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JPS5236473A - Dye bonding method - Google Patents

Dye bonding method

Info

Publication number
JPS5236473A
JPS5236473A JP11235575A JP11235575A JPS5236473A JP S5236473 A JPS5236473 A JP S5236473A JP 11235575 A JP11235575 A JP 11235575A JP 11235575 A JP11235575 A JP 11235575A JP S5236473 A JPS5236473 A JP S5236473A
Authority
JP
Japan
Prior art keywords
bonding method
silicon
stem
dye bonding
dye
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11235575A
Other languages
Japanese (ja)
Inventor
Koichiro Kishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11235575A priority Critical patent/JPS5236473A/en
Publication of JPS5236473A publication Critical patent/JPS5236473A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To contact the metal coating of a stem with the silicon pellet having a gold-silicon eutectic layer in which silicon is diffused down to the semiconductor substrate surface, and to then fix them to each other while applying heat, thereby preventing the coming-off of the stem and metal film.
COPYRIGHT: (C)1977,JPO&Japio
JP11235575A 1975-09-17 1975-09-17 Dye bonding method Pending JPS5236473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11235575A JPS5236473A (en) 1975-09-17 1975-09-17 Dye bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11235575A JPS5236473A (en) 1975-09-17 1975-09-17 Dye bonding method

Publications (1)

Publication Number Publication Date
JPS5236473A true JPS5236473A (en) 1977-03-19

Family

ID=14584609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11235575A Pending JPS5236473A (en) 1975-09-17 1975-09-17 Dye bonding method

Country Status (1)

Country Link
JP (1) JPS5236473A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024631A (en) * 1988-06-20 1990-01-09 Toyo Seikan Kaisha Ltd Plastic container for aseptic filling
JPH0472131A (en) * 1989-08-24 1992-03-06 Plasticon Patents Sa Plastic container

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH024631A (en) * 1988-06-20 1990-01-09 Toyo Seikan Kaisha Ltd Plastic container for aseptic filling
JPH0472131A (en) * 1989-08-24 1992-03-06 Plasticon Patents Sa Plastic container

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