JPS6011653Y2 - flexible wiring board - Google Patents
flexible wiring boardInfo
- Publication number
- JPS6011653Y2 JPS6011653Y2 JP1977105218U JP10521877U JPS6011653Y2 JP S6011653 Y2 JPS6011653 Y2 JP S6011653Y2 JP 1977105218 U JP1977105218 U JP 1977105218U JP 10521877 U JP10521877 U JP 10521877U JP S6011653 Y2 JPS6011653 Y2 JP S6011653Y2
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- flexible
- slit
- flexible wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
本考案は、柔軟性を有するフレキシブル基板、配線用プ
リント基板に関するものである。[Detailed Description of the Invention] The present invention relates to a flexible board having flexibility and a printed circuit board for wiring.
従来では、第1図に示す如き、490点を接続するフレ
キシブル基板1を作成する場合、横取りにはAXBのサ
イズのものが必要となりきわめて利用率がよくない。Conventionally, when creating a flexible board 1 that connects 490 points as shown in FIG. 1, a board of AXB size is required for interfering, which is extremely inefficient.
本考案はフレキシブル基板の柔軟性を板取り性向上にお
いても利用し、最小の板取りにて所定の配線を可能にす
るフレキシブル基板を提供することを目的する。An object of the present invention is to provide a flexible substrate that utilizes the flexibility of a flexible substrate to improve the ease of cutting the board, and enables predetermined wiring with a minimum amount of cutting.
フレキシブル基板はその柔軟性を利点とした使用目的の
為、複雑な曲線や曲げの入ったものが多いが、この特性
を利用した板取りは行なわれていない。Flexible substrates are used for purposes that take advantage of their flexibility, so many of them have complex curves and bends, but board cutting that takes advantage of this characteristic has not been done.
本考案はフレキシブル基板の柔軟性を板取り向上に利用
したもので、第2図に示す如きスリットを設け、折り返
し、折り曲げ、該−片22の先端22aと残片21の先
端21aとの距離が基板2の寸法Cより大きくすること
により最小の基板で当初の目的を可能とするものである
。The present invention utilizes the flexibility of a flexible substrate to improve board cutting, and by providing a slit as shown in FIG. By making dimension C larger than No. 2, the original purpose can be achieved with the smallest substrate.
また切り欠きスリット3の角の部分には、第3図に示す
ように、円形の形状に切り欠く事により、折り返した場
合に角の部分に加わる力をやわらげる事が可能であり、
基板2の角部における裂けを防止出来る。In addition, as shown in FIG. 3, the corners of the notch slits 3 are cut out in a circular shape to reduce the force applied to the corners when folded back.
This can prevent tearing at the corners of the substrate 2.
以上の如く本考案を実施すれば、その板取りの向上は多
大に節約さる。If the present invention is implemented as described above, the improvement in board cutting will be greatly reduced.
また実施例によればスリットを設けるに際し裂けを防止
し得るものである。Furthermore, according to the embodiment, it is possible to prevent tearing when providing the slits.
第1図は従来のフレキシブル基板を示し第2図は本考案
によるフレキシブル基板を示し第3図は第2図の要部拡
大図を示す。
2:フレキシブル基板、3ニスリツト。FIG. 1 shows a conventional flexible substrate, FIG. 2 shows a flexible substrate according to the present invention, and FIG. 3 is an enlarged view of the main part of FIG. 2: Flexible board, 3 Nisrits.
Claims (1)
入れ、かつ該スリットの切り込み先端部に円形等の裂は
防止を施し、該スリットによって一部左右に分離される
フレキシブル基板の一片22を上記スリット口の切り口
と反対方向に折り返し又は折り曲げ、該フレキシブル基
板の折り返し又は折り曲げ片の先端22aと上記フレキ
シブル配線基板の残片21の先端21aとの距離が上記
フレキシブル基板のスリット方向の寸法Cより大となる
ようにしたことを特徴とするフレキシブル配線基板。A slit 3 is made in one piece of flexible substrate 2 leaving a part, and the tip of the cut of the slit is prevented from forming a circular crack, etc., and a piece 22 of the flexible substrate is partially separated left and right by the slit. The distance between the tip 22a of the folded or bent piece of the flexible substrate and the tip 21a of the remaining piece 21 of the flexible wiring substrate is larger than the dimension C of the flexible substrate in the slit direction. A flexible wiring board characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977105218U JPS6011653Y2 (en) | 1977-08-08 | 1977-08-08 | flexible wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977105218U JPS6011653Y2 (en) | 1977-08-08 | 1977-08-08 | flexible wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5433956U JPS5433956U (en) | 1979-03-06 |
JPS6011653Y2 true JPS6011653Y2 (en) | 1985-04-17 |
Family
ID=29047273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977105218U Expired JPS6011653Y2 (en) | 1977-08-08 | 1977-08-08 | flexible wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6011653Y2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6056415A (en) * | 1983-09-06 | 1985-04-02 | Ishikawajima Harima Heavy Ind Co Ltd | Method and device for cooling extruded material |
JP2007165707A (en) * | 2005-12-15 | 2007-06-28 | Nitto Denko Corp | Flexible wiring circuit board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50129966A (en) * | 1974-04-01 | 1975-10-14 |
-
1977
- 1977-08-08 JP JP1977105218U patent/JPS6011653Y2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50129966A (en) * | 1974-04-01 | 1975-10-14 |
Also Published As
Publication number | Publication date |
---|---|
JPS5433956U (en) | 1979-03-06 |
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