JPS6424869A - Coating material for hybrid ic - Google Patents
Coating material for hybrid icInfo
- Publication number
- JPS6424869A JPS6424869A JP18137287A JP18137287A JPS6424869A JP S6424869 A JPS6424869 A JP S6424869A JP 18137287 A JP18137287 A JP 18137287A JP 18137287 A JP18137287 A JP 18137287A JP S6424869 A JPS6424869 A JP S6424869A
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- coating material
- bisphenol
- derived
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 title abstract 3
- 238000000576 coating method Methods 0.000 title abstract 3
- 239000000463 material Substances 0.000 title abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 229920003986 novolac Polymers 0.000 abstract 2
- 239000003960 organic solvent Substances 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000010411 cooking Methods 0.000 abstract 1
- 229930003836 cresol Natural products 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To make it possible to obtain a coating material for a hybrid IC, which can give a hybrid IC markedly improved in moisture resistance, especially, pressure cooking property and excellent in heat shock resistance by a simple working step, by mixing two specified epoxy resins with a curing agent, a cure accelerator, an organic solvent and a silica filler. CONSTITUTION:This coating material contains 30-95pts.wt. epoxy resin (1) derived from bisphenol A and/or bisphenol F, 5-70pts.wt. epoxy resin (2) derived from cresol novolac resin [provided that the total amount of components (1) and (2) is 100pts.wt.], a phenol novolac resin curing agent (3), a cure accelerator (4), an organic solvent (5) and a surface-treated silica filler (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18137287A JPS6424869A (en) | 1987-07-21 | 1987-07-21 | Coating material for hybrid ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18137287A JPS6424869A (en) | 1987-07-21 | 1987-07-21 | Coating material for hybrid ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424869A true JPS6424869A (en) | 1989-01-26 |
Family
ID=16099576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18137287A Pending JPS6424869A (en) | 1987-07-21 | 1987-07-21 | Coating material for hybrid ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424869A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09502466A (en) * | 1993-07-06 | 1997-03-11 | ビーエーエスエフ ラッケ ウント ファルベン アクチエンゲゼルシャフト | Powder lacquer, outer coating method for metal tubes and use of said powder lacquer for single-layer outer coating of metal tubes |
| JPH11286647A (en) * | 1998-04-03 | 1999-10-19 | Matsushita Electric Ind Co Ltd | Coating material for fixed resistor |
| JP2006176595A (en) * | 2004-12-21 | 2006-07-06 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor and semiconductor apparatus |
| JP2008130796A (en) * | 2006-11-21 | 2008-06-05 | Sumitomo Bakelite Co Ltd | Insulating resin composition for multilayer printed circuit boards, insulation sheet with base material, multilayer printed circuit board, and semiconductor device |
| JP2012054573A (en) * | 2011-10-11 | 2012-03-15 | Sumitomo Bakelite Co Ltd | Insulating resin composition for multilayer printed circuit board, insulation sheet with substrate, multilayer printed circuit board, and semiconductor device |
| JP2016130290A (en) * | 2015-01-14 | 2016-07-21 | リコーイメージング株式会社 | Coating liquid and manufacturing method thereof |
| JP2022503626A (en) * | 2019-09-11 | 2022-01-12 | エルジー・ケム・リミテッド | Manufacturing method of highly absorbent resin |
-
1987
- 1987-07-21 JP JP18137287A patent/JPS6424869A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09502466A (en) * | 1993-07-06 | 1997-03-11 | ビーエーエスエフ ラッケ ウント ファルベン アクチエンゲゼルシャフト | Powder lacquer, outer coating method for metal tubes and use of said powder lacquer for single-layer outer coating of metal tubes |
| JPH11286647A (en) * | 1998-04-03 | 1999-10-19 | Matsushita Electric Ind Co Ltd | Coating material for fixed resistor |
| JP2006176595A (en) * | 2004-12-21 | 2006-07-06 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor and semiconductor apparatus |
| JP2008130796A (en) * | 2006-11-21 | 2008-06-05 | Sumitomo Bakelite Co Ltd | Insulating resin composition for multilayer printed circuit boards, insulation sheet with base material, multilayer printed circuit board, and semiconductor device |
| JP2012054573A (en) * | 2011-10-11 | 2012-03-15 | Sumitomo Bakelite Co Ltd | Insulating resin composition for multilayer printed circuit board, insulation sheet with substrate, multilayer printed circuit board, and semiconductor device |
| JP2016130290A (en) * | 2015-01-14 | 2016-07-21 | リコーイメージング株式会社 | Coating liquid and manufacturing method thereof |
| JP2022503626A (en) * | 2019-09-11 | 2022-01-12 | エルジー・ケム・リミテッド | Manufacturing method of highly absorbent resin |
| US12023646B2 (en) | 2019-09-11 | 2024-07-02 | Lg Chem, Ltd. | Preparation method of super absorbent polymer |
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