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JPS6011525A - Production of low-viscosity impregnating epoxy resin - Google Patents

Production of low-viscosity impregnating epoxy resin

Info

Publication number
JPS6011525A
JPS6011525A JP11963483A JP11963483A JPS6011525A JP S6011525 A JPS6011525 A JP S6011525A JP 11963483 A JP11963483 A JP 11963483A JP 11963483 A JP11963483 A JP 11963483A JP S6011525 A JPS6011525 A JP S6011525A
Authority
JP
Japan
Prior art keywords
epoxy
parts
resin
viscosity
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11963483A
Other languages
Japanese (ja)
Other versions
JPS6257649B2 (en
Inventor
Hiroyuki Nakajima
博行 中島
Fumiyuki Miyamoto
宮本 文行
Masakazu Murayama
村山 雅一
Wataru Mifuji
美藤 亘
Hideki Chidai
地大 英毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11963483A priority Critical patent/JPS6011525A/en
Publication of JPS6011525A publication Critical patent/JPS6011525A/en
Publication of JPS6257649B2 publication Critical patent/JPS6257649B2/ja
Granted legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain the titled resin having excellent machanical and electrical properties and a long pot life, by adding butylphenyl glycidyl ether, a phenoxy resin, zinc caprylate, and a cyclic acid anhydride successively to a cycloaliphatic epoxy compound. CONSTITUTION:5-50pts.wt. p-t-butylphenyl glycidyl ether of formula I is added to 100pts.wt. cycloaliphatic epoxy compound having 1,2-epoxy group. 0.1- 10pts.wt. phenolic resin of formula II (wherein n is 200-1,000) is added to 100pts.wt. resulting composition. 0.01-1.0pt.wt. zinc caprylate is added to 100pts.wt. resulting composition, and the mixture is heat-treated at 100-150 deg.C for 10-120min and, after cooling, it is mixed with a cyclic acid anhydride. Examples of the cycloaliphatic expoxy compounds include 3,4-epoxy cyclohexylmethyl 3',4'-epoxycyclohexane-carboxylate.

Description

【発明の詳細な説明】 本発明は新規な低粘度ガエポキシ含浸樹脂の製造法に関
するものであり、さらに詳しくは、環状脂肪族エポキシ
化合物を主体とするエポキシ成分と金属塩触媒としての
オクチル酸亜鉛をあらかじめ加熱処理した後、酸無水物
と配合することにより1機械特性、電気特性などの緒特
性にすぐれ、かつポットライフの長い低粘度エポキシ樹
脂の製造法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a novel method for producing a low-viscosity epoxy-impregnated resin, and more specifically, the present invention relates to a method for producing a novel low-viscosity gas epoxy-impregnated resin. The present invention relates to a method for producing a low-viscosity epoxy resin that has excellent properties such as mechanical properties and electrical properties, and has a long pot life, by preheating the resin and then blending it with an acid anhydride.

エポキシ含浸樹脂に関しては、今までに数多くの特許が
出願されてきており、多くのエポキシ系含浸樹脂が実際
の機器に適用されている。
Many patents have been filed for epoxy impregnated resins, and many epoxy impregnated resins are used in actual equipment.

しかし、これらエポキシ含浸樹脂の多くは室温で高粘度
で、かつポットライフも短かいものが多い。低粘度化と
いう方向では希釈剤の添加が一般的な方法であるが、通
常の希釈剤は皮膚刺激性が大きくかつ特性の低下が激し
いものが多く、十分な特性が得られないのが現状である
However, many of these epoxy-impregnated resins have high viscosity at room temperature and often have short pot lives. Adding a diluent is a common method for lowering the viscosity, but the current situation is that the usual diluents are highly irritating to the skin and have a drastic drop in properties, making it difficult to obtain sufficient properties. be.

本発明者らをまこれらの現状に鑑み、上記諸欠点が改良
されたエポキシ含浸樹脂の製造法について釧意研究を重
ねた結果、本発明に到達したものである。
In view of these current circumstances, the present inventors have conducted extensive research on a method for producing an epoxy-impregnated resin that improves the above-mentioned drawbacks, and have arrived at the present invention.

