JPS6410073U - - Google Patents
Info
- Publication number
- JPS6410073U JPS6410073U JP10319487U JP10319487U JPS6410073U JP S6410073 U JPS6410073 U JP S6410073U JP 10319487 U JP10319487 U JP 10319487U JP 10319487 U JP10319487 U JP 10319487U JP S6410073 U JPS6410073 U JP S6410073U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tank
- liquid
- semiconductor wafer
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Description
図面は、本案めつき液循環路系統の好適な一実
施例を示す系統図である。
図中、１はタンク、３はポンプ、５は容器、６
はめつき槽、９は排液流通管、１０は脱気装置を
夫々示す。
The drawing is a system diagram showing a preferred embodiment of the plating liquid circulation path system of the present invention. In the figure, 1 is a tank, 3 is a pump, 5 is a container, and 6
A fitting tank, 9 a drain fluid flow pipe, and 10 a deaerator, respectively.
Claims (1)
並設されためつき槽に供給され、該めつき槽から
溢出されためつき液が排液流通管を介して上記の
タンクに還元されるよう形成された半導体ウエハ
のめつき液循環路系統において、上記の排液流通
管にはめつき槽から溢出されためつき液中に含ま
れる気泡を除去する為の脱気装置が配設された半
導体ウエハのめつき液循環路系統。 The plating liquid in the tank is supplied by a pump to a plating tank arranged in parallel in the container, and the plating liquid overflowing from the plating tank is returned to the tank via a drainage pipe. In the formed semiconductor wafer plating liquid circulation path system, the semiconductor wafer is equipped with a deaerator for removing air bubbles contained in the plating liquid overflowing from the plating tank in the above-mentioned drain liquid distribution pipe. Nometsuki liquid circulation system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10319487U JPS6410073U (en) | 1987-07-03 | 1987-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10319487U JPS6410073U (en) | 1987-07-03 | 1987-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6410073U true JPS6410073U (en) | 1989-01-19 |
Family
ID=31333796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10319487U Pending JPS6410073U (en) | 1987-07-03 | 1987-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6410073U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001068952A1 (en) * | 2000-03-17 | 2001-09-20 | Ebara Corporation | Method and apparatus for electroplating |
| JP2003528214A (en) * | 1998-11-30 | 2003-09-24 | アプライド マテリアルズ インコーポレイテッド | Electrochemical deposition equipment |
| JP2005043069A (en) * | 2003-07-22 | 2005-02-17 | Dainippon Screen Mfg Co Ltd | Absorbance meter, concentration measuring instrument, plating liquid analyzer, plating device, plating liquid analytical method, and plating method |
| US7833393B2 (en) | 1999-05-18 | 2010-11-16 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
-
1987
- 1987-07-03 JP JP10319487U patent/JPS6410073U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003528214A (en) * | 1998-11-30 | 2003-09-24 | アプライド マテリアルズ インコーポレイテッド | Electrochemical deposition equipment |
| US7833393B2 (en) | 1999-05-18 | 2010-11-16 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
| WO2001068952A1 (en) * | 2000-03-17 | 2001-09-20 | Ebara Corporation | Method and apparatus for electroplating |
| US7402227B2 (en) | 2000-03-17 | 2008-07-22 | Ebara Corporation | Plating apparatus and method |
| JP2005043069A (en) * | 2003-07-22 | 2005-02-17 | Dainippon Screen Mfg Co Ltd | Absorbance meter, concentration measuring instrument, plating liquid analyzer, plating device, plating liquid analytical method, and plating method |