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JPS53139974A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS53139974A
JPS53139974A JP5497977A JP5497977A JPS53139974A JP S53139974 A JPS53139974 A JP S53139974A JP 5497977 A JP5497977 A JP 5497977A JP 5497977 A JP5497977 A JP 5497977A JP S53139974 A JPS53139974 A JP S53139974A
Authority
JP
Japan
Prior art keywords
semiconductor device
brazing
mechanical strength
high mechanical
contact face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5497977A
Other languages
Japanese (ja)
Inventor
Motoji Nakajima
Tadashi Sakagami
Kazutoyo Narita
Noboru Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5497977A priority Critical patent/JPS53139974A/en
Publication of JPS53139974A publication Critical patent/JPS53139974A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To perform brazing of high mechanical strength by providing protrusions to the contact face with brazing material.
COPYRIGHT: (C)1978,JPO&Japio
JP5497977A 1977-05-13 1977-05-13 Semiconductor device Pending JPS53139974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5497977A JPS53139974A (en) 1977-05-13 1977-05-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5497977A JPS53139974A (en) 1977-05-13 1977-05-13 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS53139974A true JPS53139974A (en) 1978-12-06

Family

ID=12985757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5497977A Pending JPS53139974A (en) 1977-05-13 1977-05-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS53139974A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015050340A (en) * 2013-09-02 2015-03-16 株式会社ジェイテクト Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015050340A (en) * 2013-09-02 2015-03-16 株式会社ジェイテクト Semiconductor device

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