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JPS6411342A - Holding of semiconductor substrate - Google Patents

Holding of semiconductor substrate

Info

Publication number
JPS6411342A
JPS6411342A JP62166996A JP16699687A JPS6411342A JP S6411342 A JPS6411342 A JP S6411342A JP 62166996 A JP62166996 A JP 62166996A JP 16699687 A JP16699687 A JP 16699687A JP S6411342 A JPS6411342 A JP S6411342A
Authority
JP
Japan
Prior art keywords
substrate
liquid
holding
abrasive
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62166996A
Other languages
Japanese (ja)
Inventor
Shigenobu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62166996A priority Critical patent/JPS6411342A/en
Publication of JPS6411342A publication Critical patent/JPS6411342A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To avoid penetration of abrasive liquid between a substrate and a wafer mounting assembly and also prevent detachment of the substrate as well as etching of the rear by using liquid insoluble in abrasive liquid as liquid attracting the substrate when a polishing treatment of the semiconductor substrate is performed. CONSTITUTION:Holding liquid 3 applied on a mounting material 22 has insolubility in water-soluble abrasive liquid solvent for polishing. A substrate 4 is pressed into the mounting material 22 through holding liquid 3 and is attracted to the mounting material 22 by surface tension of holding liquid 3. If the substrate 4 is held in this way, attachment and detachment of the substrate 4 can be easily performed in the same manner as that is attracted with water and further, when washed in and after, the process of polishing, holding liquid 3 is so insoluble in abrasive liquid that no abrasive liquid enters the rear of the substrate 4 to come up to the surface or no etching takes place in the rear of the substrate.
JP62166996A 1987-07-06 1987-07-06 Holding of semiconductor substrate Pending JPS6411342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62166996A JPS6411342A (en) 1987-07-06 1987-07-06 Holding of semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62166996A JPS6411342A (en) 1987-07-06 1987-07-06 Holding of semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS6411342A true JPS6411342A (en) 1989-01-13

Family

ID=15841447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62166996A Pending JPS6411342A (en) 1987-07-06 1987-07-06 Holding of semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS6411342A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132397A (en) * 1992-10-19 1994-05-13 Rohm Co Ltd Dicing method
EP0811494A2 (en) * 1996-06-07 1997-12-10 Canon Kabushiki Kaisha Method for manufacturing a component having a movable member for use of liquid discharge, and method for manufacturing a liquid jet head using such component, and liquid jet head manufactured by such method
CN105280534A (en) * 2014-06-02 2016-01-27 晶元光电股份有限公司 Bearing plate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132397A (en) * 1992-10-19 1994-05-13 Rohm Co Ltd Dicing method
EP0811494A2 (en) * 1996-06-07 1997-12-10 Canon Kabushiki Kaisha Method for manufacturing a component having a movable member for use of liquid discharge, and method for manufacturing a liquid jet head using such component, and liquid jet head manufactured by such method
EP0811494A3 (en) * 1996-06-07 2000-02-02 Canon Kabushiki Kaisha Method for manufacturing a component having a movable member for use of liquid discharge, and method for manufacturing a liquid jet head using such component, and liquid jet head manufactured by such method
US6516509B1 (en) 1996-06-07 2003-02-11 Canon Kabushiki Kaisha Method of manufacturing a liquid jet head having a plurality of movable members
CN105280534A (en) * 2014-06-02 2016-01-27 晶元光电股份有限公司 Bearing plate

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