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JPS5366368A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5366368A
JPS5366368A JP14270576A JP14270576A JPS5366368A JP S5366368 A JPS5366368 A JP S5366368A JP 14270576 A JP14270576 A JP 14270576A JP 14270576 A JP14270576 A JP 14270576A JP S5366368 A JPS5366368 A JP S5366368A
Authority
JP
Japan
Prior art keywords
semiconductor device
external
grooves
insertion hole
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14270576A
Other languages
Japanese (ja)
Inventor
Koichi Konakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14270576A priority Critical patent/JPS5366368A/en
Publication of JPS5366368A publication Critical patent/JPS5366368A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To make good the connection with external connecting wires by providing cut off grooves three or more at least with the entire surrounding of the insertion hole on the internal connecting plate toward external and by forming the tip group.
COPYRIGHT: (C)1978,JPO&Japio
JP14270576A 1976-11-26 1976-11-26 Semiconductor device Pending JPS5366368A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14270576A JPS5366368A (en) 1976-11-26 1976-11-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14270576A JPS5366368A (en) 1976-11-26 1976-11-26 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5366368A true JPS5366368A (en) 1978-06-13

Family

ID=15321635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14270576A Pending JPS5366368A (en) 1976-11-26 1976-11-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5366368A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169477A (en) * 2011-02-15 2012-09-06 Shindengen Electric Mfg Co Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169477A (en) * 2011-02-15 2012-09-06 Shindengen Electric Mfg Co Ltd Semiconductor device

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