JPS6468479A - Double-layer electroless plating method - Google Patents
Double-layer electroless plating methodInfo
- Publication number
- JPS6468479A JPS6468479A JP22562287A JP22562287A JPS6468479A JP S6468479 A JPS6468479 A JP S6468479A JP 22562287 A JP22562287 A JP 22562287A JP 22562287 A JP22562287 A JP 22562287A JP S6468479 A JPS6468479 A JP S6468479A
- Authority
- JP
- Japan
- Prior art keywords
- nano3
- contg
- double
- treatment
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
Abstract
PURPOSE:To form double-layered plating having excellent electrical conductivity, corrosion resistance and heat radiatability by subjecting the surface of Mg or an Mg alloy to degreasing and cleaning, then pickling the surface with an aq. soln. contg. chromate of a specific compsn. and further subjecting the surface to an activation treatment and Zn substn. treatment, then to electroless plating of Cu, Ni, Au, etc. CONSTITUTION:After the surface of the member made of the Mg or Mg alloy is degreased and cleaned, the surface is pickled by the aq. soln. contg. 1-3mol. CrO3 and contg., in addition thereto, 0.16-0.8mol. HNO3, 0.25-1.0mol. HF or 0.12-0.35mol. NaNO3, 0.03-0.13mol. CaF2 or 0.12-0.35mol. NaNO3, 0.05-0.27mol. NH4F or 0.51-1.53mol. phosphoric acid or 0.12-0.35mol. NaNO3, and 0.01-0.24mol. NaF. The surface is in succession subjected to the activation treatment and the Zn substitution treatment and is then electroless plated with Cu, Ni, Au or Cu and Au in the double layers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22562287A JPS6468479A (en) | 1987-09-09 | 1987-09-09 | Double-layer electroless plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22562287A JPS6468479A (en) | 1987-09-09 | 1987-09-09 | Double-layer electroless plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6468479A true JPS6468479A (en) | 1989-03-14 |
Family
ID=16832197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22562287A Pending JPS6468479A (en) | 1987-09-09 | 1987-09-09 | Double-layer electroless plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6468479A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5534296A (en) * | 1992-09-17 | 1996-07-09 | Rieger; Franz | Process for the pre-treatment of light metals and articles produced |
KR100431125B1 (en) * | 2001-11-16 | 2004-05-12 | 주식회사 에이치 제이 텍 | Double electroless nikel plating method by pre-treatment process of magnesium and magnesium alloy |
KR100453994B1 (en) * | 2002-03-14 | 2004-10-26 | 주식회사 에이치 제이 텍 | Two layer non-electrolysis nickel coating method by dynamic etching of magnesium and magnesium alloy |
GB2405859A (en) * | 2003-09-09 | 2005-03-16 | Melvyn Burrell | A lift for use in a vehicle inspection pit |
JP2008190572A (en) * | 2007-02-02 | 2008-08-21 | Nippon Densan Corp | Manufacturing method of hydrodynamic bearing and motor using its hydrodynamic bearing |
-
1987
- 1987-09-09 JP JP22562287A patent/JPS6468479A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5534296A (en) * | 1992-09-17 | 1996-07-09 | Rieger; Franz | Process for the pre-treatment of light metals and articles produced |
KR100431125B1 (en) * | 2001-11-16 | 2004-05-12 | 주식회사 에이치 제이 텍 | Double electroless nikel plating method by pre-treatment process of magnesium and magnesium alloy |
KR100453994B1 (en) * | 2002-03-14 | 2004-10-26 | 주식회사 에이치 제이 텍 | Two layer non-electrolysis nickel coating method by dynamic etching of magnesium and magnesium alloy |
GB2405859A (en) * | 2003-09-09 | 2005-03-16 | Melvyn Burrell | A lift for use in a vehicle inspection pit |
JP2008190572A (en) * | 2007-02-02 | 2008-08-21 | Nippon Densan Corp | Manufacturing method of hydrodynamic bearing and motor using its hydrodynamic bearing |
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