即ち本発明は、/1.2−エポキシ基を有する環状脂肪
族エポキシ化合物100重量部(以下、部とする)に次
式(T)のTI−t−ブチルフェニルグリシジルエーテ
ル 3〜り0部を添加し、得られた組成物(AJ t o 
o部に一般式(n)で示されるフェノキシ樹脂(式中n
は200からtooO) 0 07 % / 0部を添加し、得られた組成物(B) 
t 00部にオクチル酸亜鉛0. Q /〜lO部を添
加して/θO〜/、5−θ℃で10〜/20分間加熱処
理し冷却した後、液状の環状酸無水物を配合することに
より低粘度エポキシ含浸樹脂を製造する方法である。
That is, the present invention includes 3 to 0 parts of TI-t-butylphenyl glycidyl ether of the following formula (T) to 100 parts by weight (hereinafter referred to as "parts") of a cycloaliphatic epoxy compound having a /1.2-epoxy group. and the resulting composition (AJ to
The phenoxy resin represented by the general formula (n) in the o part (in the formula n
is 200 to tooO) 0 07%/0 parts, and the resulting composition (B)
0.00 parts of zinc octylate. A low viscosity epoxy-impregnated resin is produced by adding Q/~lO part to /θO~/, heat-treating at 5-θ°C for 10~/20 minutes, cooling, and then blending a liquid cyclic acid anhydride. It's a method.

本発明においては、エポキシ成分としてl2.2−エポ
キシ基を有する環状工2キシ化合物を主体とし、これに
低粘度希釈剤としてp−t−ブチルフェニルグリシジル
エーテルを用いることが一つの特徴である。p−t−ブ
チルフェニルグリシジルエーテルは低粘度の希釈剤であ
るにもかかわらず、皮膚刺激性が低く、かつ特性低下も
少ない。
One feature of the present invention is that the epoxy component is mainly a cyclic 2-oxy compound having a 12,2-epoxy group, and pt-butylphenyl glycidyl ether is used as a low-viscosity diluent. Although pt-butylphenyl glycidyl ether is a low-viscosity diluent, it has low skin irritation and little deterioration in properties.

さらに本発明の特徴は工2キシ硬化触媒としてオクチル
酸亜鉛という特定の金属塩系触媒を用いかつこの触媒を
予めある温度範囲で所定時間、l。
A further feature of the present invention is that a specific metal salt catalyst called zinc octylate is used as the oxidation curing catalyst, and this catalyst is heated in advance at a certain temperature range for a predetermined period of time.

2−エポキシ基を有する環状エポキシ化合物とp−1−
ブチルフェニルグリシジルエーテル、さらにフェノキシ
樹脂の混合物の中で処理することにより、ポットライフ
の長い含浸樹脂とすることにある。
A cyclic epoxy compound having a 2-epoxy group and p-1-
The purpose is to obtain an impregnated resin with a long pot life by treating it in a mixture of butylphenyl glycidyl ether and a phenoxy resin.

即ち本発明者らは、オクチル酸亜鉛触媒を、l。That is, the present inventors used a zinc octylate catalyst as l.

コーエポキシ基を有する環状エポキシ化合物とp−t−
ブチルフェニルグリシジルエーテル、サラにフェノキシ
樹脂の混合物too部に対し0.0 /〜tO部の割合
で配合し、too−ts:o部の温度範囲で処理した場
合、無触媒下で上記エポキシ化合物の混合物と酸無水物
を配合したものよりも長いポットライフを有することを
見出したものである。
A cyclic epoxy compound having a co-epoxy group and a p-t-
When butylphenyl glycidyl ether is mixed with Sara at a ratio of 0.0/~tO parts to too parts of the phenoxy resin mixture and treated in a temperature range of too-ts:o parts, the above epoxy compound is It has been found that the pot life is longer than that of a mixture containing a mixture and an acid anhydride.

本発明においては、低粘度のエポキシ化合物に高分子量
のフェノキシ樹脂を前者100部に対し0、 / % 
70部の範囲で配合することにより、接着性の向上、可
撓性の付与をもたらしている。
In the present invention, a high molecular weight phenoxy resin is added to a low viscosity epoxy compound at a ratio of 0./% to 100 parts of the former.
By blending within the range of 70 parts, adhesiveness is improved and flexibility is imparted.

