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JPS6487667A - Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature - Google Patents

Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature

Info

Publication number
JPS6487667A
JPS6487667A JP24340987A JP24340987A JPS6487667A JP S6487667 A JPS6487667 A JP S6487667A JP 24340987 A JP24340987 A JP 24340987A JP 24340987 A JP24340987 A JP 24340987A JP S6487667 A JPS6487667 A JP S6487667A
Authority
JP
Japan
Prior art keywords
epoxy resin
10pts
composition
bisphenol
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24340987A
Other languages
Japanese (ja)
Inventor
Masato Nakagawa
Hajime Yamazaki
Tomoaki Dobashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama Rubber Co Ltd
Original Assignee
Yokohama Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd filed Critical Yokohama Rubber Co Ltd
Priority to JP24340987A priority Critical patent/JPS6487667A/en
Publication of JPS6487667A publication Critical patent/JPS6487667A/en
Pending legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To obtain the titled composition outstanding in film formability, by incorporating a specific epoxy resin composition with polyvinyl acetal, synthetic rubber, guanidine compound etc. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of an epoxy resin composition comprising (i) a precondensed epoxy resin containing carboxyl group-contg. liquid acrylonitrile-butadiene rubber/bisphenol compound/bisphenol-glycidyl ether type epoxy resin (ii) dinner acid- modified and/or dibasic acid-modified epoxy resin(s) and (iii) a bisphenol-glycidyl ether type epoxy resin with (B) 5-10pts.wt. of polyvinyl acetal, (C) 3-10pts.wt. of carboxyl group-contg. acrylonitrile-butadiene rubber, (D) a guanidine compound, (E) a urea compound, (F) 4-10pts.wt. of an organic fatty acid metal salt and (G) 10-50pts.wt. of inorganic filler.
JP24340987A 1987-09-28 1987-09-28 Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature Pending JPS6487667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24340987A JPS6487667A (en) 1987-09-28 1987-09-28 Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24340987A JPS6487667A (en) 1987-09-28 1987-09-28 Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature

Publications (1)

Publication Number Publication Date
JPS6487667A true JPS6487667A (en) 1989-03-31

Family

ID=17103432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24340987A Pending JPS6487667A (en) 1987-09-28 1987-09-28 Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature

Country Status (1)

Country Link
JP (1) JPS6487667A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0702070A3 (en) * 1994-09-13 1996-08-07 Mitsui Mining & Smelting Co Adhesive for copper foils and adhesive-backed copper foil
US6015865A (en) * 1991-06-26 2000-01-18 Henkel-Teroson Gmbh Hot melt adhesive from epoxy resin/amine-terminated polyalkylene glycol adduct
JP2008522391A (en) * 2004-11-29 2008-06-26 テサ・アクチエンゲゼルシヤフト Adhesive strip based on thermally activated and carboxylated nitrile rubber for bonding electronic components and strip conductors together
US7750107B2 (en) * 2003-05-30 2010-07-06 Alzchem Trostberg Gmbh Substituted urea accelerator with dicyandiamide for epoxy resin systems
JP2014111694A (en) * 2012-12-05 2014-06-19 Kyocera Chemical Corp Thin film adhesive sheet and method for producing the same
JP2016138273A (en) * 2007-11-14 2016-08-04 シーカ・テクノロジー・アーゲー Heat-curing epoxy resin composition containing non-aromatic urea as accelerant

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6015865A (en) * 1991-06-26 2000-01-18 Henkel-Teroson Gmbh Hot melt adhesive from epoxy resin/amine-terminated polyalkylene glycol adduct
EP0702070A3 (en) * 1994-09-13 1996-08-07 Mitsui Mining & Smelting Co Adhesive for copper foils and adhesive-backed copper foil
US5707729A (en) * 1994-09-13 1998-01-13 Mitsui Mining & Smelting Co., Ltd. Adhesive for copper foils and adhesive-backed copper foil
US7750107B2 (en) * 2003-05-30 2010-07-06 Alzchem Trostberg Gmbh Substituted urea accelerator with dicyandiamide for epoxy resin systems
JP2008522391A (en) * 2004-11-29 2008-06-26 テサ・アクチエンゲゼルシヤフト Adhesive strip based on thermally activated and carboxylated nitrile rubber for bonding electronic components and strip conductors together
JP2016138273A (en) * 2007-11-14 2016-08-04 シーカ・テクノロジー・アーゲー Heat-curing epoxy resin composition containing non-aromatic urea as accelerant
US11198754B2 (en) 2007-11-14 2021-12-14 Sika Technology Ag Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator
JP2014111694A (en) * 2012-12-05 2014-06-19 Kyocera Chemical Corp Thin film adhesive sheet and method for producing the same

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