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JPS5271177A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5271177A
JPS5271177A JP14699275A JP14699275A JPS5271177A JP S5271177 A JPS5271177 A JP S5271177A JP 14699275 A JP14699275 A JP 14699275A JP 14699275 A JP14699275 A JP 14699275A JP S5271177 A JPS5271177 A JP S5271177A
Authority
JP
Japan
Prior art keywords
fine metal
twice
semiconductor device
volume
metal pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14699275A
Other languages
Japanese (ja)
Inventor
Yoshiharu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP14699275A priority Critical patent/JPS5271177A/en
Publication of JPS5271177A publication Critical patent/JPS5271177A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To make the distance between a semiconductor chip and substrate to be bonded constant and improve the reliability of face-down bonding by using a conductive paste comprising containing fine metal pieces and further spherical solids having volume more than twice the average volume of the fine metal than twice the average volume of the fine metal pieces and acting as a spacer in a solvent.
COPYRIGHT: (C)1977,JPO&Japio
JP14699275A 1975-12-10 1975-12-10 Semiconductor device Pending JPS5271177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14699275A JPS5271177A (en) 1975-12-10 1975-12-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14699275A JPS5271177A (en) 1975-12-10 1975-12-10 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5271177A true JPS5271177A (en) 1977-06-14

Family

ID=15420151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14699275A Pending JPS5271177A (en) 1975-12-10 1975-12-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5271177A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56104494A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Wired board and package bonding structure
JPS57173953A (en) * 1981-04-21 1982-10-26 Seiko Epson Corp Semiconductor device
JPH01201932A (en) * 1988-02-06 1989-08-14 Sharp Corp Connecting structure of circuit element
JPH03209734A (en) * 1990-01-11 1991-09-12 Japan Radio Co Ltd Semiconductor connection method
JPH04107832U (en) * 1991-02-27 1992-09-17 三洋電機株式会社 semiconductor equipment
JP2006032412A (en) * 2004-07-12 2006-02-02 Ricoh Co Ltd Elastic conductive adhesive and inter-electrode connection structure
JP2008226946A (en) * 2007-03-09 2008-09-25 Nec Corp Semiconductor device and its manufacturing method
WO2011118658A1 (en) * 2010-03-24 2011-09-29 Toto株式会社 Electrostatic chuck

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56104494A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Wired board and package bonding structure
JPS57173953A (en) * 1981-04-21 1982-10-26 Seiko Epson Corp Semiconductor device
JPH01201932A (en) * 1988-02-06 1989-08-14 Sharp Corp Connecting structure of circuit element
JPH03209734A (en) * 1990-01-11 1991-09-12 Japan Radio Co Ltd Semiconductor connection method
JPH04107832U (en) * 1991-02-27 1992-09-17 三洋電機株式会社 semiconductor equipment
JP2006032412A (en) * 2004-07-12 2006-02-02 Ricoh Co Ltd Elastic conductive adhesive and inter-electrode connection structure
JP4542842B2 (en) * 2004-07-12 2010-09-15 株式会社リコー Interelectrode connection structure
JP2008226946A (en) * 2007-03-09 2008-09-25 Nec Corp Semiconductor device and its manufacturing method
WO2011118658A1 (en) * 2010-03-24 2011-09-29 Toto株式会社 Electrostatic chuck
JP2011222978A (en) * 2010-03-24 2011-11-04 Toto Ltd Electrostatic chuck

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