本発明においては、含浸樹脂の特性上1.2−エポキシ
基を有する環状エポキシ化合物(以下シクロ系エポキシ
化合物という)を主体f用いるのが望ましいが、ビスフ
ェノールA型エポキシ化合物、グリシジルエステル型エ
ポキシ化合物、ノボラック型エポキシ化合物などをシク
ロ系エポキシ化合物に対し30重量パーセントを越えな
い範囲で使用することができる。
In the present invention, it is desirable to mainly use a cyclic epoxy compound having a 1,2-epoxy group (hereinafter referred to as a cyclo-epoxy compound) due to the characteristics of the impregnating resin, but bisphenol A-type epoxy compounds, glycidyl ester-type epoxy compounds, A novolac type epoxy compound or the like may be used in an amount not exceeding 30% by weight based on the cyclo-epoxy compound.

本発明において用いることのできるシクロ系エポキシ化
合物としては、3.ψ−エポキシシクロヘキシルメチル
−31、F/−エポキシシクロヘキサンカルボキシレー
ト(チッソノックスコ、2/(チッソ社製商品名)、C
Y−/79(チバ社製商品名))、3.’l−エポキシ
−6−メチルシクロヘキシルメチル−J/ 、 ql−
エポキシ−6′−メチルシクロヘキサンカルボキシレー
ト、ビニルシ洟ロヘキセンジオキサイド(チッソノック
ス206(チッソ社製商品名))、ジシクロペンタジェ
ンジオキサイド、ジペンテンジオキサイドなどがある。
Examples of cycloepoxy compounds that can be used in the present invention include 3. ψ-epoxycyclohexylmethyl-31, F/-epoxycyclohexane carboxylate (Chisson Noxco, 2/ (trade name manufactured by Chisso Corporation), C
Y-/79 (product name manufactured by Ciba)), 3. 'l-epoxy-6-methylcyclohexylmethyl-J/, ql-
Examples include epoxy-6'-methylcyclohexane carboxylate, vinyl cyclohexene dioxide (Chissonox 206 (trade name, manufactured by Chisso Corporation)), dicyclopentadiene dioxide, and dipentene dioxide.

本発明においては、上記シクロ系エポキシ化合物i00
部に対し、p−t−ブチルフェニルグリシジルエーテル
は3〜50部の範囲で用いる。添加量が5部以下では粘
度が十分に低くならず、SO部を越えると硬化物特性が
低下する。
In the present invention, the above cycloepoxy compound i00
pt-butylphenyl glycidyl ether is used in a range of 3 to 50 parts. If the amount added is less than 5 parts, the viscosity will not be sufficiently lowered, and if it exceeds the SO part, the properties of the cured product will deteriorate.

又、エポキシ化合物に添加する一般式(rr)で表わさ
れるフェノキシ樹脂の量はシクロ系エポキシ化合物とp
−t−ブチルフェニルグリシジルエーテルの混合物10
0部に対しQ、 / % / Q部が望ましい。添加量
が01部に満たないとフェノキシ樹脂の添加による効果
である接着性の向上、可撓性の付与が現われない。又、
添加量が10部を越えるとフェノキシ樹脂添加効果は得
られるが、含浸樹脂粘度の上昇、ポットライフの短縮が
みられ、好ましくない。
Also, the amount of phenoxy resin represented by the general formula (rr) added to the epoxy compound is the same as that of the cyclo-epoxy compound and p
-t-butylphenyl glycidyl ether mixture 10
Q, / % / Q part is desirable for 0 part. If the amount added is less than 0.1 part, the effects of adding the phenoxy resin, such as improving adhesion and imparting flexibility, will not appear. or,
If the amount added exceeds 10 parts, the effect of adding the phenoxy resin can be obtained, but the viscosity of the impregnated resin will increase and the pot life will be shortened, which is not preferable.

さらに、ここで得られたフェノキシ樹脂を配合したエポ
キシ混合物に対するオクチル酸亜鉛の添加量は0.0 
/〜10部が望ましい。添加量が001部に満たないと
、加熱処理効果によるポットライフの延長の効果が十分
でtr <、IO部を越えると逆にポットライフが短か
くなる。
Furthermore, the amount of zinc octylate added to the epoxy mixture blended with the phenoxy resin obtained here was 0.0
/~10 parts is desirable. If the amount added is less than 0.01 parts, the effect of extending the pot life due to the heat treatment effect is sufficient, and if it exceeds tr < 10 parts, the pot life will be shortened.

