prior art keywords
- raw material
- gaseous raw
- deposited film
- chamber
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Photoreceptors In Electrophotography (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
本発明i堆積膜の製造法に関するもので、特に原料ガス
を放mKよって分解し、所定の温度に設だされた基体上
に堆積膜を形成する堆積膜製造法に関する。Detailed Description of the Invention The present invention relates to a method for producing a deposited film, and particularly relates to a method for producing a deposited film in which a source gas is decomposed by exposure to mK and a deposited film is formed on a substrate set at a predetermined temperature. .
近来、光電変換素子、−子写真用像形成体等を形成する
目的で分解可能なるガスt−減圧にし得る堆hi密内に
導入1−、グロー11に電等の放電によりて上記ガスを
分解し、所定の基体上に堆積膜を形成する手法の開発が
盛んに行なわれている。シランガス又はシランガスと水
素ガス、ヘリウムガス又はアルゴンガスを混合した気体
、さらに必要に応じてノボランガスや7オスフインガス
等のドーピング用ガスを混合した気体を用いることKよ
って得られる水素化アモルファスシリコン(a−81:
Hと略記する)膜は、その電気物性的及び、光物性的優
秀さや大面積化が容易であること、無公害であることな
どのメリットから著しい脚光を浴びている。Recently, for the purpose of forming photoelectric conversion elements, image-forming bodies for secondary photographs, etc., a decomposable gas is introduced into a vacuum chamber and the gas is decomposed by electric discharge into the glow 11. However, methods for forming deposited films on predetermined substrates are being actively developed. Hydrogenated amorphous silicon (a-81 :
Films (abbreviated as H) have been attracting considerable attention due to their excellent electrical and optical properties, ease of fabrication into large areas, and non-polluting properties.
上記の株な堆積膜製造法において、特に基体の温度が堆
ljt膜の電気物性的、光物性的特性に著しい影響を及
ぼすことは広く知られている。従来、所定の基板温度t
−得るために、堆積室内にヒーターを設け、このヒータ
ーを加熱することによって基体の温度をコントロールし
ていたが、ヒータ一温度は概して晶体温反よシ高く、ヒ
ーターと基体が離れている程、その傾向は著しかった。In the above-mentioned method for manufacturing a deposited film, it is widely known that the temperature of the substrate has a significant effect on the electrical and optical properties of the deposited ljt film. Conventionally, a predetermined substrate temperature t
In order to obtain -, a heater was installed in the deposition chamber, and the temperature of the substrate was controlled by heating the heater, but the temperature of the heater was generally higher than the crystalline temperature, and the farther apart the heater and the substrate were, the lower the temperature of the substrate. The trend was remarkable.
特にヒーター4L<はヒーターを被栓している部分が、
原料ガスと接し、基体温度よシ高い温度にまで原料ガス
を加熱している領域が存在する場合1基体上に堆積され
る膜の電気物性的、光学物性的特性に悪影響を及はすと
いう難点がおった。Especially for heater 4L<, the part that plugs the heater is
If there is a region that comes into contact with the source gas and heats the source gas to a temperature higher than the substrate temperature, the problem is that it will adversely affect the electrical and optical properties of the film deposited on the substrate. It was loud.
本発明は上記の点を考慮し、堆積室内に基体温朋よシ尚
い温度領域を形成せずに膜形成を行なうことで良好な電
気物性的、光学物性的特性を有する堆積膜を慴ることを
目的とする。In consideration of the above points, the present invention provides a deposited film having good electrical and optical properties by forming the film without forming a temperature region higher than the substrate temperature in the deposition chamber. The purpose is to
本晃ツJによる堆積膜製造法の特徴とするところは、原
料ガスに放電によって分解し、所定の基体上に堆積膜を
形成する際に、堆積室内に導入される原料ガスを、8積
膜形威に必要な所定の温度に該堆積室外で予め加熱した
上、堆積室内に導入し1基体の表面温度を前記の原料ガ
スの温度と同等の温度に保持し、堆積室内に基板よシ高
い温F!L領域を形成することなく該基体上に膜形成を
行なうことにある。The feature of the deposited film manufacturing method by Honkotsu J is that when the raw material gas is decomposed by electric discharge and a deposited film is formed on a predetermined substrate, the raw material gas introduced into the deposition chamber is divided into 8 laminated films. The substrate is preheated outside the deposition chamber to a predetermined temperature required for formation, and then introduced into the deposition chamber, and the surface temperature of the substrate is maintained at a temperature equivalent to that of the source gas, and the temperature inside the deposition chamber is higher than that of the substrate. Warm F! The object of the present invention is to form a film on the substrate without forming an L region.
