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JPS6457104A - Measuring apparatus of amount of positional deviation of circular substrate - Google Patents

Measuring apparatus of amount of positional deviation of circular substrate

Info

Publication number
JPS6457104A
JPS6457104A JP21469487A JP21469487A JPS6457104A JP S6457104 A JPS6457104 A JP S6457104A JP 21469487 A JP21469487 A JP 21469487A JP 21469487 A JP21469487 A JP 21469487A JP S6457104 A JPS6457104 A JP S6457104A
Authority
JP
Japan
Prior art keywords
wafer
coordinates
axes
amount
amounts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21469487A
Other languages
Japanese (ja)
Other versions
JP2611251B2 (en
Inventor
Shinobu Tokushima
Masaaki Tokunaga
Kazuhiko Fukazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP21469487A priority Critical patent/JP2611251B2/en
Publication of JPS6457104A publication Critical patent/JPS6457104A/en
Application granted granted Critical
Publication of JP2611251B2 publication Critical patent/JP2611251B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To measure accurately the amount of positional deviation of a circular substrate such as a wafer without contacting therewith, by scanning optical the edge part of the wafer. CONSTITUTION:An arm 8 of which amount of movement is monitored by a coordinates detector is driven to processed into a wafer carrier 1, and it sucks up a wafer 2 with vacuum and conveys the same from a position C1 to a position C2. On the way of this conveyance, photocouplers 4A-4B and 5A-5B are juxtaposed so that the optical axes thereof intersect perpendicularly in the direction of conveyance (the direction Y) of the wafer 2, and when the edge of the wafer 2 intercepts these axes, Y coordinates of the arm 8 are stored in response to signals from photosensors 4B and 5B. Since the distance in the direction X (the direction of connection of the two axes) between the optical axes 6A and 6B is measured beforehand, the coordinates of Y1-Y4 corresponding to the outside diameter of the wafer 2 are determined in a system of coordinates on the XY axes. By the computation of a prescribed formula based on these coordinates, the position of the center of the wafer 2 is computed and amounts of correction (amounts of deviation DELTAX and DELTAY) are calculated. After the arm 8 is transferred by the amounts of correction and the position of the center of the wafer 2 is corrected from a position C2 to the position C4, accordingly, a center table 7 is turned to obtain the coincidence in the direction OF.
JP21469487A 1987-08-28 1987-08-28 Substrate transfer device Expired - Lifetime JP2611251B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21469487A JP2611251B2 (en) 1987-08-28 1987-08-28 Substrate transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21469487A JP2611251B2 (en) 1987-08-28 1987-08-28 Substrate transfer device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7098445A Division JPH07302828A (en) 1995-04-24 1995-04-24 Substrate carrying apparatus

Publications (2)

Publication Number Publication Date
JPS6457104A true JPS6457104A (en) 1989-03-03
JP2611251B2 JP2611251B2 (en) 1997-05-21

Family

ID=16660054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21469487A Expired - Lifetime JP2611251B2 (en) 1987-08-28 1987-08-28 Substrate transfer device

Country Status (1)

Country Link
JP (1) JP2611251B2 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0747933A1 (en) * 1995-06-07 1996-12-11 Varian Associates, Inc. Optical position calibration system
JP2001210698A (en) * 1999-11-22 2001-08-03 Lam Res Corp Method of and apparatus for determining substrate offset using optimization technique
JP2002124557A (en) * 2000-07-07 2002-04-26 Applied Materials Inc Valve/sensor assembly
JP2002319612A (en) * 2001-04-20 2002-10-31 Shin Etsu Handotai Co Ltd Wafer transfer apparatus, vapor phase growth system, and method of transferring wafer
KR100495323B1 (en) * 2001-09-19 2005-06-14 미쓰비시 덴끼 엔지니어링 가부시키가이샤 Defect inspecting device for substrate to be processed
JP2008076309A (en) * 2006-09-22 2008-04-03 Nissan Motor Co Ltd Method and device for touch probe measuring
JP2008311303A (en) * 2007-06-12 2008-12-25 Tokyo Electron Ltd Displacement detecting apparatus and processing system using the same
JP2009500869A (en) * 2005-07-11 2009-01-08 ブルックス オートメーション インコーポレイテッド Equipment with on-the-fly workpiece centering
JP2009088184A (en) * 2007-09-28 2009-04-23 Yamatake Corp Image processing device
JP2009253197A (en) * 2008-04-10 2009-10-29 Yamatake Corp Method and apparatus for detecting center position, and method and apparatus for adjusting center position
JP2011018828A (en) * 2009-07-10 2011-01-27 Lintec Corp Position recognition device and position recognition method, and positioning device
KR20160100233A (en) 2015-02-13 2016-08-23 도쿄엘렉트론가부시키가이샤 Substrate detection apparatus, substrate detection method and substrate processing system
JP6029250B2 (en) * 2013-03-28 2016-11-24 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, and program
CN110411344A (en) * 2019-08-06 2019-11-05 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） A kind of calibration method, calibrating installation, calibration system and electronic equipment
CN112151429A (en) * 2019-06-26 2020-12-29 弘塑科技股份有限公司 Substrate transfer apparatus, semiconductor process machine and substrate transfer method
JP2021125646A (en) * 2020-02-07 2021-08-30 株式会社ディスコ Wafer center detection method and wafer center detection device
JP2022500844A (en) * 2018-09-14 2022-01-04 ラム リサーチ コーポレーションLam Research Corporation Fiducial Filtering Automatic Wafer Centering Process and Related Systems