ここで、オクチル酸亜鉛添加後の加熱処理温度は100
〜l左θ℃が望ましく、too℃に満たないと図に示す
ように顕著な効果が得られず、iro℃を越えると逆に
ポットライフが短かくなる。この加熱処理温度による効
果の原因は明確ではないが、加熱処理によりオクチル酸
亜鉛が均一に付加し、そのためポットライフが長くなる
こと(7) が考えられる。
Here, the heat treatment temperature after addition of zinc octylate is 100
~1 left θ°C is desirable; if it is less than too°C, no significant effect will be obtained as shown in the figure, and if it exceeds iro°C, the pot life will be shortened. The cause of this effect due to heat treatment temperature is not clear, but it is thought that zinc octylate is added uniformly through heat treatment, which lengthens the pot life (7).

本発明に用いることのできる液状の環状酸無水物として
は、メチルテトラヒドロフタル酸無水物としてのHN−
x2oo(日立化成社製商品名)。
The liquid cyclic acid anhydride that can be used in the present invention includes HN- as methyltetrahydrophthalic anhydride.
x2oo (trade name manufactured by Hitachi Chemical).

QH−200(日本ゼオン社製商品名)など、メチルへ
キサヒドロフタル酸無水物としてのHN−rr00(日
立化成社製商品名)、メチルエンドメチレンテトラヒド
ロフタル酸無水物としての無水メチルハイミック酸(日
立化成社製商品名)、ヘキサヒドロフタル酸無水物など
があげられる。
QH-200 (trade name manufactured by Nippon Zeon Co., Ltd.), HN-rr00 (trade name manufactured by Hitachi Chemical Co., Ltd.) as methylhexahydrophthalic anhydride, methylhimic anhydride as methylendomethylenetetrahydrophthalic anhydride (trade name manufactured by Hitachi Chemical Co., Ltd.), hexahydrophthalic anhydride, etc.

以下に本発明の製造法を実施例により説明する。The manufacturing method of the present invention will be explained below using Examples.

実施例 l シクロ系エポキシ化合物として前記したCY−/7? 
tO部に対し、p−t−ブチルフェニルグリシジルエー
テル−0部を配合し、フェノキシ樹脂io部を加え/、
10℃でコ時間加熱し、溶解させた後、オクチル酸亜鉛
02重量部を加え120℃で30分加熱処理し、25℃
まで冷却した後。
Example l CY-/7? mentioned above as a cyclo-epoxy compound?
Blend 0 parts of pt-butylphenyl glycidyl ether to t0 parts, add io parts of phenoxy resin/,
After heating at 10°C for 1 hour to dissolve, add 02 parts by weight of zinc octylate, heat-treating at 120°C for 30 minutes, and melting at 25°C.
After cooling until.

酸無水物として前記したH N −2200700部を
加え、エポキシ含浸樹脂を製造した。この樹脂(ざ ) 湿度35%の恒温恒湿槽に放置し、粘度を測定すること
により追跡した。すなわち、この測定で23℃での粘度
が200センチポイズに達するまでの日数をポットライ
フとした。図は製造したエポキシ含浸樹脂の25℃にお
ける粘度の経時変化を示す。上記含浸樹脂の粘度は30
日後で240センチポイズ、また500センチポイズに
達するまでのポットライフとして3力月以上と良好な性
質を示した(図中百MA)。
700 parts of HN-2200 described above as an acid anhydride was added to produce an epoxy-impregnated resin. This resin was left in a constant temperature and humidity bath at a humidity of 35% and tracked by measuring the viscosity. That is, in this measurement, the number of days until the viscosity at 23° C. reached 200 centipoise was defined as the pot life. The figure shows the change over time in the viscosity of the produced epoxy-impregnated resin at 25°C. The viscosity of the above impregnated resin is 30
It showed good properties with a pot life of 3 months or more until it reached 240 centipoise after a day and 500 centipoise (100 MA in the figure).

この樹脂をtSO℃で14時間硬化させ、硬化物とした
。この硬化物の曲げ強度は25℃で/10kp/−を示
し、200℃16日後の加熱重量減少はユコ%と良好な
特性を示した。
This resin was cured at tSO° C. for 14 hours to obtain a cured product. The bending strength of this cured product was /10 kp/- at 25°C, and the weight loss after heating at 200°C for 16 days was % Yuco, which showed good properties.

