[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JPS6490266A - Adhesive composition - Google Patents

Adhesive composition

Info

Publication number
JPS6490266A
JPS6490266A JP24366387A JP24366387A JPS6490266A JP S6490266 A JPS6490266 A JP S6490266A JP 24366387 A JP24366387 A JP 24366387A JP 24366387 A JP24366387 A JP 24366387A JP S6490266 A JPS6490266 A JP S6490266A
Authority
JP
Japan
Prior art keywords
meth
compound
acrylate
adhesive composition
desirable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24366387A
Other languages
Japanese (ja)
Inventor
Junichi Kazami
Koichi Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP24366387A priority Critical patent/JPS6490266A/en
Publication of JPS6490266A publication Critical patent/JPS6490266A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE:To obtain an adhesive composition curable within a short time at low temperature and excellent in adhesiveness, by mixing a compound having a polymerizable ethylenically unsaturated bond with a photopolymerization initiator, a peroxy ester and a bivalent cobalt compound. CONSTITUTION:This adhesive composition comprises a compound (A) having a polymerizable ethylenically unsaturated bond, a photopolymerization initiator (B), a peroxy ester (C) and a bivalent cobalt compound (D). It is desirable for obtaining good adhesive strength that said compound (A) contains an unsaturated polyester and/or a polyurethane poly(meth)acrylate. Because an unsaturated polyester and a polyurethane poly(meth)acrylate are usually liquid having high viscosity at room temperature and are very poor in workability as an adhesive, it is necessary to use them together with a low viscosity (meth)acrylate. In order to improve the adhesion to various materials, it is desirable to use them together with other (meth)acrylates.
JP24366387A 1987-09-30 1987-09-30 Adhesive composition Pending JPS6490266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24366387A JPS6490266A (en) 1987-09-30 1987-09-30 Adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24366387A JPS6490266A (en) 1987-09-30 1987-09-30 Adhesive composition

Publications (1)

Publication Number Publication Date
JPS6490266A true JPS6490266A (en) 1989-04-06

Family

ID=17107152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24366387A Pending JPS6490266A (en) 1987-09-30 1987-09-30 Adhesive composition

Country Status (1)

Country Link
JP (1) JPS6490266A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5466293A (en) * 1993-01-14 1995-11-14 Konica Corporation Coating apparatus for providing a superficial protective layer on a card
WO2001074952A1 (en) * 2000-03-30 2001-10-11 Sericol Limited A radiation-curable composition
WO2023018212A1 (en) * 2021-08-11 2023-02-16 주식회사 삼양사 Composition for adhesion of dissimilar materials, and preparation method therefor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5466293A (en) * 1993-01-14 1995-11-14 Konica Corporation Coating apparatus for providing a superficial protective layer on a card
WO2001074952A1 (en) * 2000-03-30 2001-10-11 Sericol Limited A radiation-curable composition
JP2003533554A (en) * 2000-03-30 2003-11-11 セリコル リミテッド Radiation curable composition
US7202285B2 (en) 2000-03-30 2007-04-10 Sericol Limited Radiation-curable composition
WO2023018212A1 (en) * 2021-08-11 2023-02-16 주식회사 삼양사 Composition for adhesion of dissimilar materials, and preparation method therefor
KR20230024455A (en) * 2021-08-11 2023-02-21 주식회사 삼양사 Composition for bonding heretogeneous materials and method for preparing the same

Similar Documents

Publication Publication Date Title
EP0096500B1 (en) Two-part self-indicating adhesive composition
ES8607355A1 (en) Methacrylate-based compositions.
AU528364B2 (en) Radiation cured block copolymer adhesive composition
EP0926214A3 (en) Adhesive composition for display unit intergral with touch panel, adhesive film, display unit integral with touch panel, and production method thereof
ATE32743T1 (en) PHOTOCROSSLINKABLE ADHESIVE COMPOSITIONS.
FR2396033B1 (en)
CN102850973A (en) Low-water-absorptivity acrylate structural adhesive and preparation method thereof
EP0202782A3 (en) Process for the production of a thermoplastic elastomer composition
JPS56122802A (en) Radiation-curable resin composition
JPS5626966A (en) Pressure-sensitive adhesive composition
JPS6490266A (en) Adhesive composition
CA2555094A1 (en) Aromatic/acrylate tackifier resin and acrylic polymer blends
JPS6460677A (en) Acrylic pressure-sensitive adhesive composition
DK352388D0 (en) ACRYLIC BASED COMPLETE POLYMER
TW363950B (en) A primer, metal plate-bonded concrete and method for bonding a metal plate to concrete
AU651954B2 (en) New starter systems initiating polymerization of ethylenically unsaturated compounds and their use
JPS6424876A (en) Self-adhesive composition
WO2002048274A3 (en) Flexible and viscoplastic methacrylate adhesives
JPS6414221A (en) Fluorinated copolymer composition
JPS56166281A (en) Pressure-sensitive adhesive composition
KR100341985B1 (en) Structural Acrylic Adhesive Composition
JPS6426686A (en) Adhesive
JPS5774374A (en) Adhesive composition
JPS5767610A (en) Anaerobic curable composition
JPS5488938A (en) Adhesive composition