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JPS6481848A - Modified curing agent-containing epoxy resin composition - Google Patents

Modified curing agent-containing epoxy resin composition

Info

Publication number
JPS6481848A
JPS6481848A JP23818687A JP23818687A JPS6481848A JP S6481848 A JPS6481848 A JP S6481848A JP 23818687 A JP23818687 A JP 23818687A JP 23818687 A JP23818687 A JP 23818687A JP S6481848 A JPS6481848 A JP S6481848A
Authority
JP
Japan
Prior art keywords
curing agent
formula
epoxy resin
epoxy
units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23818687A
Other languages
Japanese (ja)
Inventor
Shuichi Kanekawa
Tsutomu Takahashi
Tadashi Ikushima
Nobuyuki Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP23818687A priority Critical patent/JPS6481848A/en
Publication of JPS6481848A publication Critical patent/JPS6481848A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the titled composition free from bleeding, good in adhesiveness to the substrate, molding processability etc. when used as a semiconductor sealant, by blending an epoxy resin and a curing agent therefor modified with a specific polysiloxane. CONSTITUTION:The objective composition can be obtained by blending (A) a modified curing agent prepared by modification with A1: an epoxy-terminated or branched polysiloxane with as the main chain, a copolymer constituted of a total of the recurring units of formula I (R<1> and R<2> are each 1-10C alkyl, alkenyl or halogen-substituted group therefrom and those of formula II (R<3> is similar to R<1> or R<2>, or aromatic group; R<4> is aromatic group) of 20-300 (pref. 40-250) with the units of the formula I accounting for 10-95% and the rest being the units of the formula II of A2: a curing agent having two or more phenolic OHs or amino groups and (B) an epoxy resin having two or more epoxy groups in such ratio as to be 0.1-1.5 per epoxy group in the component B, for the residual functional groups in the component A.
JP23818687A 1987-09-22 1987-09-22 Modified curing agent-containing epoxy resin composition Pending JPS6481848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23818687A JPS6481848A (en) 1987-09-22 1987-09-22 Modified curing agent-containing epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23818687A JPS6481848A (en) 1987-09-22 1987-09-22 Modified curing agent-containing epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS6481848A true JPS6481848A (en) 1989-03-28

Family

ID=17026445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23818687A Pending JPS6481848A (en) 1987-09-22 1987-09-22 Modified curing agent-containing epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS6481848A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5561174A (en) * 1994-09-30 1996-10-01 Murata Manufacturing Co., Ltd. Liquid epoxy resin composition
JP2012131902A (en) * 2010-12-21 2012-07-12 Nitto Denko Corp Semiconductor sealing epoxy resin composition and semiconductor device using the same
JP2018536064A (en) * 2015-11-19 2018-12-06 ミリケン・アンド・カンパニーＭｉｌｌｉｋｅｎ ＆ Ｃｏｍｐａｎｙ Adducts of amines and cyclic siloxane compounds
WO2019163970A1 (en) * 2018-02-26 2019-08-29 三菱ケミカル株式会社 Epoxy group-containing polyorganosiloxane, curable resin composition containing epoxy group-containing polyorganosiloxane, and cured product of same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5561174A (en) * 1994-09-30 1996-10-01 Murata Manufacturing Co., Ltd. Liquid epoxy resin composition
JP2012131902A (en) * 2010-12-21 2012-07-12 Nitto Denko Corp Semiconductor sealing epoxy resin composition and semiconductor device using the same
JP2018536064A (en) * 2015-11-19 2018-12-06 ミリケン・アンド・カンパニーＭｉｌｌｉｋｅｎ ＆ Ｃｏｍｐａｎｙ Adducts of amines and cyclic siloxane compounds
WO2019163970A1 (en) * 2018-02-26 2019-08-29 三菱ケミカル株式会社 Epoxy group-containing polyorganosiloxane, curable resin composition containing epoxy group-containing polyorganosiloxane, and cured product of same

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