サラにヘリカルコイル法による接着強度測定では/’l
!に9とすぐれた値を示した(いずれもJIEIC21
03による)。又、このものの皮膚刺激性試験では、皮
膚にいかなる変化も観測されなかった。
When measuring adhesive strength using the helical coil method, /'l
! showed an excellent value of 9 (both JIEIC21
03). Also, in a skin irritation test of this product, no changes were observed on the skin.

実施例 コ 上記実施例1と同一の方法でオクチル酸亜鉛の加熱処理
条件を100℃、30分としてエポキシ含浸樹脂を製造
した。実施例1と同様な方法でのポットライフ試験では
、2部℃30日後の粘度で2gθセンチボイズ、また栂
、2部℃でのポットライフは3力月以上と良好な性質を
示した(図中曲線B)。
Example C An epoxy-impregnated resin was produced in the same manner as in Example 1 above, with the heat treatment conditions for zinc octylate being 100°C and 30 minutes. In a pot life test conducted in the same manner as in Example 1, the viscosity after 30 days at 2 parts °C was 2gθ centiboise, and the pot life at 2 parts °C was 3 months or more, showing good properties (in the figure). Curve B).

また、実施例1と同様の硬化条件で硬化させた樹脂の性
質も、実施例1の樹脂とほぼ同等の良好な特性を示した
Further, the properties of the resin cured under the same curing conditions as in Example 1 also showed good properties almost equivalent to those of the resin in Example 1.

実施例 3 上記実施例/と同一の方法で、オクチル酸亜鉛の加熱処
理条件だけを/’10℃30分に変えてエポキシ含浸樹
脂を製造した。製造した樹脂の実施例1と同様の方法に
よるポットライフ試験では、2部℃30日後の粘度で2
50センチポイズ。
Example 3 An epoxy-impregnated resin was produced in the same manner as in Example 3 above, except that the heat treatment conditions for zinc octylate were changed to 10° C. for 30 minutes. In a pot life test of the produced resin in the same manner as in Example 1, the viscosity of 2 parts after 30 days at ℃ was 2.
50 centipoise.

2!r℃でのポットライフは3力月以上と良好な性質を
示した(図中直線C)。
2! The pot life at r°C was 3 months or more, indicating good properties (straight line C in the figure).

また、実施例1と同様な硬化条件で硬化させた樹脂の性
質も、実施例/の樹脂とほぼ同等の良好な特性を示した
Further, the properties of the resin cured under the same curing conditions as in Example 1 also showed good properties almost equivalent to those of the resin in Example/.

比較例 l シクロ系エポキシ樹脂としてCY−17910部に対し
、p−t−ブチルフェニルグリシジルエーテル20部を
配合し、フェノキシ樹脂70部を加え730℃でコ時間
加熱し溶解させた後、2部℃まで冷却後、酸無水物とし
てHN−2,200′fK:100部加えエポキシ含浸
樹脂を製造した。
Comparative Example l 20 parts of pt-butylphenylglycidyl ether was blended with 10 parts of CY-179 as a cyclo-based epoxy resin, 70 parts of phenoxy resin was added, heated at 730°C for an hour to dissolve, and then 2 parts After cooling to 100%, 100 parts of HN-2,200'fK was added as an acid anhydride to produce an epoxy-impregnated resin.

実施例1と同様の方法によるポットライフ試験では、こ
のものは25℃で3C日後の粘度かに/。
In a pot life test conducted in the same manner as in Example 1, this product had a viscosity of 1/2 after 3C days at 25°C.

センチポイズと実施例1〜、?と比較し大きな粘度上昇
を示し、ポットライフが短いことが明らかである(図中
直線D)。
Centipoise and Example 1~? It is clear that the viscosity increased significantly compared to the above, and the pot life was short (straight line D in the figure).

比較例 コ 上記実施例1と同一の方法でオクチル酸亜鉛のしフ′ 加熱処理条件だ\をg 00C30分にしてエポキシ含
浸樹脂を製造した。
Comparative Example An epoxy-impregnated resin was produced in the same manner as in Example 1 above, with the heat treatment conditions for zinc octylate being 30 minutes at 00C.

実施例/と同様な方法によるポットライフ試験では、こ
のものは23℃、30日俵の粘度がzo。
In a pot life test conducted in the same manner as in Example, this product had a viscosity of zo at 23° C. and a 30-day bale.

センチポイズと実施例1〜3に比較し大きな粘度(ll
) 上昇を示し、ポットライフが短かいことは明らかである
(図中直線E)。
centipoise and a larger viscosity (ll
) It is clear that the pot life is short (straight line E in the figure).

