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JPS6444092A - Wiring substrate - Google Patents

Wiring substrate

Info

Publication number
JPS6444092A
JPS6444092A JP20157587A JP20157587A JPS6444092A JP S6444092 A JPS6444092 A JP S6444092A JP 20157587 A JP20157587 A JP 20157587A JP 20157587 A JP20157587 A JP 20157587A JP S6444092 A JPS6444092 A JP S6444092A
Authority
JP
Japan
Prior art keywords
terminals
protrusion
components
component
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20157587A
Other languages
Japanese (ja)
Inventor
Hiroshi Tsuyuki
Ryoichi Kondo
Kiichi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP20157587A priority Critical patent/JPS6444092A/en
Publication of JPS6444092A publication Critical patent/JPS6444092A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To enhance a component placing density without causing problems, such as a solder bridge and the like by providing a protrusion formed by baking it integrally with an insulating layer on a substrate surface so as to separate the terminals of surface mounting components to be adjacently mounted. CONSTITUTION:In a substrate having an insulating layer 4 and a circuit substrate 1 having external conductors 3, 3', a protrusion 61 formed by baking integrally with the layer 4 is so formed as to separate the terminals of a surface mounting component to be adjacently mounted. Then, the external conductors 3, 3' for connecting to the terminals of chip components 7, 7' are provided in recesses isolated by the protrusion 61. Thus, since a solder bridge is prevented, the mounting interval of surface mounting components, such as chip components can be shortened, and the size of the chip components can be reduced without problem, thereby improving a component mounting density.
JP20157587A 1987-08-12 1987-08-12 Wiring substrate Pending JPS6444092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20157587A JPS6444092A (en) 1987-08-12 1987-08-12 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20157587A JPS6444092A (en) 1987-08-12 1987-08-12 Wiring substrate

Publications (1)

Publication Number Publication Date
JPS6444092A true JPS6444092A (en) 1989-02-16

Family

ID=16443332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20157587A Pending JPS6444092A (en) 1987-08-12 1987-08-12 Wiring substrate

Country Status (1)

Country Link
JP (1) JPS6444092A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022021708A (en) * 2020-07-22 2022-02-03 Tdk株式会社 Manufacturing method of resin-molded electronic component and resin-molded electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022021708A (en) * 2020-07-22 2022-02-03 Tdk株式会社 Manufacturing method of resin-molded electronic component and resin-molded electronic component
US12002622B2 (en) 2020-07-22 2024-06-04 Tdk Corporation Method for producing resin mold-type electronic component and resin mold-type electronic component

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