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JPS5330274A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5330274A
JPS5330274A JP10479176A JP10479176A JPS5330274A JP S5330274 A JPS5330274 A JP S5330274A JP 10479176 A JP10479176 A JP 10479176A JP 10479176 A JP10479176 A JP 10479176A JP S5330274 A JPS5330274 A JP S5330274A
Authority
JP
Japan
Prior art keywords
semiconductor device
thin
plate
wih
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10479176A
Other languages
Japanese (ja)
Inventor
Shunji Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP10479176A priority Critical patent/JPS5330274A/en
Publication of JPS5330274A publication Critical patent/JPS5330274A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To electrically stabilize an element, by covering the top and bottom faces of a thin Si plate wih thin Mo or W plates and coating its periphery with glass having coefficient of thermal expansion nearly equal to Si plate.
COPYRIGHT: (C)1978,JPO&Japio
JP10479176A 1976-09-01 1976-09-01 Semiconductor device Pending JPS5330274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10479176A JPS5330274A (en) 1976-09-01 1976-09-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10479176A JPS5330274A (en) 1976-09-01 1976-09-01 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5330274A true JPS5330274A (en) 1978-03-22

Family

ID=14390269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10479176A Pending JPS5330274A (en) 1976-09-01 1976-09-01 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5330274A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5034044A (en) * 1988-05-11 1991-07-23 General Electric Company Method of bonding a silicon package for a power semiconductor device
US5133795A (en) * 1986-11-04 1992-07-28 General Electric Company Method of making a silicon package for a power semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130467B1 (en) * 1968-04-15 1976-09-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130467B1 (en) * 1968-04-15 1976-09-01

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5133795A (en) * 1986-11-04 1992-07-28 General Electric Company Method of making a silicon package for a power semiconductor device
US5034044A (en) * 1988-05-11 1991-07-23 General Electric Company Method of bonding a silicon package for a power semiconductor device

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