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JPS6439738A - Resin sealer for semiconductor device - Google Patents

Resin sealer for semiconductor device

Info

Publication number
JPS6439738A
JPS6439738A JP19680387A JP19680387A JPS6439738A JP S6439738 A JPS6439738 A JP S6439738A JP 19680387 A JP19680387 A JP 19680387A JP 19680387 A JP19680387 A JP 19680387A JP S6439738 A JPS6439738 A JP S6439738A
Authority
JP
Japan
Prior art keywords
sealing
block
plates
annular
blocks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19680387A
Other languages
Japanese (ja)
Inventor
Suekichi Tanaka
Koji Tsutsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP19680387A priority Critical patent/JPS6439738A/en
Publication of JPS6439738A publication Critical patent/JPS6439738A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2608—Mould seals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To form an annular groove for mounting a sealing ring on the continuously flat face of an annular sealing block, to easily clean the parting face of a chase block, and to eliminate the removal of a sealing ring by providing the sealing block on the periphery of the chase block, and interposing an annular sealing plate between a surface plate and the sealing block. CONSTITUTION:Upper and lower molding plates 21, 22 have surface plates 23, 24 and chase blocks 27, 28 secured to the plates 23, 24 and having cavities 25, 26. Annular sealing blocks 29, 30 are disposed around the blocks 27, 28, attached to the plates 23, 24, and an annular sealing plate 31 made of an elastic material is interposed between an upper sealing block 29 and the upper surface plate 23. Thus, sealing faces 29a, 30a can be formed on a flat face in which the block 29 is continued to the block 30. Thus, since parting faces are not provided with a sealing member, the cleaning property of the parting faces at the time of sealing is improved to remarkably improve the sealing operability.
JP19680387A 1987-08-05 1987-08-05 Resin sealer for semiconductor device Pending JPS6439738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19680387A JPS6439738A (en) 1987-08-05 1987-08-05 Resin sealer for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19680387A JPS6439738A (en) 1987-08-05 1987-08-05 Resin sealer for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6439738A true JPS6439738A (en) 1989-02-10

Family

ID=16363908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19680387A Pending JPS6439738A (en) 1987-08-05 1987-08-05 Resin sealer for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6439738A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63129966A (en) * 1986-11-12 1988-06-02 Chihiro Shimizu Production of miso
US5612145A (en) * 1991-11-14 1997-03-18 Victor Company Of Japan, Ltd. Perpendicular magnetic medium and manufacturing method for the medium
JP2001129833A (en) * 1999-11-05 2001-05-15 Miyagi Oki Electric Co Ltd Mold and method for producing semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63129966A (en) * 1986-11-12 1988-06-02 Chihiro Shimizu Production of miso
US5612145A (en) * 1991-11-14 1997-03-18 Victor Company Of Japan, Ltd. Perpendicular magnetic medium and manufacturing method for the medium
JP2001129833A (en) * 1999-11-05 2001-05-15 Miyagi Oki Electric Co Ltd Mold and method for producing semiconductor device

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