以下、図面を参照して本発明を説明する。The present invention will be described below with reference to the drawings.
以下の説明においては、主として堆1jJ(ll!を形
成する基体を亀子写真用円筒状基体とした実繍例につい
て本発明を説明するか、本発明は、長方形の基体を円筒
状の対向電極上に多角形を成すように配置し、アモルフ
ァス感光体膜や演算素子用アモルファス半専体膜を堆積
する目的にも利用することができ、また、金型、バイト
等の摩耗し易い工具等の表面に超硬質膜を堆積すること
によって、耐摩耗性を向上させ、寿命を延ばす目的にも
利用することができる。In the following description, the present invention will mainly be explained with reference to examples of embroidery in which the base forming the stack 1jJ (ll!) is a cylindrical base for Kameko photography. It can also be used for the purpose of depositing amorphous photoreceptor films and amorphous semi-dedicated films for arithmetic elements, and can also be used to deposit amorphous photoreceptor films and amorphous semi-dedicated films for arithmetic elements. By depositing an ultra-hard film on the material, it can be used to improve wear resistance and extend life.
本発明に係る方法を実捲する円筒状プラズマCVD装置
の一例の概略を第1図に示す。第1図中、1は堆積室た
る真空チャンバーを構成している円筒状のカソード電極
、2は該真空チャンバーの中心軸の周りに回転するよう
にこれと同心に配置された対向電極たるアノード電極を
構成している円筒状の基体、3は該真空チャンバーの上
下の壁体、4は該壁体′41:該カソード電極から絶縁
するためのドーナツ形の絶縁〃イシ、5は高周波電源、
6は原料〃ス供紺パイノ、7は排気系、8は堆積室外に
おいて原料ガスを堆積膜形成に必做な所定の温度(15
0°から350℃の範囲内の温度)に予め加熱するため
のヒーター、9は上記の円筒状の基体を回転する回転機
構、lOはアース、11#′i原料ガス放出管を示す。FIG. 1 schematically shows an example of a cylindrical plasma CVD apparatus that implements the method according to the present invention. In FIG. 1, 1 is a cylindrical cathode electrode constituting a vacuum chamber that is a deposition chamber, and 2 is an anode electrode that is a counter electrode that is arranged concentrically with the vacuum chamber so as to rotate around the central axis of the vacuum chamber. 3 is the upper and lower walls of the vacuum chamber; 4 is the wall '41: a donut-shaped insulator for insulating from the cathode electrode; 5 is a high-frequency power source;
6 is a raw material supply navy blue pipe, 7 is an exhaust system, and 8 is a source gas outside the deposition chamber at a predetermined temperature necessary for forming a deposited film (15
9 is a rotation mechanism for rotating the above-mentioned cylindrical base, IO is ground, and 11#'i is a raw material gas discharge pipe.
上記のプラズマCVD装置の動作を簡単に説明する。The operation of the above plasma CVD apparatus will be briefly explained.
まず)真空チャンバー内に円筒状の基板2をセットし、
排気系7によってチャンバー内金真空にする0同時に原
料ガス供給ノやイブ6をヒータ8によって加熱し、基体
2を回転機構9によって回転し、原料ガス供給パイプの
温度が一定になったら、ガス供給パイグ6から原料ガス
fc真窒チャンバー内に供給する。a別ガスはヒーター
8によって堆積膜形成に必要な所定の温度に加熱され7
c原料供給バイブロを通ることによシ、150℃乃至3
50℃の範囲内のDr定の温度となって、原料ガス放出
v11に設けfc多数のガス放出穴から基体2に向けて
放出される。真空チャンバー内にガスが安定して供縮さ
れ、基体シリンダーの温度が一定に保たれている状態で
13.56 P/iHt、の市周波翫源5によりカソー
ド電極1に島周波電圧を印加し、アース接地された基体
2の間でグロー放電を発生させ1ガス分子を分解して基
体上に堆積させ、基体2上に堆積膜、例えはアモルファ
スシリコン膜を成膜する。First) Set a cylindrical substrate 2 in a vacuum chamber,
The inside of the chamber is evacuated by the exhaust system 7. At the same time, the raw material gas supply tube 6 is heated by the heater 8, and the base body 2 is rotated by the rotation mechanism 9. When the temperature of the raw material gas supply pipe becomes constant, the gas is supplied. The raw material gas fc is supplied from the pipe 6 into the true nitrogen chamber. The separate gas a is heated by a heater 8 to a predetermined temperature necessary for forming a deposited film 7
c By passing through the raw material supply vibro, 150℃ to 3
The temperature becomes Dr constant within the range of 50° C., and the raw material gas is discharged toward the base body 2 from a large number of gas discharge holes fc provided in the raw material gas discharge v11. While the gas was stably supplied and condensed in the vacuum chamber and the temperature of the base cylinder was kept constant, an island frequency voltage of 13.56 P/iHt was applied to the cathode electrode 1 by the city frequency voltage source 5. , a glow discharge is generated between the grounded substrates 2, one gas molecule is decomposed and deposited on the substrate, and a deposited film, for example an amorphous silicon film, is formed on the substrate 2.