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102679921B (en) * 2012-05-04 2014-07-16 上海华力微电子有限公司 Device and method for measuring rotating center

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155804A (en) * 1980-05-06 1981-12-02 Mitsubishi Electric Corp Picture processor
JPS58144704A (en) * 1982-02-24 1983-08-29 Glory Ltd Method for judging diameter of circular body
JPS5965429A (en) * 1982-10-06 1984-04-13 Hitachi Ltd Wafer pre-alignment device
JPS59139414A (en) * 1983-01-28 1984-08-10 Matsushita Electric Ind Co Ltd Substrate positioning device
JPS59181617A (en) * 1983-03-28 1984-10-16 シリコン・バレイ・グル−プ・インコ−ポレイテツド Method and device for operating wafer
JPS618U (en) * 1984-06-06 1986-01-06 大日本スクリ−ン製造株式会社 Printed wiring board misalignment detection device
JPS62162342A (en) * 1986-01-13 1987-07-18 Canon Inc Wafer alignment device
JPS6448443A (en) * 1987-04-20 1989-02-22 Applied Materials Inc System and method for detecting center of integrated circuit wafer

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155804A (en) * 1980-05-06 1981-12-02 Mitsubishi Electric Corp Picture processor
JPS58144704A (en) * 1982-02-24 1983-08-29 Glory Ltd Method for judging diameter of circular body
JPS5965429A (en) * 1982-10-06 1984-04-13 Hitachi Ltd Wafer pre-alignment device
JPS59139414A (en) * 1983-01-28 1984-08-10 Matsushita Electric Ind Co Ltd Substrate positioning device
JPS59181617A (en) * 1983-03-28 1984-10-16 シリコン・バレイ・グル−プ・インコ−ポレイテツド Method and device for operating wafer
JPS618U (en) * 1984-06-06 1986-01-06 大日本スクリ−ン製造株式会社 Printed wiring board misalignment detection device
JPS62162342A (en) * 1986-01-13 1987-07-18 Canon Inc Wafer alignment device
JPS6448443A (en) * 1987-04-20 1989-02-22 Applied Materials Inc System and method for detecting center of integrated circuit wafer
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5742393A (en) * 1995-06-07 1998-04-21 Varian Associates, Inc. Optical position calibration system
EP0747933A1 (en) * 1995-06-07 1996-12-11 Varian Associates, Inc. Optical position calibration system
JP2001210698A (en) * 1999-11-22 2001-08-03 Lam Res Corp Method of and apparatus for determining substrate offset using optimization technique
JP2001230302A (en) * 1999-11-22 2001-08-24 Lam Res Corp Method and apparatus for dynamic alignment of substrate
JP2002124557A (en) * 2000-07-07 2002-04-26 Applied Materials Inc Valve/sensor assembly
JP2002319612A (en) * 2001-04-20 2002-10-31 Shin Etsu Handotai Co Ltd Wafer transfer apparatus, vapor phase growth system, and method of transferring wafer
KR100495323B1 (en) * 2001-09-19 2005-06-14 미쓰비시 덴끼 엔지니어링 가부시키가이샤 Defect inspecting device for substrate to be processed
JP2009500869A (en) * 2005-07-11 2009-01-08 ブルックス オートメーション インコーポレイテッド Equipment with on-the-fly workpiece centering
JP2008076309A (en) * 2006-09-22 2008-04-03 Nissan Motor Co Ltd Method and device for touch probe measuring
US8395136B2 (en) 2007-06-12 2013-03-12 Tokyo Electron Limited Positional deviation detection apparatus and process system employing the same
JP2008311303A (en) * 2007-06-12 2008-12-25 Tokyo Electron Ltd Displacement detecting apparatus and processing system using the same
JP2009088184A (en) * 2007-09-28 2009-04-23 Yamatake Corp Image processing device
JP2009253197A (en) * 2008-04-10 2009-10-29 Yamatake Corp Method and apparatus for detecting center position, and method and apparatus for adjusting center position
JP2011018828A (en) * 2009-07-10 2011-01-27 Lintec Corp Position recognition device and position recognition method, and positioning device
JP6029250B2 (en) * 2013-03-28 2016-11-24 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, and program
US9842754B2 (en) 2013-03-28 2017-12-12 Hitachi Kokusai Electric, Inc. Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KR20160100233A (en) 2015-02-13 2016-08-23 도쿄엘렉트론가부시키가이샤 Substrate detection apparatus, substrate detection method and substrate processing system
US10429543B2 (en) 2015-02-13 2019-10-01 Tokyo Electron Limited Substrate detection apparatus, substrate detection method and substrate processing system
JP2022500844A (en) * 2018-09-14 2022-01-04 ラム リサーチ コーポレーションLam Research Corporation Fiducial Filtering Automatic Wafer Centering Process and Related Systems
CN112151429A (en) * 2019-06-26 2020-12-29 弘塑科技股份有限公司 Substrate transfer apparatus, semiconductor process machine and substrate transfer method
CN110411344A (en) * 2019-08-06 2019-11-05 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） A kind of calibration method, calibrating installation, calibration system and electronic equipment
CN110411344B (en) * 2019-08-06 2021-07-20 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Calibration method, calibration device, calibration system and electronic equipment
JP2021125646A (en) * 2020-02-07 2021-08-30 株式会社ディスコ Wafer center detection method and wafer center detection device

Also Published As

Publication number Publication date
JP2611251B2 (en) 1997-05-21

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