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JPS5216147A - Pacage method for surface elastic wave element - Google Patents

Pacage method for surface elastic wave element

Info

Publication number
JPS5216147A
JPS5216147A JP9186875A JP9186875A JPS5216147A JP S5216147 A JPS5216147 A JP S5216147A JP 9186875 A JP9186875 A JP 9186875A JP 9186875 A JP9186875 A JP 9186875A JP S5216147 A JPS5216147 A JP S5216147A
Authority
JP
Japan
Prior art keywords
elastic wave
pacage
wave element
surface elastic
reliability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9186875A
Other languages
Japanese (ja)
Inventor
Masanori Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9186875A priority Critical patent/JPS5216147A/en
Publication of JPS5216147A publication Critical patent/JPS5216147A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To improve on reliability of a surface elastic wave element by molding both a substrate surface and the element.
JP9186875A 1975-07-30 1975-07-30 Pacage method for surface elastic wave element Pending JPS5216147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9186875A JPS5216147A (en) 1975-07-30 1975-07-30 Pacage method for surface elastic wave element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9186875A JPS5216147A (en) 1975-07-30 1975-07-30 Pacage method for surface elastic wave element

Publications (1)

Publication Number Publication Date
JPS5216147A true JPS5216147A (en) 1977-02-07

Family

ID=14038524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9186875A Pending JPS5216147A (en) 1975-07-30 1975-07-30 Pacage method for surface elastic wave element

Country Status (1)

Country Link
JP (1) JPS5216147A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387031U (en) * 1976-12-17 1978-07-18
JPS5412544A (en) * 1977-06-29 1979-01-30 Toshiba Corp Elastic surface wave unit
JPS5476640U (en) * 1977-11-11 1979-05-31
JPS5492141U (en) * 1977-12-13 1979-06-29
JPS599625U (en) * 1982-07-09 1984-01-21 松下電器産業株式会社 Filter package
US4699682A (en) * 1985-10-23 1987-10-13 Clarion Co., Ltd. Surface acoustic wave device sealing method
JPS6437132U (en) * 1987-08-31 1989-03-06
JPH04170811A (en) * 1990-11-05 1992-06-18 Fujitsu Ltd Surface acoustic wave device
US6262513B1 (en) 1995-06-30 2001-07-17 Kabushiki Kaisha Toshiba Electronic component and method of production thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5428935U (en) * 1977-07-29 1979-02-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5428935U (en) * 1977-07-29 1979-02-26

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387031U (en) * 1976-12-17 1978-07-18
JPS5412544A (en) * 1977-06-29 1979-01-30 Toshiba Corp Elastic surface wave unit
JPS5759687B2 (en) * 1977-06-29 1982-12-16 Tokyo Shibaura Electric Co
JPS5476640U (en) * 1977-11-11 1979-05-31
JPS5492141U (en) * 1977-12-13 1979-06-29
JPS5827554Y2 (en) * 1977-12-13 1983-06-15 東光株式会社 surface acoustic wave device
JPS599625U (en) * 1982-07-09 1984-01-21 松下電器産業株式会社 Filter package
US4699682A (en) * 1985-10-23 1987-10-13 Clarion Co., Ltd. Surface acoustic wave device sealing method
JPS6437132U (en) * 1987-08-31 1989-03-06
JPH04170811A (en) * 1990-11-05 1992-06-18 Fujitsu Ltd Surface acoustic wave device
US6262513B1 (en) 1995-06-30 2001-07-17 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6628043B2 (en) 1995-06-30 2003-09-30 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6754950B2 (en) 1995-06-30 2004-06-29 Kabushiki Kaisha Toshiba Electronic component and method of production thereof

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