実施例 V シクロ系エポキシ化合物としてCY−77970部に、
GY−2タタ 10部、p−t−ブチルフェニルグリシ
ジルエーテル20部を配合シ、フェノキシ樹脂一部を加
えiqo℃でコ時間で溶解させた後、オクチル酸亜鉛0
.7部を加え、130℃で30分加熱処理し、23℃ま
で冷却し、さらに酸無水物としてHN−!rk00の9
部部を加えエポキシ含浸樹脂を製造した。この樹脂の初
期粘度は23℃で/90センチポイズを示した。実施例
1と同様な方法によるポットライフ試験では、SOOセ
ノチボイズに達するまでの2ツトライフは3力月以上と
良好な性質を示した。このものを750℃で76時間硬
化させ硬化物とした。この硬化物の曲げ強度は2部℃で
lユoklI/−を示し、200℃i t、日後の加熱
重量減少は:L2%と良好な値を示した。さらにヘリカ
ルコイル法による接着強度測定では/9.Oklとすぐ
れた値を示した(、Tl5(12) C2103による)。
Example V CY-77970 parts as a cyclo-epoxy compound,
Blend 10 parts of GY-2 Tata and 20 parts of pt-butylphenyl glycidyl ether, add a part of phenoxy resin and dissolve at iqo℃ for 1 hour, then add 0 parts of zinc octylate.
.. 7 parts were added, heat treated at 130°C for 30 minutes, cooled to 23°C, and further converted to HN-! as an acid anhydride. rk00 no 9
An epoxy-impregnated resin was produced by adding a part. The initial viscosity of this resin was 90 centipoise at 23°C. In a pot life test conducted in the same manner as in Example 1, the pot life was 3 months or more before reaching SOO cell size, indicating good properties. This product was cured at 750° C. for 76 hours to obtain a cured product. The bending strength of this cured product was 2 parts 1/- at 200°C, and the weight loss after heating at 200°C was 2%, which was a good value. Furthermore, the adhesive strength measurement using the helical coil method was /9. It showed an excellent value of Okl (according to Tl5(12) C2103).

また、このものの皮膚刺激性試験では、皮膚のいかなる
変化も観測されなかった。
Also, in a skin irritation test of this product, no changes in the skin were observed.

実施例 ! シクロ系エポキシ化合物としてC’Y−/’19 9部
部に対し、T)−t−プチルアェニルグリシジルエーテ
ルタ部を配合し、フェノキシ樹脂3部を加え。
Example ! As a cyclo-based epoxy compound, 9 parts of C'Y-/'19 were blended with 9 parts of T)-t-butylarhenylglycidyl ether, and 3 parts of phenoxy resin was added.

130℃で2時間で溶解させた後、オクチル酸亜鉛02
部を加え、119℃で30分加熱処理し、2部℃まで冷
却し、さらに酸無水物として無水メチルハイミック酸1
00部を加え、エポキシ含浸樹脂を製造した。この樹脂
の:1g℃での初期粘度はtgoセンチIイズを示した
。また、実施例1と同様の方法によるポットライフ試験
では、SOOセy チ4イズに達するまでのポットライ
フで3力月以上と良好な性質を示した。
After dissolving at 130°C for 2 hours, zinc octylate 02
1 part of methylhimic acid anhydride was added, heated at 119°C for 30 minutes, cooled to 2 parts°C, and added 1 part of methylhimic acid anhydride as an acid anhydride.
00 parts were added to produce an epoxy-impregnated resin. The initial viscosity of this resin was 1 g at 1 g°C. In addition, in a pot life test conducted in the same manner as in Example 1, the pot life until reaching SOO cell size was 3 months or more, showing good properties.

このものをtS−O℃で16時間硬化させ、硬化物とし
た。この硬化物の曲げ強度は25℃で11g−一を示し
、200℃lル日後の加熱重量減少は二t%と良好な性
質を示した。またヘリヵルコイル法による接着強度は、
tgkgとすぐれた値を示した(いずれもJIS C2
103による)。
This product was cured at tS-O°C for 16 hours to obtain a cured product. The bending strength of this cured product was 11 g-1 at 25 DEG C., and the weight loss after heating at 200 DEG C. was 2 t%, showing good properties. In addition, the adhesive strength by the helical coil method is
It showed an excellent value of tgkg (both JIS C2
103).

