JPS52150563A - Method of wiring circuit board - Google Patents
Method of wiring circuit boardInfo
- Publication number
- JPS52150563A JPS52150563A JP6656976A JP6656976A JPS52150563A JP S52150563 A JPS52150563 A JP S52150563A JP 6656976 A JP6656976 A JP 6656976A JP 6656976 A JP6656976 A JP 6656976A JP S52150563 A JPS52150563 A JP S52150563A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- wiring circuit
- wiring
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6656976A JPS52150563A (en) | 1976-06-09 | 1976-06-09 | Method of wiring circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6656976A JPS52150563A (en) | 1976-06-09 | 1976-06-09 | Method of wiring circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52150563A true JPS52150563A (en) | 1977-12-14 |
JPS5532237B2 JPS5532237B2 (en) | 1980-08-23 |
Family
ID=13319708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6656976A Granted JPS52150563A (en) | 1976-06-09 | 1976-06-09 | Method of wiring circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52150563A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS553628A (en) * | 1978-06-21 | 1980-01-11 | Tsunesuke Takano | Method of fabricating conductive path for electric circuit panel |
JPS5638897A (en) * | 1979-09-05 | 1981-04-14 | Fujitsu Ltd | Discrete wire arraying system |
JPS58168294A (en) * | 1982-03-29 | 1983-10-04 | 日立化成工業株式会社 | Method of producing high density circuit board using insulated wire on necessary wiring pattern |
JP2014030840A (en) * | 2012-08-03 | 2014-02-20 | Toyota Motor Corp | Lead wiring welding device and lead wiring welding method |
-
1976
- 1976-06-09 JP JP6656976A patent/JPS52150563A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS553628A (en) * | 1978-06-21 | 1980-01-11 | Tsunesuke Takano | Method of fabricating conductive path for electric circuit panel |
JPS5734676B2 (en) * | 1978-06-21 | 1982-07-24 | ||
JPS5638897A (en) * | 1979-09-05 | 1981-04-14 | Fujitsu Ltd | Discrete wire arraying system |
JPH0132679B2 (en) * | 1979-09-05 | 1989-07-10 | Fujitsu Ltd | |
JPS58168294A (en) * | 1982-03-29 | 1983-10-04 | 日立化成工業株式会社 | Method of producing high density circuit board using insulated wire on necessary wiring pattern |
JPH0213835B2 (en) * | 1982-03-29 | 1990-04-05 | Hitachi Chemical Co Ltd | |
JP2014030840A (en) * | 2012-08-03 | 2014-02-20 | Toyota Motor Corp | Lead wiring welding device and lead wiring welding method |
Also Published As
Publication number | Publication date |
---|---|
JPS5532237B2 (en) | 1980-08-23 |
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