本発明による製造方法の一実施例として翫この方法によ
シミ子写真用感光ドラムを作製した。この時の作製争件
を泥1表に示す。As an example of the manufacturing method according to the present invention, a photosensitive drum for photosensitive photography was manufactured by this method. The production disputes at this time are shown in Table 1.
こうして得られた電子写真用感光ドラムを帯電露光現像
装置に設置し、■5 kVでQ、2sec間コロナ帯電
を行い直ちに光像を照射した。光源はタングステンラン
グを用い、1.06ux−IIeCの光量を、透過型の
テストチャートを用いて照射した。その後直ちにe荷電
性の現像剤(トナーとキャリアを含む)を部材表面にカ
スケードすることによって感光ドラム表面上に良好なト
ナー画像を得た。The electrophotographic photosensitive drum thus obtained was placed in a charging, exposing and developing device, corona charging was performed at 5 kV for Q, 2 seconds, and a light image was immediately irradiated. A tungsten lung was used as a light source, and a light intensity of 1.06 ux-IIeC was irradiated using a transmission type test chart. Immediately thereafter, a good toner image was obtained on the surface of the photosensitive drum by cascading an e-chargeable developer (containing toner and carrier) onto the surface of the member.
このようにして得られたトナー像を、一旦ゴムチル−ト
でクリーニングし、再び上記作像クリーニング工程を緑
シ返した。繰り返し回数10万回以上行っても画像の劣
化はみられなかった。The toner image thus obtained was once cleaned with a rubber tilter, and the image forming and cleaning process was repeated again. No deterioration of the image was observed even after repeating the test over 100,000 times.
第2図は本発明の方法を実施するのに使用される円筒状
プラズマCVD装置の他の例を示す。この例は、基本的
には第1図に示す装置と同様の栴造を有する。従って第
1図と同じ参照数字によって各部金指示し、その詳細な
説明は省略する。FIG. 2 shows another example of a cylindrical plasma CVD apparatus used to carry out the method of the invention. This example has a construction basically similar to the device shown in FIG. Therefore, each part will be designated by the same reference numerals as in FIG. 1, and detailed explanation thereof will be omitted.
第2図の装置において第1図の装置と大きく異なる部分
はガス放出v11がアノード′電極である円筒状基体2
の内部に設けられ、ガス放出穴が基体の白傷に向けられ
ている点である。この方法によれば原料〃スタ子やその
分解によって生じた喪ノカルやイオンが円筒状基体上に
堆積しつつある膜の表面に衝突することによって、それ
らの分子、ラジカル、イオン等が未結合状態で取ル込オ
れる等の悪影響を及ばずことなく、膜の堆積を行なうこ
とかできる。The major difference between the device shown in FIG. 2 and the device shown in FIG.
The point is that the gas release hole is directed to the white flaw on the base. According to this method, the raw material (stator) and its decomposition causes the particles and ions to collide with the surface of the film that is being deposited on the cylindrical substrate, causing their molecules, radicals, ions, etc. to become unbonded. The film can be deposited without causing any negative effects such as run-in.
第2図に示す装置によシ第1図に示す装置と同様の手順
に従って電子写真用感光ドラムを作製した。仁の時の作
IA条件を表2に示す。こうして得られた感ブ0ドラム
を前記と同様の方法で評価したところ良好な結果が得ら
れた。An electrophotographic photosensitive drum was produced using the apparatus shown in FIG. 2 and following the same procedure as the apparatus shown in FIG. Table 2 shows the IA conditions for cultivation at the time of jin. When the thus obtained drum-free drum was evaluated in the same manner as described above, good results were obtained.
