JPS6481295A - Exfoliation of resist with corrosion suppression of solder - Google Patents
Exfoliation of resist with corrosion suppression of solderInfo
- Publication number
- JPS6481295A JPS6481295A JP23775087A JP23775087A JPS6481295A JP S6481295 A JPS6481295 A JP S6481295A JP 23775087 A JP23775087 A JP 23775087A JP 23775087 A JP23775087 A JP 23775087A JP S6481295 A JPS6481295 A JP S6481295A
- Authority
- JP
- Japan
- Prior art keywords
- aqueous solution
- solder
- exfoliated
- hydrogen atom
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To suppress the occurrence of a phenomenon called corrosion such as elution, discoloration or the like of a solder by using a solution prepared by adding a specific imidazole compound to an alkaline aqueous solution. CONSTITUTION:When a plated part, to be exfoliated by an alkali, used to manufacture a through-hole printed-circuit board using the solder plated part as an etching resist is to be exfoliated, an imidazole compound expressed by Formula (1) (where R1 is a hydrogen atom, a cyanoethyl group or an aminoethyl group, R2 is the hydrogen atom, a methyl group or an ethyl group and R3 is the hydrogen atom or the methyl group) is added to an alkaline aqueous solution and the plating resist is exfoliated by using this aqueous solution. The imidazole compound to be used is imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole or the like; these compounds are normally added to the alkaline aqueous solution within a range of 0.1-1.0wt.%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23775087A JPS6481295A (en) | 1987-09-22 | 1987-09-22 | Exfoliation of resist with corrosion suppression of solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23775087A JPS6481295A (en) | 1987-09-22 | 1987-09-22 | Exfoliation of resist with corrosion suppression of solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6481295A true JPS6481295A (en) | 1989-03-27 |
Family
ID=17019915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23775087A Pending JPS6481295A (en) | 1987-09-22 | 1987-09-22 | Exfoliation of resist with corrosion suppression of solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6481295A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011118101A (en) * | 2009-12-02 | 2011-06-16 | Tokyo Ohka Kogyo Co Ltd | Cleaning liquid for lithography and wiring forming method |
-
1987
- 1987-09-22 JP JP23775087A patent/JPS6481295A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011118101A (en) * | 2009-12-02 | 2011-06-16 | Tokyo Ohka Kogyo Co Ltd | Cleaning liquid for lithography and wiring forming method |
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