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JPS5339330A - Application of adherends to articles - Google Patents

Application of adherends to articles

Info

Publication number
JPS5339330A
JPS5339330A JP11369776A JP11369776A JPS5339330A JP S5339330 A JPS5339330 A JP S5339330A JP 11369776 A JP11369776 A JP 11369776A JP 11369776 A JP11369776 A JP 11369776A JP S5339330 A JPS5339330 A JP S5339330A
Authority
JP
Japan
Prior art keywords
adherends
articles
application
article
vessel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11369776A
Other languages
Japanese (ja)
Other versions
JPS5938278B2 (en
Inventor
Osamu Sumiya
Tsutomu Mimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP51113697A priority Critical patent/JPS5938278B2/en
Publication of JPS5339330A publication Critical patent/JPS5339330A/en
Publication of JPS5938278B2 publication Critical patent/JPS5938278B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Vacuum Packaging (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To adhere a material securely to an article to be adhered without leaving any unadhered area, by placing the material on the surface of the article, then transferring this article into a vessel, evacuating the air from the vessel, and introducing the air into the vessel suddenly.
COPYRIGHT: (C)1978,JPO&Japio
JP51113697A 1976-09-24 1976-09-24 How to attach items Expired JPS5938278B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51113697A JPS5938278B2 (en) 1976-09-24 1976-09-24 How to attach items

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51113697A JPS5938278B2 (en) 1976-09-24 1976-09-24 How to attach items

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58172954A Division JPS59103354A (en) 1983-09-21 1983-09-21 Adhering device of tabular object

Publications (2)

Publication Number Publication Date
JPS5339330A true JPS5339330A (en) 1978-04-11
JPS5938278B2 JPS5938278B2 (en) 1984-09-14

Family

ID=14618877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51113697A Expired JPS5938278B2 (en) 1976-09-24 1976-09-24 How to attach items

Country Status (1)

Country Link
JP (1) JPS5938278B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113637A (en) * 1982-12-20 1984-06-30 Disco Abrasive Sys Ltd Vacuum tape bonder for wafer
JPS59132634U (en) * 1983-02-25 1984-09-05 日本電気ホームエレクトロニクス株式会社 semiconductor manufacturing equipment
JPS6038897A (en) * 1983-08-11 1985-02-28 日東電工株式会社 Method of bonding thin plate to ring
JPS6038898A (en) * 1983-08-11 1985-02-28 日東電工株式会社 Method of bonding ring to thin plate
JPS60100350U (en) * 1983-09-24 1985-07-09 ブラザー工業株式会社 Processing machine for tape adhesion
JPS62230561A (en) * 1986-04-01 1987-10-09 Disco Abrasive Syst Ltd Method and device for attaching tape to semiconductor substrate
JPH0254564A (en) * 1988-08-18 1990-02-23 Nec Corp Device for application of adhesive tape to semiconductor wafer
JP2010118584A (en) * 2008-11-14 2010-05-27 Takatori Corp Mounting device for wafer
CN102907185A (en) * 2010-05-27 2013-01-30 禹荣官 Method for attaching member plates to FPC product, and member plate tapes

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6272948U (en) * 1985-10-23 1987-05-11
FR2940439B1 (en) 2008-12-18 2011-02-11 Millipore Corp DEVICE FOR TRANSFERRING A MEDIUM

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113637A (en) * 1982-12-20 1984-06-30 Disco Abrasive Sys Ltd Vacuum tape bonder for wafer
JPH0216583B2 (en) * 1982-12-20 1990-04-17 Disco Abrasive Systems Ltd
JPS59132634U (en) * 1983-02-25 1984-09-05 日本電気ホームエレクトロニクス株式会社 semiconductor manufacturing equipment
JPS6038898A (en) * 1983-08-11 1985-02-28 日東電工株式会社 Method of bonding ring to thin plate
JPS6313903B2 (en) * 1983-08-11 1988-03-28 Nitto Electric Ind Co
JPS6337018B2 (en) * 1983-08-11 1988-07-22 Nitto Electric Ind Co
JPS6038897A (en) * 1983-08-11 1985-02-28 日東電工株式会社 Method of bonding thin plate to ring
JPS60100350U (en) * 1983-09-24 1985-07-09 ブラザー工業株式会社 Processing machine for tape adhesion
JPS62230561A (en) * 1986-04-01 1987-10-09 Disco Abrasive Syst Ltd Method and device for attaching tape to semiconductor substrate
JPH0254564A (en) * 1988-08-18 1990-02-23 Nec Corp Device for application of adhesive tape to semiconductor wafer
JP2010118584A (en) * 2008-11-14 2010-05-27 Takatori Corp Mounting device for wafer
CN102907185A (en) * 2010-05-27 2013-01-30 禹荣官 Method for attaching member plates to FPC product, and member plate tapes
JP2013528322A (en) * 2010-05-27 2013-07-08 ヨン・コアン・ウ Method of attaching member plate to FPC product and member plate tape
CN102907185B (en) * 2010-05-27 2015-08-19 禹荣官 For method that panels is connected with FPC product and component strip

Also Published As

Publication number Publication date
JPS5938278B2 (en) 1984-09-14

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