1 第 2 式1 Second ceremony
g1図に、本発明の製造方法を実施するための製造装置
の模式図を示す。又第2図に第2の実施例で用いられる
製造装置の模式図を示す。
l・・・カソード電極、2・・・基体(アノード電極)
、3・・・*全チャンバーの壁体、
4・・・絶縁ガイシ、 5・・・面周I&電源、6・・
・原料ガス供粕I♀イノ、
7・・・排気系、 8・・・ヒーター、9・・・回転機
構、 10・・・アース、11・・・原料ガス放出管。Fig. g1 shows a schematic diagram of a manufacturing apparatus for carrying out the manufacturing method of the present invention. Further, FIG. 2 shows a schematic diagram of a manufacturing apparatus used in the second embodiment. l...Cathode electrode, 2...Substrate (anode electrode)
, 3... *Walls of all chambers, 4... Insulating insulators, 5... Surface circumference I & power supply, 6...
- Raw material gas supply lees I♀INO, 7... Exhaust system, 8... Heater, 9... Rotating mechanism, 10... Earth, 11... Raw material gas discharge pipe.
Claims (1)
を形成する際に1堆積室内に尋人される原料ガスを為堆
積膜形成に必要な所定の温度に該堆積室外で予め加熱し
た上、堆積室内に導入し、基体の表面温度を前記の原料
ガスの温度と同等の温度に保持し、堆積室内に基板よシ
趙い温度領域を形成することなく該基体上に膜形成を行
なうことを特徴とする堆積膜製造法。When the raw material gas is decomposed by electric discharge and a deposited film is formed on a predetermined substrate, the raw material gas that enters one deposition chamber is heated outside the deposition chamber in advance to a predetermined temperature necessary for forming the deposited film. , the substrate is introduced into a deposition chamber, the surface temperature of the substrate is maintained at a temperature equivalent to the temperature of the source gas, and a film is formed on the substrate without forming a temperature region lower than that of the substrate in the deposition chamber. A deposited film manufacturing method characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23247983A JPS60125373A (en) | 1983-12-09 | 1983-12-09 | Production of deposited film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23247983A JPS60125373A (en) | 1983-12-09 | 1983-12-09 | Production of deposited film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60125373A true JPS60125373A (en) | 1985-07-04 |
Family
ID=16939945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23247983A Pending JPS60125373A (en) | 1983-12-09 | 1983-12-09 | Production of deposited film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60125373A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61183469A (en) * | 1985-02-07 | 1986-08-16 | Toshiba Corp | Film forming device |
-
1983
- 1983-12-09 JP JP23247983A patent/JPS60125373A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61183469A (en) * | 1985-02-07 | 1986-08-16 | Toshiba Corp | Film forming device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4452828A (en) | Production of amorphous silicon film | |
JPS60125373A (en) | Production of deposited film | |
JPH0124866B2 (en) | ||
JPS6247486A (en) | Device for producing electrophotographic sensitive body | |
US5098812A (en) | Photosensitive device and manufacturing method for the same | |
JPS60116783A (en) | Apparatus for producing deposited film | |
JPH0418456B2 (en) | ||
JPS6153432B2 (en) | ||
JPS6132851A (en) | Manufacture of amorphous silicon photoconductor | |
JP3368142B2 (en) | Deposition film forming equipment | |
JP2620939B2 (en) | Glow discharge decomposition equipment | |
JPS62198872A (en) | Production of electrophotographic sensitive body | |
JP2925298B2 (en) | Deposition film formation method | |
JPS6247485A (en) | Device for forming deposited film by plasma cvd | |
JPS63479A (en) | Device for forming functional deposited film by plasma cvd method | |
JPS59136474A (en) | Capacity-coupling apparatus for glow discharge decomposition | |
JPH0941149A (en) | Deposited film forming method and deposited film forming device | |
JPS642191B2 (en) | ||
JPS6013075A (en) | Plasma cvd device | |
JP2003129243A (en) | Vacuum treatment method | |
JPH0212265A (en) | Production of electrophotographic sensitive body | |
JPS61232462A (en) | Manufacture of electrophotographic sensitive body | |
JPH02129378A (en) | Device for producing functional deposited film by microwave plasma cvd | |
JPS6311981A (en) | Method for cleaning photoconductive body manufacturing device | |
JPS6024376A (en) | Plasma cvd device |