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JPS5295172A - Semi-conductor - Google Patents

Semi-conductor

Info

Publication number
JPS5295172A
JPS5295172A JP1189376A JP1189376A JPS5295172A JP S5295172 A JPS5295172 A JP S5295172A JP 1189376 A JP1189376 A JP 1189376A JP 1189376 A JP1189376 A JP 1189376A JP S5295172 A JPS5295172 A JP S5295172A
Authority
JP
Japan
Prior art keywords
conductor
semi
void
basic element
panel made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1189376A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Sugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1189376A priority Critical patent/JPS5295172A/en
Publication of JPS5295172A publication Critical patent/JPS5295172A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To void bi-metal action by inserting a round panel made of many copper bars bundled by soft solder between basic element and copper block.
COPYRIGHT: (C)1977,JPO&Japio
JP1189376A 1976-02-06 1976-02-06 Semi-conductor Pending JPS5295172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1189376A JPS5295172A (en) 1976-02-06 1976-02-06 Semi-conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1189376A JPS5295172A (en) 1976-02-06 1976-02-06 Semi-conductor

Publications (1)

Publication Number Publication Date
JPS5295172A true JPS5295172A (en) 1977-08-10

Family

ID=11790398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1189376A Pending JPS5295172A (en) 1976-02-06 1976-02-06 Semi-conductor

Country Status (1)

Country Link
JP (1) JPS5295172A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54148375A (en) * 1978-03-22 1979-11-20 Gen Electric Strain buffer for semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056162A (en) * 1973-09-14 1975-05-16
JPS5068057A (en) * 1973-10-17 1975-06-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056162A (en) * 1973-09-14 1975-05-16
JPS5068057A (en) * 1973-10-17 1975-06-07

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54148375A (en) * 1978-03-22 1979-11-20 Gen Electric Strain buffer for semiconductor device
JPS6336136B2 (en) * 1978-03-22 1988-07-19 Gen Electric

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