このものの皮膚刺激性試験では、皮膚のいかなる変化も
観測されなかった。
In the skin irritation test of this product, no changes in the skin were observed.

比較例 3 p −t −7’チルフエニルグリシジルエーテルの代
りに一般的な希釈剤であるタレジルグリシジルエーテル
を使用した以外は、実施例/と同じ方法で含浸樹脂を製
造した。この樹脂の2!;′Cにおける初期粘度ばlグ
Qセンチポイズであった。
Comparative Example 3 An impregnated resin was produced in the same manner as in Example 3, except that talesyl glycidyl ether, a common diluent, was used instead of p-t-7' tylphenyl glycidyl ether. 2 of this resin! The initial viscosity at C was Q centipoise.

実施例1と同様な方法でこの樹脂のポットライフを測定
した結果SOOセンチポイズに達するまでの日数は2!
日で短かいポットライフしか示さなかった。また、この
樹脂の皮膚刺激性試験によれば皮膚に軽度の炎症がみら
れた。
The pot life of this resin was measured in the same manner as in Example 1, and the number of days until it reached SOO centipoise was 2!
It showed only a short pot life in days. Furthermore, according to a skin irritation test of this resin, mild inflammation was observed on the skin.

この樹脂な/jθ0Cで76時間硬化させ硬化物とした
。この硬化物の曲げ強度は2!℃で9.0に9/dであ
り、200℃/6日後の加熱型を沖少は75%、ヘリカ
ルコイル法による接着強度は23℃でtlOkgと実施
例1の方法により得られた樹脂と比較し、諸性質の低い
ものしか得られなかった(JIS Cコ103による)
This resin was cured at /jθ0C for 76 hours to obtain a cured product. The bending strength of this cured product is 2! The adhesive strength of the heated mold after 200°C/6 days was 75%, and the adhesive strength by helical coil method was tlOkg at 23°C, and the resin obtained by the method of Example 1. When compared, only those with poor properties were obtained (according to JIS C Co. 103)
.

比較例 グ フェノキシ樹脂のみを使用せず、他は実施例1と同じ方
法によりエポキシ含浸樹脂を製造した。
Comparative Example An epoxy-impregnated resin was produced in the same manner as in Example 1 except that the gphenoxy resin was not used.

この樹脂の2!℃における初期粘度は12タセンチボイ
ズであった。実施例1と同様な方法によるポットライフ
は、実施例1で得られた樹脂とほぼ同等であった。また
、/jtO℃で/乙時間硬化させた硬化物の性質では曲
げ強度と加熱重量減少の特性は実施例1の結果とほぼ同
等であったが、接着強度は/ !!rlq7と低い値を
示した。
2 of this resin! The initial viscosity at °C was 12 tacentivoise. The pot life obtained by the same method as in Example 1 was approximately the same as that of the resin obtained in Example 1. In addition, the properties of the cured product cured at /jtO℃ for /2 hours were almost the same as the results of Example 1 in terms of bending strength and heating weight loss, but the adhesive strength was /! ! It showed a low value of rlq7.

以上、実施例で述べたように本発明の製造法によれば、
ポットライフが長く、かつ硬化物性の良力ゝ゛′ 好な低粘度エポキシ含浸樹脂濁得られる。
As described above in the examples, according to the manufacturing method of the present invention,
A low-viscosity epoxy-impregnated resin having a long pot life and good curing properties is obtained.

【図面の簡単な説明】[Brief explanation of drawings]

図は実施例または比較例において製造したエポキシ含浸
樹脂のユA−cにおける粘度の経時変化を示す線図であ
る。 代理人 大 岩 増 雄 (/、1) 経過日 &(日) (16) 第1頁の続き の発 明 者 地大英毅 尼崎市塚口本町8丁目1番1号 三菱電機株式会社生産技術研究 所内
The figure is a diagram showing the change over time in the viscosity of the epoxy-impregnated resin produced in Examples or Comparative Examples in U-A-c. Agent Masuo Oiwa (/, 1) Date of elapsed & (days) (16) Inventor of the continuation of page 1 Takeshi Daiei Mitsubishi Electric Corporation Production Technology Laboratory, 8-1-1 Tsukaguchi Honmachi, Amagasaki City

Claims (3)

