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JPS6448499A - Warp correcting device for printed board - Google Patents

Warp correcting device for printed board

Info

Publication number
JPS6448499A
JPS6448499A JP62204135A JP20413587A JPS6448499A JP S6448499 A JPS6448499 A JP S6448499A JP 62204135 A JP62204135 A JP 62204135A JP 20413587 A JP20413587 A JP 20413587A JP S6448499 A JPS6448499 A JP S6448499A
Authority
JP
Japan
Prior art keywords
printed board
warp
correcting device
travelling
warp correcting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62204135A
Other languages
Japanese (ja)
Other versions
JPH0570319B2 (en
Inventor
Toshio Sagara
Motomasa Udagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Nihon Den Netsu Keiki Co Ltd
Original Assignee
Sony Corp
Nihon Den Netsu Keiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp, Nihon Den Netsu Keiki Co Ltd filed Critical Sony Corp
Priority to JP62204135A priority Critical patent/JPS6448499A/en
Publication of JPS6448499A publication Critical patent/JPS6448499A/en
Publication of JPH0570319B2 publication Critical patent/JPH0570319B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To correct a warp of a printed board by pressing the printed board from both surfaces thereof. CONSTITUTION:A warp is corrected by a warp correcting device 6 which presses the warp from the bottom of a printed board, and a warp correcting device 11 which presses the warp by a pin from the top of the travelling printed board 1. The warp correcting device 11 pressing from the top is interlocked with the travelling board 1, and moves conjointly therewith to perform necessary processings, such as cutting a lead wire by a cutter, then elevating it by an elevating device 41, transferring it by a transferring device 53 which transfers it in the direction opposite to the travelling direction of the printed board 1, and then lowering it by putting it on a lowering device 21 to return to the original position. According to the constitution, warps bending toward top and bottom directions of the printed board can be corrected, thereby improving the quality of the printed board.
JP62204135A 1987-08-19 1987-08-19 Warp correcting device for printed board Granted JPS6448499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62204135A JPS6448499A (en) 1987-08-19 1987-08-19 Warp correcting device for printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62204135A JPS6448499A (en) 1987-08-19 1987-08-19 Warp correcting device for printed board

Publications (2)

Publication Number Publication Date
JPS6448499A true JPS6448499A (en) 1989-02-22
JPH0570319B2 JPH0570319B2 (en) 1993-10-04

Family

ID=16485415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62204135A Granted JPS6448499A (en) 1987-08-19 1987-08-19 Warp correcting device for printed board

Country Status (1)

Country Link
JP (1) JPS6448499A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008116354A (en) * 2006-11-06 2008-05-22 Nec Electronics Corp Warpage measurement system, film formation system, and warpage measurement method
CN110899892A (en) * 2019-12-16 2020-03-24 王强 Electrical component pin positioning and welding integrated machine for assembling circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008116354A (en) * 2006-11-06 2008-05-22 Nec Electronics Corp Warpage measurement system, film formation system, and warpage measurement method
CN110899892A (en) * 2019-12-16 2020-03-24 王强 Electrical component pin positioning and welding integrated machine for assembling circuit board

Also Published As

Publication number Publication date
JPH0570319B2 (en) 1993-10-04

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