JPS53142182A - Case for electronic parts - Google Patents
Case for electronic partsInfo
- Publication number
- JPS53142182A JPS53142182A JP5814078A JP5814078A JPS53142182A JP S53142182 A JPS53142182 A JP S53142182A JP 5814078 A JP5814078 A JP 5814078A JP 5814078 A JP5814078 A JP 5814078A JP S53142182 A JPS53142182 A JP S53142182A
- Authority
- JP
- Japan
- Prior art keywords
- case
- electronic parts
- electronic
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19772722142 DE2722142C3 (en) | 1977-05-16 | 1977-05-16 | Metallic housing wall for a housing accommodating electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53142182A true JPS53142182A (en) | 1978-12-11 |
Family
ID=6009133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5814078A Pending JPS53142182A (en) | 1977-05-16 | 1978-05-15 | Case for electronic parts |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS53142182A (en) |
DE (1) | DE2722142C3 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2939088C2 (en) * | 1979-09-27 | 1988-07-28 | Rohde & Schwarz GmbH & Co KG, 8000 München | Device for dissipating the heat loss from electronic device modules installed in a cabinet frame |
FR2469089A1 (en) * | 1979-11-02 | 1981-05-08 | Telemecanique Electrique | Semiconductor device cooling structure - includes finned base with slots for contact strips, and securing bolts holding device across them |
DE3010363C2 (en) * | 1980-03-14 | 1987-02-12 | Siemens AG, 1000 Berlin und 8000 München | Device combination for mining with components for power electronics |
US4444994A (en) * | 1982-01-29 | 1984-04-24 | Varo, Inc. | Electrically insulated quick disconnect heat sink |
DE3236262A1 (en) * | 1982-09-30 | 1984-04-05 | Siemens AG, 1000 Berlin und 8000 München | Arrangement for cooling electrical assembly magazines |
DE3315414A1 (en) * | 1983-04-28 | 1984-10-31 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Heat sink |
JPS60137489U (en) * | 1984-02-23 | 1985-09-11 | フアナツク株式会社 | power circuit mounter |
DE3611658A1 (en) * | 1985-04-05 | 1986-10-16 | Omron Tateisi Electronics Co., Kyoto | ELECTRONIC COMPONENT ASSEMBLY |
DE3517149A1 (en) * | 1985-05-11 | 1986-11-13 | Zinser Textilmaschinen Gmbh, 7333 Ebersbach | COOLING DEVICE |
DE4012180C1 (en) * | 1990-04-14 | 1991-08-01 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
US5796584A (en) * | 1996-04-30 | 1998-08-18 | Telefonaktiebolaget Lm Ericsson | Bridge for power transistors with improved cooling |
DE19924957B4 (en) | 1999-05-31 | 2004-07-29 | Siemens Ag | Device for cooling an electronic component fastened in a housing |
DE102007057839A1 (en) * | 2007-11-30 | 2009-06-04 | Temic Automotive Electric Motors Gmbh | Electric motor for motor vehicle, has central motor support module with main plate and preinstalled modules |
DE102009054585A1 (en) * | 2009-12-14 | 2011-06-16 | Robert Bosch Gmbh | control unit |
DE102019207498B4 (en) | 2018-05-28 | 2025-02-13 | Denso Corporation | mounting structure and semiconductor device using the structure |
DE102021214462A1 (en) * | 2021-12-15 | 2023-06-15 | Robert Bosch Gesellschaft mit beschränkter Haftung | control unit family |
-
1977
- 1977-05-16 DE DE19772722142 patent/DE2722142C3/en not_active Expired
-
1978
- 1978-05-15 JP JP5814078A patent/JPS53142182A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE2722142B2 (en) | 1979-06-13 |
DE2722142C3 (en) | 1980-02-14 |
DE2722142A1 (en) | 1978-11-23 |
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