【特許請求の範囲】[Claims] (1) l、2−エポキシ基を有する環状脂肪族エポキ
シ化合物100重量部に次式(I)のp−t−ブチルフ
ェニルグリシジルエーテル CH30 t−go重量部を添加し、得られた組成物(A) t 
00重量部に一般式(II)で示されるフェノキシ樹脂
+27−70重量部を添加し、得られた組成物(B)1
00重量部にオクチル酸亜鉛0.07〜/θ重量部を添
加して700〜150℃で10〜/20分間加熱処理し
冷却した後、液状の環状酸無水物を配合することを特徴
とする低粘度エポキシ含浸樹脂の製造法。
(1) Parts by weight of pt-butylphenyl glycidyl ether CH30 t-go of the following formula (I) were added to 100 parts by weight of a cycloaliphatic epoxy compound having an l,2-epoxy group, and the resulting composition ( A) t
Composition (B) 1 obtained by adding 27-70 parts by weight of a phenoxy resin represented by general formula (II) to 00 parts by weight
00 parts by weight of zinc octylate, heat-treated at 700 to 150°C for 10 to 20 minutes, cooled, and then blended with a liquid cyclic acid anhydride. Method for producing low viscosity epoxy impregnated resin.
(2)t、S−エポキシ基を有する環状脂肪族エポキシ
樹脂が3.ダーエポキ汐クロヘキシルメチル−sl 、
 tI/−エポキシシクロヘキサンカルボキシレート、
3.グーエポキシ−6−メチルシクロヘキシルメチル−
3/ 、 f−エポキシ−61−メチルシクロヘキサン
カルボキシレート、ビニルシクロヘキセ/ジオキサイド
、ジシクロペンタジェンジオキサイド、またはジペンテ
ンジオキサイドである特許請求の範囲第1項記載の低粘
度エポキシ含浸樹脂の製造法。
(2) A cycloaliphatic epoxy resin having a t,S-epoxy group is 3. epoxy chlorohexylmethyl-sl,
tI/-epoxycyclohexane carboxylate,
3. Goo epoxy-6-methylcyclohexylmethyl-
3/, f-epoxy-61-methylcyclohexane carboxylate, vinylcyclohexe/dioxide, dicyclopentadiene dioxide, or dipentene dioxide. Law.
(3)液状の環状酸無水物がヘキサヒドロフタル酸無水
物、メチルへキサヒドロフタル酸無水物。 メチルテトラヒドロフタル酸無水物、またはメチルエン
ドメチレンテトラヒドロフタル酸無水物である特許請求
の範囲第1項記載の低粘度エポキシ含浸樹脂の製造法。
(3) The liquid cyclic acid anhydride is hexahydrophthalic anhydride and methylhexahydrophthalic anhydride. 2. The method for producing a low-viscosity epoxy-impregnated resin according to claim 1, which is methyltetrahydrophthalic anhydride or methylendomethylenetetrahydrophthalic anhydride.
JP11963483A 1983-06-29 1983-06-29 Production of low-viscosity impregnating epoxy resin Granted JPS6011525A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11963483A JPS6011525A (en) 1983-06-29 1983-06-29 Production of low-viscosity impregnating epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11963483A JPS6011525A (en) 1983-06-29 1983-06-29 Production of low-viscosity impregnating epoxy resin

Publications (2)

Publication Number Publication Date
JPS6011525A true JPS6011525A (en) 1985-01-21
JPS6257649B2 JPS6257649B2 (en) 1987-12-02

Family

ID=14766299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11963483A Granted JPS6011525A (en) 1983-06-29 1983-06-29 Production of low-viscosity impregnating epoxy resin

Country Status (1)

Country Link
JP (1) JPS6011525A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006022693A1 (en) * 2004-08-05 2006-03-02 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
US7247683B2 (en) 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
US8053587B2 (en) 2000-03-31 2011-11-08 Henkel Corporation Reworkable thermosetting resin composition

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62115213A (en) * 1985-11-14 1987-05-26 株式会社クボタ Apparatus for loading seedling growing box
JPH058826Y2 (en) * 1986-07-16 1993-03-04

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8053587B2 (en) 2000-03-31 2011-11-08 Henkel Corporation Reworkable thermosetting resin composition
WO2006022693A1 (en) * 2004-08-05 2006-03-02 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
US7247683B2 (en) 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices

Also Published As

Publication number Publication date
JPS6257649B2 (en) 1987-12-02

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